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Thin layer etching of low-k SiCO spacer using hydrogen ion implantation followed by hydrofluoric acid

Journal of vacuum science and technology. B, Nanotechnology & microelectronics, 2018-09, Vol.36 (5)

2018

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Understanding of a new approach for silicon nitride spacer etching using gaseous hydrofluoric acid after hydrogen ion implantation

Journal of vacuum science & technology. A, Vacuum, surfaces, and films, 2017-03, Vol.35 (2)

2017

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Cyclic approach for silicon nitride spacer etching in fin field-effect transistors and stacked nanowire devices

Journal of vacuum science & technology. A, Vacuum, surfaces, and films, 2020-12, Vol.38 (6)

2020

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Gate spacers etching of Si$_3$N$_4$ using cyclic approach for 3D CMOS devices

Journal of vacuum science & technology. A, Vacuum, surfaces, and films, 2021, Vol.39

2021

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Silicon nitride spacer etching selectively to silicon using CH3F/O2/He/SiCl4 plasma

Journal of vacuum science & technology. A, Vacuum, surfaces, and films, 2020-05, Vol.38 (3)

2020

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Landscapes of Globalization in Ordinary Towns: Logistics and Trade Apparatus

Urbanities, 2017-11, Vol.7 (2), p.35-51

Raffin, Fabrice

2017

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Gate spacers etching of Si3N4 using cyclic approach for 3D CMOS devices

Journal of vacuum science & technology. A, Vacuum, surfaces, and films, 2021-05, Vol.39 (3)

2021

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Une approche pluridisciplinaire et pluri-scalaire des dynamiques paysagères du bassin minier du Nord-Pas-de-Calais

VertigO : la revue électronique en sciences de l'environnement, 2016-06 (Hors-série 24)

2016

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Le bassin minier du Nord-Pas-de-Calais. Un paysage stratifié entre projets, amnésies et créations: Retour sur une démarche de recherche interdisciplinaire

Projets de paysage, 2015-12 (13)

2015

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Thin Layer Etching of Silicon Nitride: Comparison of Downstream Plasma, Liquid HF and Gaseous HF Processes for Selective Removal after Light Ion Implantation

Solid state phenomena, 2016-09, Vol.255, p.69-74

2016

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A full-process chain assessment for nanoimprint technology on 200-mm industrial platform

Advanced optical technologies, 2017-06, Vol.6 (3-4), p.277-292

2017

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An Etch Stop and Sacrificial Materials Study for 3D NEMS-CMOS Co-Integration

ECS transactions, 2014, Vol.61 (2), p.395-400

2014

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Electroless deposition of CoWP: Material characterization and process optimization on 300 mm wafers

Microelectronic engineering, 2006-11, Vol.83 (11), p.2082-2087

2006

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Effects of Plasma and Wet Processes on Si-Rich Anti-Reflective Coating to Address Selective Trilayer Rework for Sub-20nm Technology Nodes

ECS transactions, 2013, Vol.58 (6), p.241-249

2013

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Infrastructures de transports, territoire et opérationnalités : enjeux méthodologiques et positionnements de recherche

VertigO : la revue électronique en sciences de l'environnement, 2016-06

2016

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Advanced Surface Preparation Development on a 300 mm Single Wafer Spin-on Platform

ECS transactions, 2007, Vol.11 (2), p.249-256

2007

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Single Wafer Hydrophobic Surface Preparation on 300mm by HF Vapor

Solid state phenomena, 2008, Vol.134, p.11-14

2008

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Germanium Surface Passivation Using Ozone Gaseous Phase

Solid state phenomena, 2008, Vol.134, p.37-40

2008

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Silicon Nitride Spacer Etching with Nearly Atomic Precision for 2D and 3D Devices

Meeting abstracts (Electrochemical Society), 2017-04, Vol.MA2017-01 (25), p.1248-1248

2017

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Resist Stripping for Advanced FEOL Nodes: Improvements to Process Based on Ozone Diffusion by Use of Additives

Solid state phenomena, 2005-04, Vol.103-104, p.301-304

2005

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An Etch Stop and Sacrificial Materials Study for 3D NEMS-CMOS Co-Integration

Meeting abstracts (Electrochemical Society), 2014-04, Vol.MA2014-01 (36), p.1389-1389

2014

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Effects of Plasma and Wet Processes on Si-Rich Anti-Reflective Coating to Address Selective Trilayer Rework for Sub-20nm Technology Nodes

Meeting abstracts (Electrochemical Society), 2013-10, Vol.MA2013-02 (30), p.2122-2122

2013

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SAFETY IN BIOSOLIDS DRYING-PELLETIZING PLANTS, THEORY AND BEST PRAC TICE

Proceedings of the Water Environment Federation, 2004-01, Vol.2004 (1), p.967-977

2004

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A New Entry to Pyrano[3,2-f]indolizines via the Regioselective Formation of an Indolizidin-7-one Enamine

Heterocycles, 1996, Vol.43 (7), p.1391

1996

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Development of a Manufacturable Single-Wafer HF Vapor Process for Pre-Epitaxial Cleans

Meeting abstracts (Electrochemical Society), 2007-09, Vol.MA2007-02 (18), p.1011-1011

2007

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Thin layer etching of low-k SiCO spacer using hydrogen ion implantation followed by hydrofluoric acid

Understanding of a new approach for silicon nitride spacer etching using gaseous hydrofluoric acid after hydrogen ion implantation

Cyclic approach for silicon nitride spacer etching in fin field-effect transistors and stacked nanowire devices

Gate spacers etching of Si$_3$N$_4$ using cyclic approach for 3D CMOS devices

Silicon nitride spacer etching selectively to silicon using CH3F/O2/He/SiCl4 plasma

Landscapes of Globalization in Ordinary Towns: Logistics and Trade Apparatus

Gate spacers etching of Si3N4 using cyclic approach for 3D CMOS devices

Une approche pluridisciplinaire et pluri-scalaire des dynamiques paysagères du bassin minier du Nord-Pas-de-Calais

Le bassin minier du Nord-Pas-de-Calais. Un paysage stratifié entre projets, amnésies et créations: Retour sur une démarche de recherche interdisciplinaire

Thin Layer Etching of Silicon Nitride: Comparison of Downstream Plasma, Liquid HF and Gaseous HF Processes for Selective Removal after Light Ion Implantation

A full-process chain assessment for nanoimprint technology on 200-mm industrial platform

An Etch Stop and Sacrificial Materials Study for 3D NEMS-CMOS Co-Integration

Electroless deposition of CoWP: Material characterization and process optimization on 300 mm wafers

Effects of Plasma and Wet Processes on Si-Rich Anti-Reflective Coating to Address Selective Trilayer Rework for Sub-20nm Technology Nodes

Infrastructures de transports, territoire et opérationnalités : enjeux méthodologiques et positionnements de recherche

Advanced Surface Preparation Development on a 300 mm Single Wafer Spin-on Platform

Single Wafer Hydrophobic Surface Preparation on 300mm by HF Vapor

Germanium Surface Passivation Using Ozone Gaseous Phase

Silicon Nitride Spacer Etching with Nearly Atomic Precision for 2D and 3D Devices

Resist Stripping for Advanced FEOL Nodes: Improvements to Process Based on Ozone Diffusion by Use of Additives

An Etch Stop and Sacrificial Materials Study for 3D NEMS-CMOS Co-Integration

Effects of Plasma and Wet Processes on Si-Rich Anti-Reflective Coating to Address Selective Trilayer Rework for Sub-20nm Technology Nodes

SAFETY IN BIOSOLIDS DRYING-PELLETIZING PLANTS, THEORY AND BEST PRAC TICE

A New Entry to Pyrano[3,2-f]indolizines via the Regioselective Formation of an Indolizidin-7-one Enamine

Development of a Manufacturable Single-Wafer HF Vapor Process for Pre-Epitaxial Cleans

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