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Influence of Neutron Irradiation on Electron Traps Induced by NGB Stress in AlInN/GaN HEMTs

IEEE transactions on nuclear science, 2017-08, Vol.64 (8), p.2284-2291

2017

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Influence of Neutron Irradiation on Electron Traps Existing in GaN-Based Transistors

IEEE transactions on nuclear science, 2016-06, Vol.63 (3), p.1918-1926

2016

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Silicon Chemical Oxide Growth by a Novel Wet Treatment in Aqueous Chlorine Solutions

Electrochemistry, 2004/04/05, Vol.72(4), pp.238-245

2004

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Si and SiGe Alloys Wet Etching Using TMAH Chemistry

ECS transactions, 2013-08, Vol.58 (6), p.47-55

2013

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Neutron Irradiation Effects on the Electrical Properties of Previously Electrically Stressed AlInN/GaN HEMTs

IEEE transactions on nuclear science, 2019-05, Vol.66 (5), p.810-819

2019

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Effect of an Organic Inhibitor in High pH Chemical Rinse on the Platen for Cu-CMP

Solid state phenomena, 2008-01, Vol.134, p.299-302

2008

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Impact of Megasonic Activation with Different Chemistries on Silicon Surface in Single Wafer Tool

Solid state phenomena, 2009, Vol.145-146, p.15-18

2009

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Silicon surface wet cleaning and chemical oxide growth by a novel treatment in aqueous chlorine solutions

Electrochimica acta, 2004-09, Vol.49 (21), p.3545-3553

2004

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Post Cu-CMP Engineering Challenges for the 65 nm Technology Nodes and Beyond

ECS transactions, 2007-09, Vol.11 (2), p.431-440

2007

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Elimination of Post Cu-CMP Watermark by Optimizing Post CMP Clean to Control Cu Dissolution

ECS transactions, 2007, Vol.11 (2), p.387-394

2007

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Electrochemical impedance spectroscopy as a probe for wet chemical silicon oxide characterization

Journal of solid state electrochemistry, 2001-07, Vol.5 (5), p.306-312

2001

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Semiconductor Space Charge and Surface Oxide Thin Layers Capacitance by Electrochemical Impedance Spectroscopy

Denki kagaku oyobi kōgyō butsuri kagaku, 2003-10, Vol.71 (10), p.844-852

2003

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Thermo-mechanical study of a 2.5D passive silicon interposer technology: Experimental, numerical and In-Situ stress sensors developments

2013 IEEE International 3D Systems Integration Conference (3DIC), 2013, p.1-7

2013

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Si and Sige Alloys Wet Etching Using Tmah Chemistry

Meeting abstracts (Electrochemical Society), 2013-10, Vol.MA2013-02 (30), p.2101-2101

2013

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Influence of the Process Conditions of a Polishing Rinse after CuCMP

Solid state phenomena, 2008, Vol.134, p.375-378

2008

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Neutron reflectivity study of ultrathin SiO2 on Si

Applied physics letters, 2004-05, Vol.84 (19), p.3816-3818

2004

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Copper Surface Analysis with ToF-SIMS: Spectra Interpretation and Stability Issues

Solid state phenomena, 2008, Vol.134, p.371-374

2008

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R and C Impedance Components Equivalent to the Charge Distribution within Si-Substrate Depletion Layer

Electrochemical and solid-state letters, 2003, Vol.6 (1), p.G7

2003

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Modelling the Growth of Chemical Oxide for Advanced Surface Preparation

Solid state phenomena, 2003-01, Vol.92, p.187-190

2003

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Elimination of Post Cu-CMP Watermark by Optimizing Post CMP Clean to Control Cu Dissolution

Meeting abstracts (Electrochemical Society), 2007-09, Vol.MA2007-02 (18), p.1060-1060

2007

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Post Cu-CMP Engineering Challenges for the 65 nm Technology Nodes and Beyond

Meeting abstracts (Electrochemical Society), 2007-09, Vol.MA2007-02 (18), p.1065-1065

2007

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Characterization of Post-Copper CMP Surface Leakage with Scanning Probe Microscopy

Meeting abstracts (Electrochemical Society), 2006-02, Vol.MA2005-01 (2), p.71-71

2006

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'Resist / Wet Etch' Couple for Dual Gate Oxide

Solid state phenomena, 2003-01, Vol.92, p.235-238

2003

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Zero Current Electrochemical Impedance Spectrometry for the Study of Si Substrate Depletion Layer

Denki kagaku oyobi kōgyō butsuri kagaku, 2002-08, Vol.70 (8), p.609-614

2002

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Electrochemical Study for the Characterization of Wet Silicon Oxide Surfaces

Solid state phenomena, 2001-01, Vol.76-77, p.81-84

2001

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Influence of Neutron Irradiation on Electron Traps Induced by NGB Stress in AlInN/GaN HEMTs

Influence of Neutron Irradiation on Electron Traps Existing in GaN-Based Transistors

Silicon Chemical Oxide Growth by a Novel Wet Treatment in Aqueous Chlorine Solutions

Si and SiGe Alloys Wet Etching Using TMAH Chemistry

Neutron Irradiation Effects on the Electrical Properties of Previously Electrically Stressed AlInN/GaN HEMTs

Effect of an Organic Inhibitor in High pH Chemical Rinse on the Platen for Cu-CMP

Impact of Megasonic Activation with Different Chemistries on Silicon Surface in Single Wafer Tool

Silicon surface wet cleaning and chemical oxide growth by a novel treatment in aqueous chlorine solutions

Post Cu-CMP Engineering Challenges for the 65 nm Technology Nodes and Beyond

Elimination of Post Cu-CMP Watermark by Optimizing Post CMP Clean to Control Cu Dissolution

Electrochemical impedance spectroscopy as a probe for wet chemical silicon oxide characterization

Semiconductor Space Charge and Surface Oxide Thin Layers Capacitance by Electrochemical Impedance Spectroscopy

Thermo-mechanical study of a 2.5D passive silicon interposer technology: Experimental, numerical and In-Situ stress sensors developments

Si and Sige Alloys Wet Etching Using Tmah Chemistry

Influence of the Process Conditions of a Polishing Rinse after CuCMP

Neutron reflectivity study of ultrathin SiO2 on Si

Copper Surface Analysis with ToF-SIMS: Spectra Interpretation and Stability Issues

R and C Impedance Components Equivalent to the Charge Distribution within Si-Substrate Depletion Layer

Modelling the Growth of Chemical Oxide for Advanced Surface Preparation

Elimination of Post Cu-CMP Watermark by Optimizing Post CMP Clean to Control Cu Dissolution

Post Cu-CMP Engineering Challenges for the 65 nm Technology Nodes and Beyond

Characterization of Post-Copper CMP Surface Leakage with Scanning Probe Microscopy

'Resist / Wet Etch' Couple for Dual Gate Oxide

Zero Current Electrochemical Impedance Spectrometry for the Study of Si Substrate Depletion Layer

Electrochemical Study for the Characterization of Wet Silicon Oxide Surfaces

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