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3D SiP with Organic Interposer for ASIC and Memory Integration

2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016, p.1445-1450

2016

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A four ASIC MCM-C, design for manufacturability and the next generation silicon

IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 1995-02, Vol.18 (1), p.4-8

1995

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A Four Asic Mcm-c, the "Kiss" Principle, and the Next Generation Silicon

Proceedings of the International Conference on Multichip Modules, 1994, p.572-577

1994

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Development of a self-assessment tool for resident doctors’ communication skills in India

Journal of Educational Evaluation for Health Professions, 2019, 16(0), , pp.1-6

2019

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A CASE OF MULTIPLE SELF-INFLICTED CUTS TO THE NECK AND WRIST PRESENTING WITH AIRWAY COMPROMISE AND CATASTROPHIC HEMORRHAGE

Indian Journal of Case Reports, 2019-12, Vol.5 (6), p.551-553

2019

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3D SiP with Organic Interposer for ASIC and Memory Integration

A four ASIC MCM-C, design for manufacturability and the next generation silicon

A Four Asic Mcm-c, the "Kiss" Principle, and the Next Generation Silicon

Development of a self-assessment tool for resident doctors’ communication skills in India

A CASE OF MULTIPLE SELF-INFLICTED CUTS TO THE NECK AND WRIST PRESENTING WITH AIRWAY COMPROMISE AND CATASTROPHIC HEMORRHAGE

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