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Automated, real-time material detection during ultrashort pulsed laser machining using laser-induced breakdown spectroscopy, for process tuning, end-pointing, and segmentation

PloS one, 2024-01, Vol.19 (1), p.e0290761-e0290761

2024

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Gas-assisted femtosecond pulsed laser machining: A high-throughput alternative to focused ion beam for creating large, high-resolution cross sections

PloS one, 2023-05, Vol.18 (5), p.e0285158-e0285158

2023

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Terahertz-readable laser engraved marks as a novel solution for product traceability

Scientific reports, 2023-08, Vol.13 (1), p.12474-12474, Article 12474

2023

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Rapid high-resolution volumetric imaging via laser ablation delayering and confocal imaging

Scientific reports, 2022-07, Vol.12 (1), p.12277-12277, Article 12277

2022

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A novel material detection method using femtosecond laser, confocal imaging and image processing enabling endpointing in fast inspection of microelectronics

Microelectronics and reliability, 2021-11, Vol.126, p.114287, Article 114287

2021

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Synthetic Data for Deep Learning: Segmentation of PCB X-Ray Images

Microscopy and microanalysis, 2023-07, Vol.29 (Supplement_1), p.1897-1897

2023

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Three-Dimensional Reconstruction of Printed Circuit Boards: Comparative Study between 3D Femtosecond Laser Serial Sectioning and Optical Imaging versus 3D X-Ray Computed Tomography

Microscopy and microanalysis, 2022-08, Vol.28 (S1), p.284-286

2022

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Single Image Composite Tomography Utilizing Large Scale Femtosecond Laser Cross-sectioning and Scanning Electron Microscopy

Microscopy and microanalysis, 2022-08, Vol.28 (S1), p.876-878

2022

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Synthetic data augmentation to enhance manual and automated defect detection in microelectronics

Microelectronics and reliability, 2023-11, Vol.150, p.115220, Article 115220

2023

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Automated endpointing in microelectronics failure analysis using laser induced breakdown spectroscopy

Microelectronics and reliability, 2023-11, Vol.150, p.115224, Article 115224

2023

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Rapid three-dimensional reconstruction of printed circuit board using femtosecond laser delayering and digital microscopy

Microelectronics and reliability, 2022-11, Vol.138, p.114659, Article 114659

2022

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Rapid Chip Reverse Engineering Using Laser, FIB, and SEM

Microscopy and microanalysis, 2024-07, Vol.30 (Supplement_1)

2024

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Enhancing 3D SEM Imaging with AI: Generating Training Data through Laser Machining and Confocal Analysis

Microscopy and microanalysis, 2024-07, Vol.30 (Supplement_1)

2024

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Correlative multimodal imaging and targeted lasering for automated high-precision IC decapsulation

Microelectronics and reliability, 2022-11, Vol.138, p.114660, Article 114660

2022

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Material prediction from confocal images of lasered samples

Microscopy and microanalysis, 2021-08, Vol.27 (S1), p.2754-2755

2021

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Intelligent Ultrashort Pulsed Laser Machining Using Laser-Induced Breakdown Spectroscopy

Microscopy and microanalysis, 2023-07, Vol.29 (Supplement_1), p.2014-2014

2023

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Terahertz Readable Laser Tags for Information Storage and Traceability

Microscopy and microanalysis, 2023-07, Vol.29 (Supplement_1), p.818-818

2023

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Synthetic Data for Semantic Segmentation: A Path to Reverse Engineering in Printed Circuit Boards

Electronics (Basel), 2024-06, Vol.13 (12), p.2353

2024

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Model for predicting surface properties of lasered samples

Microscopy and microanalysis, 2021-08, Vol.27 (S1), p.3186-3189

2021

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Forward modeling of volume electron microscopy (vEM) of stained resin-embedded biological samples

Microscopy and microanalysis, 2021-08, Vol.27 (S1), p.776-777

2021

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A Tsetlin Machine with Multigranular Clauses

Artificial Intelligence XXXVI, p.146-151

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LNDb challenge on automatic lung cancer patient management

Medical image analysis, 2021-05, Vol.70, p.102027-102027, Article 102027

2021

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Automated, real-time material detection during ultrashort pulsed laser machining using laser-induced breakdown spectroscopy, for process tuning, end-pointing, and segmentation

Gas-assisted femtosecond pulsed laser machining: A high-throughput alternative to focused ion beam for creating large, high-resolution cross sections

Terahertz-readable laser engraved marks as a novel solution for product traceability

Rapid high-resolution volumetric imaging via laser ablation delayering and confocal imaging

A novel material detection method using femtosecond laser, confocal imaging and image processing enabling endpointing in fast inspection of microelectronics

Synthetic Data for Deep Learning: Segmentation of PCB X-Ray Images

Three-Dimensional Reconstruction of Printed Circuit Boards: Comparative Study between 3D Femtosecond Laser Serial Sectioning and Optical Imaging versus 3D X-Ray Computed Tomography

Single Image Composite Tomography Utilizing Large Scale Femtosecond Laser Cross-sectioning and Scanning Electron Microscopy

Synthetic data augmentation to enhance manual and automated defect detection in microelectronics

Automated endpointing in microelectronics failure analysis using laser induced breakdown spectroscopy

Rapid three-dimensional reconstruction of printed circuit board using femtosecond laser delayering and digital microscopy

Rapid Chip Reverse Engineering Using Laser, FIB, and SEM

Enhancing 3D SEM Imaging with AI: Generating Training Data through Laser Machining and Confocal Analysis

Correlative multimodal imaging and targeted lasering for automated high-precision IC decapsulation

Material prediction from confocal images of lasered samples

Intelligent Ultrashort Pulsed Laser Machining Using Laser-Induced Breakdown Spectroscopy

Terahertz Readable Laser Tags for Information Storage and Traceability

Synthetic Data for Semantic Segmentation: A Path to Reverse Engineering in Printed Circuit Boards

Model for predicting surface properties of lasered samples

Forward modeling of volume electron microscopy (vEM) of stained resin-embedded biological samples

A Tsetlin Machine with Multigranular Clauses

LNDb challenge on automatic lung cancer patient management

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