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IEEE transactions on components and packaging technologies, 2005-12, Vol.28 (4), p.637-643
2005

IEEE transactions on components and packaging technologies, 2003-03, Vol.26 (1), p.80-88
2003

Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium, 2006, p.199-203
2006

IEEE transactions on components and packaging technologies, 2007-12, Vol.30 (4), p.597-603
2007

IEEE transactions on components and packaging technologies, 2005-03, Vol.28 (1), p.39-44
2005

International journal of heat and mass transfer, 2004-08, Vol.47 (17), p.3707-3720
2004
Link zum Volltext

Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2007, p.57-63
2007

Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium, 2006, p.87-94
2006

Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium, 2006, p.204-209
2006

The Surface Marker Method
Fluid Flow, 2016, p.223-234
Originally published 1991, 2016
Link zum Volltext


Journal of computational physics, 1993-05, Vol.106 (1), p.42-51
1993
Link zum Volltext

2009 15th International Workshop on Thermal Investigations of ICs and Systems, 2009, p.130-135
2009

2009 15th International Workshop on Thermal Investigations of ICs and Systems, 2009, p.36-39
2009

Numerical heat transfer. Part A, Applications, 1997-11, Vol.31 (7), p.685-702
1997
Link zum Volltext

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258), 2002, p.142-149
2002

Proceedings of the Second IEEE Symposium on Parallel and Distributed Processing 1990, 1990, p.357-362
1990


Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 1998, p.1-7
1998

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC), 2007, p.126-127
2007

5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the, 2004, p.269-276
2004

IEEE transactions on components, packaging, and manufacturing technology. Part A, 1998-09, Vol.21 (3), p.412-417
1998

Proceedings of the Second IEEE Symposium on Parallel and Distributed Processing 1990, 1990, p.826-833
1990

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