UB Paderborn / Katalog / Suche / in CDI

Transient Measurement of the Junction-To-Case Thermal Resistance Using Structure Functions: Chances and Limits

2008 Twenty-fourth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2008, p.191-197

2008

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Development of a standard for transient measurement of junction-to-case thermal resistance

Microelectronics and reliability, 2012-07, Vol.52 (7), p.1272-1278

2012

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Transient dual interface measurement - A new JEDEC standard for the measurement of the junction-to-case thermal resistance

2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2011, p.222-229

2011

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Spiral CT Angiography of the Abdominal Aorta: Comparison of Iodixanol and Ioversol

Investigative radiology, 1999-05, Vol.34 (5), p.374-374

1999

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How to evaluate transient dual interface measurements of the Rth-JC of power semiconductor packages

2009 25th Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2009, p.172-179

2009

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Clusteranalyse

Multivariate statistische Verfahren, 2015, p.437-536

Originally published 1996, 2015

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Grundlagen der mehrdimensionalen Skalierung

Multivariate statistische Verfahren, 2015, p.767-794

Originally published 1996, 2015

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Thermal transient modeling and experimental validation in the European project PROFIT

IEEE transactions on components and packaging technologies, 2004-09, Vol.27 (3), p.530-538

2004

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Board via effect on thermal performance of a leadless package

Journal of microelectronics and electronic packaging, 2004, Vol.1 (1), p.9-15

2004

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Generation and verification of boundary independent compact thermal models for active components according to the DELPHI/SEED methods

Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306), 1999, p.201-211

1999

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Modeling of mixed-mode delamination by cohesive zone method

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013, p.1-7

2013

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Thermal transient modeling and experimental validation in the European project PROFIT

Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2003, 2003, p.247-254

2003

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Simulation of diffusion controlled intermetallic formation of Au/Al interface

2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2012, p.1/7-7/7

2012

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Interfacial strength of Silicon-to-Molding Compound changes with thermal residual stress

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE), 2010, p.1-5

2010

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How to fabricate specimens for silicon-to-molding compound interface adhesion measurements

2009 11th Electronics Packaging Technology Conference, 2009, p.357-362

2009

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Effect of substrate warpage on flip chip BGA thermal stress simulation

2010 12th Electronics Packaging Technology Conference, 2010, p.500-504

2010

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Thermal impact of randomly distributed solder voids on Rth-JC of MOSFETs

2008 2nd Electronics System-Integration Technology Conference, 2008, p.237-244

2008

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Development of a standard for transient measurement of junction-to-case thermal resistance

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2011, p.1/8-8/8

2011

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Induced delamination of silicon-molding compound interfaces

EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2009, p.1-4

2009

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Improving predictability of wire-sweep in cavity filling analysis

2011 IEEE 13th Electronics Packaging Technology Conference, 2011, p.272-276

2011

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Thermo-mechanical modeling of a 3D flip chip fully populated BGA package

2010 12th Electronics Packaging Technology Conference, 2010, p.637-640

2010

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Design study for improved solder joint reliability of VQFN packages

EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005, 2005, p.297-304

2005

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Socioeconomic Aspects of a Value Analysis of Wind Energy-Illustrated for the Netherlands

Energy sources. Part A, Recovery, utilization, and environmental effects, 1982-01, Vol.6 (3), p.245-245

1982

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Importance of molding compound chemical shrinkage in the stress and warpage analysis of PQFPs

IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 1996-05, Vol.19 (2), p.296-300

1996

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A new leadframe design solution for improved pop-corn cracking performance

1996 Proceedings 46th Electronic Components and Technology Conference, 1996, p.78-91

1996

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Transient Measurement of the Junction-To-Case Thermal Resistance Using Structure Functions: Chances and Limits

Development of a standard for transient measurement of junction-to-case thermal resistance

Transient dual interface measurement - A new JEDEC standard for the measurement of the junction-to-case thermal resistance

Spiral CT Angiography of the Abdominal Aorta: Comparison of Iodixanol and Ioversol

How to evaluate transient dual interface measurements of the Rth-JC of power semiconductor packages

Clusteranalyse

Grundlagen der mehrdimensionalen Skalierung

Thermal transient modeling and experimental validation in the European project PROFIT

Board via effect on thermal performance of a leadless package

Generation and verification of boundary independent compact thermal models for active components according to the DELPHI/SEED methods

Modeling of mixed-mode delamination by cohesive zone method

Thermal transient modeling and experimental validation in the European project PROFIT

Simulation of diffusion controlled intermetallic formation of Au/Al interface

Interfacial strength of Silicon-to-Molding Compound changes with thermal residual stress

How to fabricate specimens for silicon-to-molding compound interface adhesion measurements

Effect of substrate warpage on flip chip BGA thermal stress simulation

Thermal impact of randomly distributed solder voids on Rth-JC of MOSFETs

Development of a standard for transient measurement of junction-to-case thermal resistance

Induced delamination of silicon-molding compound interfaces

Improving predictability of wire-sweep in cavity filling analysis

Thermo-mechanical modeling of a 3D flip chip fully populated BGA package

Design study for improved solder joint reliability of VQFN packages

Socioeconomic Aspects of a Value Analysis of Wind Energy-Illustrated for the Netherlands

Importance of molding compound chemical shrinkage in the stress and warpage analysis of PQFPs

A new leadframe design solution for improved pop-corn cracking performance

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