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Journal of heat transfer, 2007-02, Vol.129 (2), p.141-153
2007
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IEEE transactions on components and packaging technologies, 2008-03, Vol.31 (1), p.204-210
2008
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Journal of heat transfer, 2003-12, Vol.125 (6), p.1170-1177
2003
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Journal of heat transfer, 2008-12, Vol.130 (12), p.121501(9)-121501(9)
2008
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Heat transfer engineering, 2003-07, Vol.24 (4), p.39-48
2003
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Strojniski Vestnik, 2001-01, Vol.47 (8), p.441-448
2001
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Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006, 2006, p.791-797
2006
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Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006, 2006, p.5 pp.-457
2006
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Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005, 2005, p.90-93
2005
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The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543), 2004, Vol.1, p.91-95 Vol.1
2004
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