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IEEE transactions on components and packaging technologies, 2007-03, Vol.30 (1), p.152-162
2007
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IEEE transactions on electronics packaging manufacturing, 2002-04, Vol.25 (2), p.100-106
2002
- Link zum Volltext
IEEE transactions on advanced packaging, 2007-11, Vol.30 (4), p.641-653
2007
- Link zum Volltext
IEEE transactions on advanced packaging, 2004-05, Vol.27 (2), p.438-452
2004
- Link zum Volltext
ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258), 2002, p.919-925
2002
- Link zum Volltext
2007 Proceedings 57th Electronic Components and Technology Conference, 2007, p.1809-1814
2007
- Link zum Volltext
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004, Vol.2, p.1579-1585 Vol.2
2004
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2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004, Vol.2, p.2027-2031 Vol.2
2004
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52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345), 2002, p.1304-1309
2002
- Link zum Volltext
2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007, 2007, p.1-1
2007
- Link zum Volltext
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004, Vol.2, p.1843-1850 Vol.2
2004
- Link zum Volltext
Proceedings Electronic Components and Technology, 2005. ECTC '05, 2005, p.1364-1372
2005
- Link zum Volltext
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004, Vol.1, p.895-900 Vol.1
2004
- Link zum Volltext
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004, Vol.2, p.1630-1635 Vol.2
2004
- Link zum Volltext
52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345), 2002, p.446-451
2002
- Link zum Volltext
53rd Electronic Components and Technology Conference, 2003. Proceedings, 2003, p.182-188
2003
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2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004, Vol.1, p.17-23 Vol.1
2004
- Link zum Volltext
9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No.04TH8742). 2004 Proceedings, 2004, p.247-252
2004
- Link zum Volltext
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