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Electromigration Cu mass flow in Cu interconnections

Thin solid films, 2006-05, Vol.504 (1), p.274-278

2006

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Comparison of Cu electromigration lifetime in Cu interconnects coated with various caps

Applied physics letters, 2003-08, Vol.83 (5), p.869-871

2003

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Effects of overlayers on electromigration reliability improvement for Cu/low K interconnects

2004 IEEE International Reliability Physics Symposium. Proceedings, 2004, p.222-228

2004

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Electromigration in AlCu lines: comparison of Dual Damascene and metal reactive ion etching

Thin solid films, 2001-06, Vol.388 (1), p.303-314

2001

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Continuous work function monitoring for electrode emersion

Surface science, 1981-09, Vol.109 (3), p.641-647

1981

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New Aqueous Clean for Aluminum Interconnects: Part II. Applications

Solid state phenomena, 2001-01, Vol.76-77, p.51-54

2001

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An ESCA Study on the Electrochemical Double Layer of Emersed Electrodes

Berichte der Bunsengesellschaft für Physikalische Chemie, 1983-12, Vol.87 (12), p.1108-1113

1983

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Analysis of Pb on Ag by Rutherford backscattering

Surface science, 1981-04, Vol.105 (2), p.L271-L276

1981

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A novel low resistance gate fill for extreme gate length scaling at 20nm and beyond for gate-last high-k/metal gate CMOS technology

2012 Symposium on VLSI Technology (VLSIT), 2012, p.29-30

2012

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Electrode resistance in the electrochemical cell; analysis of size effect theory with the specific adsorption of Br − and I − on polycrystalline gold films

Surface science, 1984, Vol.136 (1), p.195-216

1984

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Enhancement of Semiconductor Wafer Cleaning by Chelating Agent Addition

Journal of the Electrochemical Society, 2001-09, Vol.148 (9), p.G513

2001

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Study of field-driven wall-configuration conversions for laminated Permalloy in the easy-axis state

Journal of applied physics, 1988-04, Vol.63 (8), p.4036-4038

1988

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Fully aligned via integration for extendibility of interconnects to beyond the 7 nm node

2017 IEEE International Electron Devices Meeting (IEDM), 2017, p.14.2.1-14.2.4

2017

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Edge-curling-wall discontinuities and interactions with Bloch walls in easy-axis Permalloy

IEEE transactions on magnetics, 1988-11, Vol.24 (6), p.3066-3068

1988

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Structural investigations of metal adsorbates on single crystal surfaces using reflectance spectroscopy

Surface science, 1980-01, Vol.101 (1), p.490-498

1980

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Process Challenges in Fully Aligned Via Integration for sub 32 nm Pitch BEOL

2018 IEEE International Interconnect Technology Conference (IITC), 2018, p.148-148

2018

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Successful dual damascene integration of extreme low k materials (k < 2.0) using a novel gap fill based integration scheme

IEDM Technical Digest. IEEE International Electron Devices Meeting, 2004, 2004, p.321-324

2004

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New Aqueous Clean for Aluminum Interconnects: Part I. Fundamentals

Solid state phenomena, 2001, Vol.76-77, p.31-34

2001

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Challenges of aluminum RIE technology at sub 0.45 μm pitches

1999

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An ESCA study on emersed electrodes

Journal of electroanalytical chemistry and interfacial electrochemistry, 1980-01, Vol.110 (1), p.369-373

1980

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Electrode Resistance in the Electrochemical Cell; Analysis of Size Effect Theory With the Specific Adsorption of Br exp -- and I exp -- on Polycrystalline Gold Films

Surface science, 1984-01, Vol.136 (1), p.195-216

1984

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Using paid radio advertisements to promote physical activity among Arkansas tweens

Preventing chronic disease, 2005-11, Vol.2 Spec no (Spec No), p.A08-A08

2005

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Influence of sidewall roughness on the reliability of 0.20-μm AI RIE wiring

1999

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Studies of electrode resistance in the electrochemical cell

Journal of electroanalytical chemistry and interfacial electrochemistry, 1983-01, Vol.150 (1), p.521-534

Rath, David L.

1983

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The importance of international collaboration for rare diseases research: a European perspective

Gene therapy, 2017-09, Vol.24 (9), p.562-571

2017

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Electromigration Cu mass flow in Cu interconnections

Comparison of Cu electromigration lifetime in Cu interconnects coated with various caps

Effects of overlayers on electromigration reliability improvement for Cu/low K interconnects

Electromigration in AlCu lines: comparison of Dual Damascene and metal reactive ion etching

Continuous work function monitoring for electrode emersion

New Aqueous Clean for Aluminum Interconnects: Part II. Applications

An ESCA Study on the Electrochemical Double Layer of Emersed Electrodes

Analysis of Pb on Ag by Rutherford backscattering

A novel low resistance gate fill for extreme gate length scaling at 20nm and beyond for gate-last high-k/metal gate CMOS technology

Electrode resistance in the electrochemical cell; analysis of size effect theory with the specific adsorption of Br − and I − on polycrystalline gold films

Enhancement of Semiconductor Wafer Cleaning by Chelating Agent Addition

Study of field-driven wall-configuration conversions for laminated Permalloy in the easy-axis state

Fully aligned via integration for extendibility of interconnects to beyond the 7 nm node

Edge-curling-wall discontinuities and interactions with Bloch walls in easy-axis Permalloy

Structural investigations of metal adsorbates on single crystal surfaces using reflectance spectroscopy

Process Challenges in Fully Aligned Via Integration for sub 32 nm Pitch BEOL

Successful dual damascene integration of extreme low k materials (k < 2.0) using a novel gap fill based integration scheme

New Aqueous Clean for Aluminum Interconnects: Part I. Fundamentals

Challenges of aluminum RIE technology at sub 0.45 μm pitches

An ESCA study on emersed electrodes

Electrode Resistance in the Electrochemical Cell; Analysis of Size Effect Theory With the Specific Adsorption of Br exp -- and I exp -- on Polycrystalline Gold Films

Using paid radio advertisements to promote physical activity among Arkansas tweens

Influence of sidewall roughness on the reliability of 0.20-μm AI RIE wiring

Studies of electrode resistance in the electrochemical cell

The importance of international collaboration for rare diseases research: a European perspective

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