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Development of Advanced All-SiC Power Modules

IEEE transactions on power electronics, 2014-05, Vol.29 (5), p.2289-2295

2014

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A High Power Density Single-Phase PWM Rectifier With Active Ripple Energy Storage

IEEE transactions on power electronics, 2011-05, Vol.26 (5), p.1430-1443

2011

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CoP Quantum Dots Embedded in Carbon Polyhedra through Co─P─C Bonding Enabling High‐Energy Lithium‐Ion Capacitors

Advanced functional materials, 2024-06, Vol.34 (24), p.n/a

2024

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A High-Temperature SiC Three-Phase AC-DC Converter Design for > 100 °C Ambient Temperature

IEEE transactions on power electronics, 2013, Vol.28 (1), p.555-572

2013

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An Analytical Approach to Magnet Eddy-Current Losses for Interior Permanent-Magnet Synchronous Machines During Flux Weakening

IEEE transactions on magnetics, 2015-08, Vol.51 (8), p.1-9

2015

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An Electrothermal Model for IGBT Based on Finite Differential Method

IEEE journal of emerging and selected topics in power electronics, 2020-03, Vol.8 (1), p.673-684

2020

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On-Site Estimation of Thermal Resistance Degradation of Double-Sided Cooling (DSC) Power Modules under Power Cycling Conditions

IEEE journal of emerging and selected topics in power electronics, 2023-08, Vol.11 (4), p.1-1

2023

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A Novel Method for Busbar Design of Electric Vehicle Motor Drive

World electric vehicle journal, 2021-12, Vol.12 (4), p.186, Article 186

2021

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A Phase-Leg Power Module Packaged With Optimized Planar Interconnections and Integrated Double-Sided Cooling

IEEE journal of emerging and selected topics in power electronics, 2014-09, Vol.2 (3), p.443-450

2014

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Automatic layout design for power module

IEEE transactions on power electronics, 2013-01, Vol.28 (1), p.481-487, Article 481

2013

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A Novel Multiple DBC-staked units Package to Parallel More Chips for SiC Power Module

CES transactions on electrical machines and systems (Online, 2024-03, Vol.8 (1), p.72-79

2024

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Power Module and Cooling System Thermal Performance Evaluation for HEV Application

IEEE journal of emerging and selected topics in power electronics, 2014-09, Vol.2 (3), p.487-495

2014

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Forced-Air Cooling System Design Under Weight Constraint for High-Temperature SiC Converter

IEEE transactions on power electronics, 2014-04, Vol.29 (4), p.1998-2007

2014

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Practical SPICE Model for IGBT and PiN Diode Based on Finite Differential Method

JOURNAL OF POWER ELECTRONICS, 2019-11, Vol.19 (6), p.1591-1600

2019

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Online monitoring of IGBT junction temperature based on Vce measurement

Journal of Power Electronics, 2021, 21(2), , pp.451-463

2021

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Methodology for switching characterization evaluation of wide band-gap devices in a phase-leg configuration

2014 IEEE Applied Power Electronics Conference and Exposition - APEC 2014, 2014, p.2534-2541

2014

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A Shoot-Through Protection Scheme for Converters Built With SiC JFETs

IEEE transactions on industry applications, 2010-11, Vol.46 (6), p.2495-2500

2010

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High-Temperature SiC Power Module Electrical Evaluation Procedure

IEEE transactions on power electronics, 2011-11, Vol.26 (11), p.3079-3083

2011

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A Novel High-Temperature Planar Package for SiC Multichip Phase-Leg Power Module

IEEE transactions on power electronics, 2010-08, Vol.25 (8), p.2059-2067

2010

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Investigation on the Novel High-performance Copper/Graphene Composite Conductor for High Power Density Motor

CES transactions on electrical machines and systems (Online, 2024-03, Vol.8 (1), p.80-85

2024

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SiC Wirebond Multichip Phase-Leg Module Packaging Design and Testing for Harsh Environment

IEEE transactions on power electronics, 2010-01, Vol.25 (1), p.16-23

2010

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A turn-off delay time measurement and junction temperature estimation method for IGBT

2017 IEEE Applied Power Electronics Conference and Exposition (APEC), 2017, p.2290-2296

2017

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A hybrid Si IGBT and SiC MOSFET module development

CES transactions on electrical machines and systems (Online, 2017-12, Vol.1 (4), p.360-366

2017

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An improved planar module automatic layout method for large number of dies

CES transactions on electrical machines and systems (Online, 2017-12, Vol.1 (4), p.411-417

2017

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Impact of ringing on switching losses of wide band-gap devices in a phase-leg configuration

2014 IEEE Applied Power Electronics Conference and Exposition - APEC 2014, 2014, p.2542-2549

2014

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Development of Advanced All-SiC Power Modules

A High Power Density Single-Phase PWM Rectifier With Active Ripple Energy Storage

CoP Quantum Dots Embedded in Carbon Polyhedra through Co─P─C Bonding Enabling High‐Energy Lithium‐Ion Capacitors

A High-Temperature SiC Three-Phase AC-DC Converter Design for > 100 °C Ambient Temperature

An Analytical Approach to Magnet Eddy-Current Losses for Interior Permanent-Magnet Synchronous Machines During Flux Weakening

An Electrothermal Model for IGBT Based on Finite Differential Method

On-Site Estimation of Thermal Resistance Degradation of Double-Sided Cooling (DSC) Power Modules under Power Cycling Conditions

A Novel Method for Busbar Design of Electric Vehicle Motor Drive

A Phase-Leg Power Module Packaged With Optimized Planar Interconnections and Integrated Double-Sided Cooling

Automatic layout design for power module

A Novel Multiple DBC-staked units Package to Parallel More Chips for SiC Power Module

Power Module and Cooling System Thermal Performance Evaluation for HEV Application

Forced-Air Cooling System Design Under Weight Constraint for High-Temperature SiC Converter

Practical SPICE Model for IGBT and PiN Diode Based on Finite Differential Method

Online monitoring of IGBT junction temperature based on Vce measurement

Methodology for switching characterization evaluation of wide band-gap devices in a phase-leg configuration

A Shoot-Through Protection Scheme for Converters Built With SiC JFETs

High-Temperature SiC Power Module Electrical Evaluation Procedure

A Novel High-Temperature Planar Package for SiC Multichip Phase-Leg Power Module

Investigation on the Novel High-performance Copper/Graphene Composite Conductor for High Power Density Motor

SiC Wirebond Multichip Phase-Leg Module Packaging Design and Testing for Harsh Environment

A turn-off delay time measurement and junction temperature estimation method for IGBT

A hybrid Si IGBT and SiC MOSFET module development

An improved planar module automatic layout method for large number of dies

Impact of ringing on switching losses of wide band-gap devices in a phase-leg configuration

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