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Enhancement of Sn-Bi-Ag Solder Joints with ENEPIG Surface Finish for Low-Temperature Interconnection

Journal of electronic materials, 2018-09, Vol.47 (9), p.5191-5202

2018

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Solid-state growth kinetics of intermetallic compounds in Cu pillar solder flip chip with ENEPIG surface finish under isothermal aging

Journal of materials science. Materials in electronics, 2017-09, Vol.28 (17), p.12617-12629

2017

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Latest advancement of fully additive process for 8 µm ultra-fine pitch chip-on-film (COF) by nano-size Ni–P metallization

Journal of materials science. Materials in electronics, 2018-04, Vol.29 (8), p.6937-6949

2018

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Effect of ENEPIG metallization for solid-state gold-gold diffusion bonds

Microelectronics and reliability, 2017-11, Vol.78, p.339-348

2017

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Application of fuzzy integrated FMEA with product lifetime consideration for new product development in flexible electronics industry

Journal of industrial engineering and management, 2019-01, Vol.12 (1), p.176-200

2019

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Flexible Integrated Battery on System-in-Package (SiP) for Internet of Things (IoT) and Smart Wearables

2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC), 2021, p.270-275

2021

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Demonstration of Ni-free Surface Finishing with IGEPIG for Solid-State Diffusion Bonding on Ultra-fine Pitch Chip-on-Film (COF)

2018 IEEE 20th Electronics Packaging Technology Conference (EPTC), 2018, p.924-931

2018

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Miniaturization of system in package for wearable devices using copper pillar solder flip chip interconnects

2016 China Semiconductor Technology International Conference (CSTIC), 2016, p.1-8

2016

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Study of fine pitch copper pillar solder joint on HDI flexible substrate for wearable devices

2015 16th International Conference on Electronic Packaging Technology (ICEPT), 2015, p.1309-1316

2015

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Foldable substrates for wearable electronics

2014 15th International Conference on Electronic Packaging Technology, 2014, p.74-79

2014

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ENEG and ENEPIG surface finish for long term solderability

2014 15th International Conference on Electronic Packaging Technology, 2014, p.1-5

2014

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High reliability underfill encapsulated fine pitch system on flex packages

2013 14th International Conference on Electronic Packaging Technology, 2013, p.665-670

2013

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Comparison between ENA and ENEPIG surface finish for high density TBGA package

Proceedings of the 5th Electronics System-integration Technology Conference (ESTC), 2014, p.1-4

2014

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Development of void free, high reliability underfill encapsulated fine pitch system on flex packages

Proceedings of the 5th Electronics System-integration Technology Conference (ESTC), 2014, p.1-5

2014

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MEMS gyro sensor using flexible substrate for package size reduction

2015 16th International Conference on Electronic Packaging Technology (ICEPT), 2015, p.1482-1488

2015

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Enhancement of TBGA substrate in packing drop test

2009 International Conference on Electronic Packaging Technology & High Density Packaging, 2009, p.1097-1103

2009

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Cu Fully Filled Ultra-Fine Blind Via on Flexible Substrate for High Density Interconnect

2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium, 2006, p.13-19

2006

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Ultra-fine via pitch on flexible substrate for high density interconnect (HDI)

2008 International Conference on Electronic Packaging Technology & High Density Packaging, 2008, p.1-6

2008

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Effect of Ni Layer Thickness on Intermetallic Formation and Mechanical Strength of Sn-Ag-Cu Solder Joint

2008 10th Electronics Packaging Technology Conference, 2008, p.487-493

2008

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TBGA substrate for lead-free and halogen-free applications

2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of, 2004, p.45-49

2004

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New Form of an Old Natural Dye: Bay-Annulated Indigo (BAI) as an Excellent Electron Accepting Unit for High Performance Organic Semiconductors

Journal of the American Chemical Society, 2014-10, Vol.136 (42), p.15093-15101

2014

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Consensus Statements from the Diabetologists & Endocrinologists Alliance for the Management of People with Hypertension and Type 2 Diabetes Mellitus

Journal of clinical medicine, 2023-05, Vol.12 (10), p.3403

2023

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Rapid Intensification of Typhoon Hato (2017) over Shallow Water

Sustainability, 2019-07, Vol.11 (13), p.3709

2019

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Effect of Thyroid Remnant Volume on the Risk of Hypothyroidism After Hemithyroidectomy: A Prospective Study

Annals of surgical oncology, 2017-06, Vol.24 (6), p.1525-1532

2017

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Effectiveness and experiences of integrating Mindfulness into Peer-assisted Learning (PAL) in clinical education for nursing students: A mixed method study

Nurse education today, 2024-01, Vol.132, p.106039-106039, Article 106039

2024

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Engineering, Electrical & Electronic
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Enhancement of Sn-Bi-Ag Solder Joints with ENEPIG Surface Finish for Low-Temperature Interconnection

Solid-state growth kinetics of intermetallic compounds in Cu pillar solder flip chip with ENEPIG surface finish under isothermal aging

Latest advancement of fully additive process for 8 µm ultra-fine pitch chip-on-film (COF) by nano-size Ni–P metallization

Effect of ENEPIG metallization for solid-state gold-gold diffusion bonds

Application of fuzzy integrated FMEA with product lifetime consideration for new product development in flexible electronics industry

Flexible Integrated Battery on System-in-Package (SiP) for Internet of Things (IoT) and Smart Wearables

Demonstration of Ni-free Surface Finishing with IGEPIG for Solid-State Diffusion Bonding on Ultra-fine Pitch Chip-on-Film (COF)

Miniaturization of system in package for wearable devices using copper pillar solder flip chip interconnects

Study of fine pitch copper pillar solder joint on HDI flexible substrate for wearable devices

Foldable substrates for wearable electronics

ENEG and ENEPIG surface finish for long term solderability

High reliability underfill encapsulated fine pitch system on flex packages

Comparison between ENA and ENEPIG surface finish for high density TBGA package

Development of void free, high reliability underfill encapsulated fine pitch system on flex packages

MEMS gyro sensor using flexible substrate for package size reduction

Enhancement of TBGA substrate in packing drop test

Cu Fully Filled Ultra-Fine Blind Via on Flexible Substrate for High Density Interconnect

Ultra-fine via pitch on flexible substrate for high density interconnect (HDI)

Effect of Ni Layer Thickness on Intermetallic Formation and Mechanical Strength of Sn-Ag-Cu Solder Joint

TBGA substrate for lead-free and halogen-free applications

New Form of an Old Natural Dye: Bay-Annulated Indigo (BAI) as an Excellent Electron Accepting Unit for High Performance Organic Semiconductors

Consensus Statements from the Diabetologists & Endocrinologists Alliance for the Management of People with Hypertension and Type 2 Diabetes Mellitus

Rapid Intensification of Typhoon Hato (2017) over Shallow Water

Effect of Thyroid Remnant Volume on the Risk of Hypothyroidism After Hemithyroidectomy: A Prospective Study

Effectiveness and experiences of integrating Mindfulness into Peer-assisted Learning (PAL) in clinical education for nursing students: A mixed method study

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