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Resource-Efficient SRAM-Based Ternary Content Addressable Memory

IEEE transactions on very large scale integration (VLSI) systems, 2017-04, Vol.25 (4), p.1583-1587

2017

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IEEE_Xplore

Dynamics from open innovation to evolutionary change

Journal of open innovation, 2016-06, Vol.2 (7), p.1-22

2016

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Open Innovation and Serial Entrepreneurs

Sustainability, 2019-09, Vol.11 (18), p.5055

2019

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On intersection forms of definite 4-manifolds bounded by a rational homology 3-sphere

Topology and its applications, 2018-04, Vol.238, p.59-75

2018

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Active Precharge Hammering to Monitor Displacement Damage Using High-Energy Protons in 3x-nm SDRAM

IEEE transactions on nuclear science, 2017-02, Vol.64 (2), p.859-866

2017

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IEEE_Xplore

Irreducible 3-manifolds that cannot be obtained by 0-surgery on a knot

Transactions of the American Mathematical Society, 2019-12, Vol.372 (11), p.7619-7638

2019

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Measurement of thermal conductivity of Bi2Te3 nanowire using high-vacuum scanning thermal wave microscopy

Applied physics letters, 2016-02, Vol.108 (7)

2016

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Collective Intelligence: The Creative Way from Knowledge to Open Innovation

Science, technology & society (New Delhi, India), 2021-07, Vol.26 (2), p.201-222

2021

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The Applicability of Artificial Intelligence in International Law

Journal of East Asia and international law, 2019-03, Vol.12 (1), p.7-30

2019

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Sustainable Production Scheduling in Open Innovation Perspective under the Fourth Industrial Revolution

Journal of open innovation, 2018-12, Vol.4 (4), p.42, Article 42

2018

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Complementary multiplatforms in the growing innovation ecosystem: Evidence from 3D printing technology

Technological forecasting & social change, 2018-11, Vol.136, p.192-207

2018

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Active-precharge hammering on a row induced failure in DDR3 SDRAMs under 3× nm technology

2014 IEEE International Integrated Reliability Workshop Final Report (IIRW), 2014, p.82-85

2014

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IEEE_Xplore

Entrepreneurial cyclical dynamics of open innovation

Journal of evolutionary economics, 2018-12, Vol.28 (5), p.1151-1174

2018

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Spherical 3-Manifolds Bounding Rational Homology Balls

The Michigan mathematical journal, 2021-05, Vol.70 (2), Article 227

2021

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Thermal efficiency decision of variable polarity aluminum arc welding through molten pool analysis

International journal of heat and mass transfer, 2019-08, Vol.138, p.729-737

2019

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Sustainability Condition of Open Innovation: Dynamic Growth of Alibaba from SME to Large Enterprise

Sustainability, 2020-06, Vol.12 (11), p.4379

2020

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Statistical distributions of row-hammering induced failures in DDR3 components

Microelectronics and reliability, 2016-12, Vol.67, p.143-149

2016

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Open Innovation to Business Model: New Perspective to connect between technology and market

Science, technology & society (New Delhi, India), 2016-11, Vol.21 (3), p.324-348

2016

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An infinite-rank summand of knots with trivial Alexander polynomial

Journal of symplectic geometry, 2018, Vol.16 (6), p.1749-1771

2018

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Logic soft error study with 800-MHz DDR3 SDRAMs in 3x nm using proton and neutron beams

2015 IEEE International Reliability Physics Symposium, 2015, p.SE.3.1-SE.3.5

2015

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IEEE_Xplore

The role of a business model in market growth: The difference between the converted industry and the emerging industry

Technological forecasting & social change, 2019-09, Vol.146, p.534-562

2019

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Solution-processed oxide semiconductors for low-cost and high-performance thin-film transistors and fabrication of organic light-emitting-diode displays

Journal of the Society for Information Display, 2010-10, Vol.18 (10), p.734-744

2010

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How to Respond to the Fourth Industrial Revolution, or the Second Information Technology Revolution? Dynamic New Combinations between Technology, Market, and Society through Open Innovation

Journal of open innovation, 2018-09, Vol.4 (3), p.21, Article 21

2018

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Micro open innovation dynamics under inter-rationality

Technological forecasting & social change, 2024-04, Vol.201, p.123263, Article 123263

2024

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Experiments and root cause analysis for active-precharge hammering fault in DDR3 SDRAM under 3× nm technology

Microelectronics and reliability, 2016-02, Vol.57, p.39-46

2016

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Resource-Efficient SRAM-Based Ternary Content Addressable Memory

Dynamics from open innovation to evolutionary change

Open Innovation and Serial Entrepreneurs

On intersection forms of definite 4-manifolds bounded by a rational homology 3-sphere

Active Precharge Hammering to Monitor Displacement Damage Using High-Energy Protons in 3x-nm SDRAM

Irreducible 3-manifolds that cannot be obtained by 0-surgery on a knot

Measurement of thermal conductivity of Bi2Te3 nanowire using high-vacuum scanning thermal wave microscopy

Collective Intelligence: The Creative Way from Knowledge to Open Innovation

The Applicability of Artificial Intelligence in International Law

Sustainable Production Scheduling in Open Innovation Perspective under the Fourth Industrial Revolution

Complementary multiplatforms in the growing innovation ecosystem: Evidence from 3D printing technology

Active-precharge hammering on a row induced failure in DDR3 SDRAMs under 3× nm technology

Entrepreneurial cyclical dynamics of open innovation

Spherical 3-Manifolds Bounding Rational Homology Balls

Thermal efficiency decision of variable polarity aluminum arc welding through molten pool analysis

Sustainability Condition of Open Innovation: Dynamic Growth of Alibaba from SME to Large Enterprise

Statistical distributions of row-hammering induced failures in DDR3 components

Open Innovation to Business Model: New Perspective to connect between technology and market

An infinite-rank summand of knots with trivial Alexander polynomial

Logic soft error study with 800-MHz DDR3 SDRAMs in 3x nm using proton and neutron beams

The role of a business model in market growth: The difference between the converted industry and the emerging industry

Solution-processed oxide semiconductors for low-cost and high-performance thin-film transistors and fabrication of organic light-emitting-diode displays

How to Respond to the Fourth Industrial Revolution, or the Second Information Technology Revolution? Dynamic New Combinations between Technology, Market, and Society through Open Innovation

Micro open innovation dynamics under inter-rationality

Experiments and root cause analysis for active-precharge hammering fault in DDR3 SDRAM under 3× nm technology

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