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High-Performance Low-Leakage-Current AlN/GaN HEMTs Grown on Silicon Substrate

IEEE electron device letters, 2011-07, Vol.32 (7), p.874-876

2011

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First Demonstration of High-Power GaN-on-Silicon Transistors at 40 GHz

IEEE electron device letters, 2012-08, Vol.33 (8), p.1168-1170

2012

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Micro-patterning of LiPON and lithium iron phosphate material deposited onto silicon nanopillars array for lithium ion solid state 3D micro-battery

Microelectronic engineering, 2011-10, Vol.88 (10), p.3172-3177

2011

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Low-Noise Microwave Performance of AlN/GaN HEMTs Grown on Silicon Substrate

IEEE electron device letters, 2011-09, Vol.32 (9), p.1230-1232

2011

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Packaging methodology for RF devices using a BCB membrane transfer technique

Journal of micromechanics and microengineering, 2006-11, Vol.16 (11), p.2384-2388

2006

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UWB in Millimeter Wave Band With Pulsed ILO

IEEE transactions on circuits and systems. I, Regular papers, 2008-04, Vol.55 (4), p.339-343

2008

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A novel packaging method using wafer-level BCB polymer bonding and glass wet-etching for RF applications

Sensors and actuators. A. Physical., 2008-10, Vol.147 (2), p.677-682

2008

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Design, Fabrication, and Measurement of Benzocyclobutene Polymer Zero-Level Packaging for Millimeter-Wave Applications

IEEE transactions on microwave theory and techniques, 2007-05, Vol.55 (5), p.1040-1045

2007

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Chitosan and depolymerized chitosan oligomers as condensing carriers for in vivo plasmid delivery

Journal of controlled release, 1998-12, Vol.56 (1), p.259-272

1998

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Transposition of a baseband UWB signal at 60 GHz for high data rate indoor WLAN

IEEE microwave and wireless components letters, 2005-10, Vol.15 (10), p.609-611

2005

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α-stable multiple access interference modelling for amplify-and-forward multihop ad hoc networks

Electronics letters, 2010-08, Vol.46 (16), p.1160-1162

2010

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A solid-mounted resonator-oscillator-based 4.596 GHz frequency synthesis

Review of scientific instruments, 2011-03, Vol.82 (3), p.034706-034706-8

2011

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Design, realization, and test of a 2.1-GHz low-phase-noise oscillator based on BAW resonator

Microwave and optical technology letters, 2011-02, Vol.53 (2), p.405-409

2011

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Review of Glass and Polymer Multimode Fibers Used in a Wimedia Ultrawideband MB-OFDM Radio Over Fiber System

Journal of lightwave technology, 2009-05, Vol.27 (10), p.1320-1331

2009

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Multi-service applications on high modal bandwidth glass multimode fibre

Electronics letters, 2009-08, Vol.45 (18), p.951-952

2009

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Zero-level packaging using BCB adhesive bonding and glass wet-etching for W-band applications

Electronics letters, 2006-06, Vol.42 (13), p.755-757

2006

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From genes to gene medicines: recent advances in nonviral gene delivery

Critical reviews in therapeutic drug carrier systems, 1998, Vol.15 (2), p.143-198

Rolland, A P

1998

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4.2 GHz sub-harmonic low-phase-noise oscillator based on BAW resonator

Electronics letters, 2011-02, Vol.47 (4), p.239-240

2011

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Demonstration of low leakage current and high polarization in ultrathin AlN/GaN high electron mobility transistors grown on silicon substrate

Applied physics letters, 2011-05, Vol.98 (22), p.223502-223502-3

2011

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Controllable gene therapy pharmaceutics of non-viral gene delivery systems

Journal of controlled release, 1996-05, Vol.39 (2), p.357-372

1996

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Tunable BST capacitor loss compensation using active circuit

IEEE microwave and wireless components letters, 2006-10, Vol.16 (10), p.549-551

2006

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Sub-1-dB Minimum-Noise-Figure Performance of GaN-on-Si Transistors Up to 40 GHz

IEEE electron device letters, 2012-09, Vol.33 (9), p.1258-1260

2012

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RF-MEMS reconfigurable GaAs MMICs and antennas for microwave/MM-wave applications

CAS 2013 (International Semiconductor Conference), 2013, Vol.1, p.83-88

2013

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Low-temperature, low-loss zero level packaging techniques for RF applications by using a photopatternable dry film

Journal of micromechanics and microengineering, 2012-06, Vol.22 (6), p.65032-9

2012

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Thermal management of electronic devices by composite materials integrated in silicon

Microelectronic engineering, 2014-09, Vol.127, p.28-33

2014

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High-Performance Low-Leakage-Current AlN/GaN HEMTs Grown on Silicon Substrate

First Demonstration of High-Power GaN-on-Silicon Transistors at 40 GHz

Micro-patterning of LiPON and lithium iron phosphate material deposited onto silicon nanopillars array for lithium ion solid state 3D micro-battery

Low-Noise Microwave Performance of AlN/GaN HEMTs Grown on Silicon Substrate

Packaging methodology for RF devices using a BCB membrane transfer technique

UWB in Millimeter Wave Band With Pulsed ILO

A novel packaging method using wafer-level BCB polymer bonding and glass wet-etching for RF applications

Design, Fabrication, and Measurement of Benzocyclobutene Polymer Zero-Level Packaging for Millimeter-Wave Applications

Chitosan and depolymerized chitosan oligomers as condensing carriers for in vivo plasmid delivery

Transposition of a baseband UWB signal at 60 GHz for high data rate indoor WLAN

α-stable multiple access interference modelling for amplify-and-forward multihop ad hoc networks

A solid-mounted resonator-oscillator-based 4.596 GHz frequency synthesis

Design, realization, and test of a 2.1-GHz low-phase-noise oscillator based on BAW resonator

Review of Glass and Polymer Multimode Fibers Used in a Wimedia Ultrawideband MB-OFDM Radio Over Fiber System

Multi-service applications on high modal bandwidth glass multimode fibre

Zero-level packaging using BCB adhesive bonding and glass wet-etching for W-band applications

From genes to gene medicines: recent advances in nonviral gene delivery

4.2 GHz sub-harmonic low-phase-noise oscillator based on BAW resonator

Demonstration of low leakage current and high polarization in ultrathin AlN/GaN high electron mobility transistors grown on silicon substrate

Controllable gene therapy pharmaceutics of non-viral gene delivery systems

Tunable BST capacitor loss compensation using active circuit

Sub-1-dB Minimum-Noise-Figure Performance of GaN-on-Si Transistors Up to 40 GHz

RF-MEMS reconfigurable GaAs MMICs and antennas for microwave/MM-wave applications

Low-temperature, low-loss zero level packaging techniques for RF applications by using a photopatternable dry film

Thermal management of electronic devices by composite materials integrated in silicon

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