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2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2014, p.1-5

2014

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IEEE_Xplore

Study of Chip-Package Interaction Parameters on Interlayer Dielectric Crack Propagation

IEEE transactions on device and materials reliability, 2014-03, Vol.14 (1), p.57-65

2014

Link zum Volltext
IEEE_Xplore

Modelling and control strategy for isolated fuel cell system

2012 International Conference on Emerging Trends in Electrical Engineering and Energy Management (ICETEEEM), 2012, p.394-397

2012

Link zum Volltext
IEEE_Xplore

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Magnetic Alignment of Hexagonal Boron Nitride Platelets in Polymer Matrix: Toward High Performance Anisotropic Polymer Composites for Electronic Encapsulation

Shear test on hard coated flip-chip bumps to measure back end of the line stack reliability

Mixed-mode cohesive zone parameters for sub-micron scale stacked layers to predict microelectronic device reliability

Attention-Based 3D Neural Architectures for Predicting Cracks in Designs

Experiments for Obtaining Cohesive-Zone Parameters for Copper-Mold Compound Interfacial Delamination

The Impact of AI on Contact Resistance and Its Suitability in Fine Pitch Interconnects

Methodology to Predict Substrate Warpage and Different Techniques to Achieve Substrate Warpage Targets

An Efficient Implementation of Polymer Viscoelastic Behavior Through a Pseudo Viscoelastic Model

Cohesive zone experiments for copper/mold compound delamination

Interlayer dielectric cracking in back end of line (BEOL) stack

Framework to extract cohesive zone parameters using double cantilever beam and four-point bend fracture tests

Study of Chip-Package Interaction Parameters on Interlayer Dielectric Crack Propagation

Modelling and control strategy for isolated fuel cell system

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