UB Paderborn / Katalog / Suche / in CDI

1 – 2 von 2

Sortiert nach

Study of five substrate pad finishes for the co-design of solder joint reliability under board-level drop and temperature cycling test conditions

2008 International Conference on Electronic Packaging Technology & High Density Packaging, 2008, p.1-8

Wei Sun
Zhu, W.H.
Poh, E.S.W.
Tan, H.B.
Gan, R.T.

2008

Volltextzugriff (PDF)

Lead-free solder material characterization for thermo-mechanical modeling

EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008, p.1-8

Poh, E.S.W.
Zhu, W.H.
Zhang, X.R.
Wang, C.K.
Sun, A.Y.S.
Tan, H.B.

2008

Volltextzugriff (PDF)

1 – 2 von 2

Menü

Weitere Dienste

Einstellungen

Study of five substrate pad finishes for the co-design of solder joint reliability under board-level drop and temperature cycling test conditions

Lead-free solder material characterization for thermo-mechanical modeling

Suchergebnisse filtern