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2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME), 2015, p.157-160
2015
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2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME), 2015, p.65-69
2015
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2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME), 2013, p.167-170
2013
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2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME), 2013, p.255-258
2013
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International journal of electromagnetics and applications, 2012-08, Vol.1 (1), p.7-11
2012
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2010 9th International Symposium on Electronics and Telecommunications, 2010, p.433-436
2010
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33rd International Spring Seminar on Electronics Technology, ISSE 2010, 2010, p.354-359
2010
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2010 9th International Symposium on Electronics and Telecommunications, 2010, p.421-424
2010
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33rd International Spring Seminar on Electronics Technology, ISSE 2010, 2010, p.174-178
2010
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2010 9th International Symposium on Electronics and Telecommunications, 2010, p.429-432
2010
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2014 IEEE 20th International Symposium for Design and Technology in Electronic Packaging (SIITME), 2014, p.63-68
2014
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2016 IEEE 22nd International Symposium for Design and Technology in Electronic Packaging (SIITME), 2016, p.44-47
2016
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2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME), 2017, p.78-81
2017
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2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME), 2012, p.157-161
2012
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2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME), 2012, p.201-204
2012
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2012 35th International Spring Seminar on Electronics Technology, 2012, p.155-160
2012
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2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME), 2012, p.321-324
2012
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2010 3rd International Symposium on Electrical and Electronics Engineering (ISEEE), 2010, p.355-358
2010
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2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME), 2012, p.167-172
2012
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2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME), 2009, p.383-386
2009
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2009 32nd International Spring Seminar on Electronics Technology, 2009, p.1-6
2009
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2012 35th International Spring Seminar on Electronics Technology, 2012, p.168-172
2012
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2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME), 2010, p.233-236
2010
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2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME), 2012, p.151-156
2012
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Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE), 2011, p.320-326
2011
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Sprache
Erscheinungsjahr
n.n
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Thema
- Soldering
- Science & Technology
- Engineering
- Engineering, Electrical & Electronic
- Technology
- Temperature Measurement
- Lead
- Temperature
- Cooling
- Metals
- Resistors
- Electrical Resistance Measurement
- Environmentally Friendly Manufacturing Techniques
- Assembly
- Costs
- Electronics Packaging
- Heat Transfer
- Heating
- Microstructure
- Resistance
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