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Aluminum Nitride to Silicon Direct Bonding for an Alternative Silicon-On-Insulator Platform

ACS applied materials & interfaces, 2021-08, Vol.13 (32), p.38857-38865

2021

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Void formation and its impact on Cu Sn intermetallic compound formation

Journal of alloys and compounds, 2016-08, Vol.677, p.127-138

2016

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Scaling of piezoelectric in-plane NEMS: Towards nanoscale integration of AlN-based transducer on vertical sidewalls

Materials & design, 2024-08, Vol.244, p.113116, Article 113116

2024

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Chemically Stable Atomic-Layer-Deposited Al2O3 Films for Processability

ACS omega, 2017-07, Vol.2 (7), p.3390-3398

2017

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Heat generation in high power prismatic Li-ion battery cell with LiMnNiCoO2 cathode material

International journal of energy research, 2014-09, Vol.38 (11), p.1424-1437

2014

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Metalorganic Chemical Vapor Deposition of AlN on High Degree Roughness Vertical Surfaces for MEMS Fabrication

Advanced electronic materials, 2024-04, Vol.10 (4), p.n/a

2024

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In‐Plane AlN‐based Actuator: Toward a New Generation of Piezoelectric MEMS

Advanced electronic materials, 2023-08, Vol.9 (8), p.n/a

2023

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Calculation of Phase Diagrams and First-Principles Study of Germanium Impacts on Phosphorus Distribution in Czochralski Silicon

Journal of electronic materials, 2021-08, Vol.50 (8), p.4272-4288

2021

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Thermal Boundary Conductance of Direct Bonded Aluminum Nitride to Silicon Interfaces

ACS applied electronic materials, 2024-04, Vol.6 (4), p.2413-2419

2024

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In‐Plane AlN‐Based Actuator: Toward a New Generation of Piezoelectric MEMS

Advanced electronic materials, 2023-12, Vol.9 (12), p.n/a

2023

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Detection of In-Plane Movement in Electrically Actuated Microelectromechanical Systems Using a Scanning Electron Microscope

Micromachines (Basel), 2023-03, Vol.14 (3), p.698

2023

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The Role of Ultrafine Crystalline Behavior and Trace Impurities in Copper on Intermetallic Void Formation

ACS applied electronic materials, 2019-01, Vol.1 (1), p.88-95

2019

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Thermal Cycling Reliability of Sn-Ag-Cu Solder Interconnections—Part 2: Failure Mechanisms

Journal of electronic materials, 2013-06, Vol.42 (6), p.963-972

2013

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Thermal simulation of high-power Li-ion battery with LiMn1/3Ni1/3Co1/3O2 cathode on cell and module levels

International journal of energy research, 2014-04, Vol.38 (5), p.564-572

2014

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Thermal Cycling Reliability of Sn-Ag-Cu Solder Interconnections. Part 1: Effects of Test Parameters

Journal of electronic materials, 2013-06, Vol.42 (6), p.1171-1183

2013

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Handbook of Silicon Based MEMS Materials and Technologies (3rd Edition)

3rd edition., 2020

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Atomic layer deposition of AlN using atomic layer annealing—Towards high-quality AlN on vertical sidewalls

Journal of vacuum science & technology. A, Vacuum, surfaces, and films, 2021-05, Vol.39 (3)

2021

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A reliability study of adhesion mechanism between liquid crystal polymer and silicone adhesive

Microelectronics and reliability, 2012-12, Vol.52 (12), p.2962-2969

2012

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Blistering mechanisms of atomic-layer-deposited AlN and Al2O3 films

Applied physics letters, 2017-10, Vol.111 (14)

2017

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Handbook of Silicon Based MEMS Materials and Technologies (2nd Edition)

Markku Tilli, Mervi Paulasto-Kröckel, Teruaki Motooka, Markku Tilli, Veikko Lindroos, Veikko Lindroos

2, 2015

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The impact of residual stress on resonating piezoelectric devices

Materials & design, 2020-11, Vol.196, p.109126, Article 109126

2020

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Improved methods for development of high reliability electronics

2014 IEEE Aerospace Conference, 2014, p.1-13

2014

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Finite element analyses and lifetime predictions for SnAgCu solder interconnections in thermal shock tests

Soldering & surface mount technology, 2011-01, Vol.23 (3), p.161-167

2011

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Mechanical properties and reliability of aluminum nitride thin films

Journal of alloys and compounds, 2019-01, Vol.772, p.306-313

2019

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Low-Temperature Wafer-Level Bonding with Cu-Sn-In Solid Liquid Interdiffusion for Microsystem Packaging

Microelectronic engineering, 2024-03, Vol.286, p.112140, Article 112140

2024

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Aluminum Nitride to Silicon Direct Bonding for an Alternative Silicon-On-Insulator Platform

Void formation and its impact on Cu Sn intermetallic compound formation

Scaling of piezoelectric in-plane NEMS: Towards nanoscale integration of AlN-based transducer on vertical sidewalls

Chemically Stable Atomic-Layer-Deposited Al2O3 Films for Processability

Heat generation in high power prismatic Li-ion battery cell with LiMnNiCoO2 cathode material

Metalorganic Chemical Vapor Deposition of AlN on High Degree Roughness Vertical Surfaces for MEMS Fabrication

In‐Plane AlN‐based Actuator: Toward a New Generation of Piezoelectric MEMS

Calculation of Phase Diagrams and First-Principles Study of Germanium Impacts on Phosphorus Distribution in Czochralski Silicon

Thermal Boundary Conductance of Direct Bonded Aluminum Nitride to Silicon Interfaces

In‐Plane AlN‐Based Actuator: Toward a New Generation of Piezoelectric MEMS

Detection of In-Plane Movement in Electrically Actuated Microelectromechanical Systems Using a Scanning Electron Microscope

The Role of Ultrafine Crystalline Behavior and Trace Impurities in Copper on Intermetallic Void Formation

Thermal Cycling Reliability of Sn-Ag-Cu Solder Interconnections—Part 2: Failure Mechanisms

Thermal simulation of high-power Li-ion battery with LiMn1/3Ni1/3Co1/3O2 cathode on cell and module levels

Thermal Cycling Reliability of Sn-Ag-Cu Solder Interconnections. Part 1: Effects of Test Parameters

Handbook of Silicon Based MEMS Materials and Technologies (3rd Edition)

Atomic layer deposition of AlN using atomic layer annealing—Towards high-quality AlN on vertical sidewalls

A reliability study of adhesion mechanism between liquid crystal polymer and silicone adhesive

Blistering mechanisms of atomic-layer-deposited AlN and Al2O3 films

Handbook of Silicon Based MEMS Materials and Technologies (2nd Edition)

The impact of residual stress on resonating piezoelectric devices

Improved methods for development of high reliability electronics

Finite element analyses and lifetime predictions for SnAgCu solder interconnections in thermal shock tests

Mechanical properties and reliability of aluminum nitride thin films

Low-Temperature Wafer-Level Bonding with Cu-Sn-In Solid Liquid Interdiffusion for Microsystem Packaging

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