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Journal of alloys and compounds, 2010-09, Vol.507 (1), p.215-224
2010
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Journal of electronic materials, 2011-03, Vol.40 (3), p.344-354
2011
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2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, 2010, p.81-87
2010
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2008 58th Electronic Components and Technology Conference, 2008, p.1667-1672
2008
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2007 9th Electronics Packaging Technology Conference, 2007, p.713-718
2007
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2008 International Conference on Electronic Packaging Technology & High Density Packaging, 2008, p.1-8
2008
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EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008, p.1-8
2008
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