Sortiert nach
IEEE sensors journal, 2019-10, Vol.19 (20), p.9139-9148
2019
Volltextzugriff (PDF)
Microelectronics and reliability, 2017-07, Vol.74, p.165-172
2017
Volltextzugriff (PDF)
IEEE transactions on components, packaging, and manufacturing technology (2011), 2019-01, Vol.9 (1), p.28-38
2019
Volltextzugriff (PDF)
IEEE transactions on components, packaging, and manufacturing technology (2011), 2018-05, Vol.8 (5), p.750-763
2018
Volltextzugriff (PDF)
Microelectronics and reliability, 2016-07, Vol.62, p.58-62
2016
Volltextzugriff (PDF)
IEEE transactions on components, packaging, and manufacturing technology (2011), 2018-01, Vol.8 (5), p.750
2018
Volltextzugriff (PDF)
Applied Mechanics and Materials, 2015-11, Vol.807 (Uncertainty in Mechanical Engineering II), p.45-54
2015
Volltextzugriff (PDF)
2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2014, p.1-10
2014
Volltextzugriff (PDF)
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2018, p.1366-1373
2018
Volltextzugriff (PDF)
2015 16th International Conference on Electronic Packaging Technology (ICEPT), 2015, p.413-418
2015
Volltextzugriff (PDF)
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 2017, p.1119-1127
2017
Volltextzugriff (PDF)
2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2016, p.1-8
2016
Volltextzugriff (PDF)
2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2015, p.1-5
2015
Volltextzugriff (PDF)
2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2015, p.1-6
2015
Volltextzugriff (PDF)
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 2017, p.476-482
2017
Volltextzugriff (PDF)
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016, p.1386-1393
2016
Volltextzugriff (PDF)
2015 European Microelectronics Packaging Conference (EMPC), 2015, p.1-6
2015
Volltextzugriff (PDF)
2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2014, p.1-4
2014
Volltextzugriff (PDF)
Foods, 2023-10, Vol.12 (19), p.3667
2023
Volltextzugriff (PDF)
Materials science & engineering. C, Materials for biological applications, 2019-04, Vol.97, p.302
- Kołaczkowska, Magdalena
- Siondalski, Piotr
- Kowalik, Maciej Michał
- Pęksa, Rafał
- Długa, Aldona
- Zając, Wacław
- Dederko, Paulina
- Kołodziejska, Ilona
- Malinowska-Pańczyk, Edyta
- Sinkiewicz, Izabela
- Staroszczyk, Hanna
- Śliwińska, Agata
- Stanisławska, Alicja
- Szkodo, Marek
- Pałczyńska, Paulina
- Jabłoński, Grzegorz
- Borman, Andrzej
- Wilczek, Piotr
2019
Volltextzugriff (PDF)
Materials Science & Engineering C, 2019-04, Vol.97, p.302-312
- Kołaczkowska, Magdalena
- Siondalski, Piotr
- Kowalik, Maciej Michał
- Pęksa, Rafał
- Długa, Aldona
- Zając, Wacław
- Dederko, Paulina
- Kołodziejska, Ilona
- Malinowska-Pańczyk, Edyta
- Sinkiewicz, Izabela
- Staroszczyk, Hanna
- Śliwińska, Agata
- Stanisławska, Alicja
- Szkodo, Marek
- Pałczyńska, Paulina
- Jabłoński, Grzegorz
- Borman, Andrzej
- Wilczek, Piotr
2019
Volltextzugriff (PDF)
Suchergebnisse filtern
Filter anzeigenNur zeigen
Publikationsform
Sprache
Erscheinungsjahr
n.n
n.n
Thema
- Science & Technology
- Technology
- Engineering
- Engineering, Electrical & Electronic
- Sensors
- Stress
- Stress Measurement
- Silicon
- Temperature Measurement
- Automotive Electronics
- Finite Element Method
- Physical Sciences
- Physics
- Physics, Applied
- Stress Sensor
- Stresses
- Temperature Sensors
- Computer Simulation
- Materials Science
- Mathematical Models
Kollektion
Zeitschrift / Serie
- Ieee Transactions On Components, Packaging, And Manufacturing Technology
- Materials Science & Engineering. C, Materials For Biological Applications
- Microelectronics And Reliability
- Applied Mechanics And Materials
- Foods
- Ieee Sensors Journal
- Materials Science & Engineering C
- Materials Science & Engineering C-Materials For Biological Applications
- Materials Science & Engineering. C, Biomimetic Materials, Sensors And Systems
- Materials Science And Engineering C