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Modeling of Eye-Diagram Distortion and Data-Dependent Jitter in Meander Delay Lines on High-Speed Printed Circuit Boards (PCBs) Based on a Time-Domain Even-Mode and Odd-Mode Analysis

IEEE transactions on microwave theory and techniques, 2008-08, Vol.56 (8), p.1962-1972

2008

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Suppression of Power/Ground Inductive Impedance and Simultaneous Switching Noise Using Silicon Through-Via in a 3-D Stacked Chip Package

IEEE microwave and wireless components letters, 2007-12, Vol.17 (12), p.855-857

2007

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High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)

IEEE transactions on components, packaging, and manufacturing technology (2011), 2011-02, Vol.1 (2), p.181-195

2011

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High-Frequency Scalable Modeling and Analysis of a Differential Signal Through-Silicon Via

IEEE transactions on components, packaging, and manufacturing technology (2011), 2014-04, Vol.4 (4), p.697-707

2014

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Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring

IEEE transactions on components, packaging, and manufacturing technology (2011), 2011-02, Vol.1 (2), p.220-233

2011

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Modeling and Measurement of Power Supply Noise Effects on an Analog-to-Digital Converter Based on a Chip-PCB Hierarchical Power Distribution Network Analysis

IEEE transactions on electromagnetic compatibility, 2013-12, Vol.55 (6), p.1260-1270

2013

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PDN Impedance Modeling and Analysis of 3D TSV IC by Using Proposed P/G TSV Array Model Based on Separated P/G TSV and Chip-PDN Models

IEEE transactions on components, packaging, and manufacturing technology (2011), 2011-02, Vol.1 (2), p.208-219

2011

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Through-Silicon-Via-Based Decoupling Capacitor Stacked Chip in 3-D-ICs

IEEE transactions on components, packaging, and manufacturing technology (2011), 2013-09, Vol.3 (9), p.1467-1480

2013

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An On-Chip Electromagnetic Bandgap Structure using an On-Chip Inductor and a MOS Capacitor

IEEE microwave and wireless components letters, 2011-08, Vol.21 (8), p.439-441

2011

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Vertical Stepped Impedance EBG (VSI-EBG) Structure for Wideband Suppression of Simultaneous Switching Noise in Multilayer PCBs

IEEE transactions on electromagnetic compatibility, 2013-04, Vol.55 (2), p.307-314

2013

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Modeling and Analysis of a Power Distribution Network in TSV-Based 3-D Memory IC Including P/G TSVs, On-Chip Decoupling Capacitors, and Silicon Substrate Effects

IEEE transactions on components, packaging, and manufacturing technology (2011), 2012-12, Vol.2 (12), p.2057-2070

2012

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Mixed-Mode ABCD Parameters: Theory and Application to Signal Integrity Analysis of PCB-Level Differential Interconnects

IEEE transactions on electromagnetic compatibility, 2011-08, Vol.53 (3), p.814-822

2011

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Modeling and measurement of simultaneous switching noise coupling through signal via transition

IEEE transactions on advanced packaging, 2006-08, Vol.29 (3), p.548-559

2006

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Co-modeling, Experimental Verification, and Analysis of Chip-Package Hierarchical Power Distribution Network

IEICE transactions on electronics, 2008-04, Vol.E91-C (4), p.595-606

2008

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Protection of a delay-locked loop from simultaneous switching noise coupling using an on-chip electromagnetic bandgap structure

2012 IEEE International Symposium on Electromagnetic Compatibility, 2012, p.544-548

2012

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Analysis on Optimal Chip Floorplanning Considering Various Types of Decoupling Capacitors in Package PDN

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022, p.2091-2094

2022

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Design space exploration (DSE) for over-136GB/s IO bandwidth with LPDDR5X SDRAM packages on SOC package in 200mm3

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.19-23

2023

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Experimental analysis and measurement of hotspot location with thermal test vehicle in mobile SOC

2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2024, p.1-7

2024

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Multi-resolution method for thermal resistance matrix based on 2D Haar wavelet

2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2024, p.1-6

2024

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Differential signal via shield with narrow via pitch partial electromagnetic bandgap structure

2010 IEEE International Symposium on Electromagnetic Compatibility, 2010, p.451-454

2010

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Band-Stop Filter Effect of Power/Ground Plane on Through-Hole Signal Via in Multilayer PCB

IEICE transactions on electronics, 2006-04, Vol.E89-C (4), p.551-559

PAK, J. S.

2006

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Slots on ground fillings of multi-layer printed circuit board for suppressing indirect crosstalk between digital clock line and RF signal line in mixed mode mobile systems

2008 IEEE International Symposium on Electromagnetic Compatibility, 2008, p.1-6

2008

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Modeling and Measurement of Radiated Field Emission From a Power/Ground Plane Cavity Edge Excited by a Through-Hole Signal Via Based on a Balanced TLM and Via Coupling Model

IEEE transactions on advanced packaging, 2007-02, Vol.30 (1), p.73-85

2007

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Power/ground noise immunity test in wireless and high-speed UWB communication system

2008 IEEE International Symposium on Electromagnetic Compatibility, 2008, p.1-6

2008

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Electrical characterization of trough silicon via (TSV) depending on structural and material parameters based on 3D full wave simulation

2007 International Conference on Electronic Materials and Packaging, 2007, p.1-6

2007

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Modeling of Eye-Diagram Distortion and Data-Dependent Jitter in Meander Delay Lines on High-Speed Printed Circuit Boards (PCBs) Based on a Time-Domain Even-Mode and Odd-Mode Analysis

Suppression of Power/Ground Inductive Impedance and Simultaneous Switching Noise Using Silicon Through-Via in a 3-D Stacked Chip Package

High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)

High-Frequency Scalable Modeling and Analysis of a Differential Signal Through-Silicon Via

Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring

Modeling and Measurement of Power Supply Noise Effects on an Analog-to-Digital Converter Based on a Chip-PCB Hierarchical Power Distribution Network Analysis

PDN Impedance Modeling and Analysis of 3D TSV IC by Using Proposed P/G TSV Array Model Based on Separated P/G TSV and Chip-PDN Models

Through-Silicon-Via-Based Decoupling Capacitor Stacked Chip in 3-D-ICs

An On-Chip Electromagnetic Bandgap Structure using an On-Chip Inductor and a MOS Capacitor

Vertical Stepped Impedance EBG (VSI-EBG) Structure for Wideband Suppression of Simultaneous Switching Noise in Multilayer PCBs

Modeling and Analysis of a Power Distribution Network in TSV-Based 3-D Memory IC Including P/G TSVs, On-Chip Decoupling Capacitors, and Silicon Substrate Effects

Mixed-Mode ABCD Parameters: Theory and Application to Signal Integrity Analysis of PCB-Level Differential Interconnects

Modeling and measurement of simultaneous switching noise coupling through signal via transition

Co-modeling, Experimental Verification, and Analysis of Chip-Package Hierarchical Power Distribution Network

Protection of a delay-locked loop from simultaneous switching noise coupling using an on-chip electromagnetic bandgap structure

Analysis on Optimal Chip Floorplanning Considering Various Types of Decoupling Capacitors in Package PDN

Design space exploration (DSE) for over-136GB/s IO bandwidth with LPDDR5X SDRAM packages on SOC package in 200mm3

Experimental analysis and measurement of hotspot location with thermal test vehicle in mobile SOC

Multi-resolution method for thermal resistance matrix based on 2D Haar wavelet

Differential signal via shield with narrow via pitch partial electromagnetic bandgap structure

Band-Stop Filter Effect of Power/Ground Plane on Through-Hole Signal Via in Multilayer PCB

Slots on ground fillings of multi-layer printed circuit board for suppressing indirect crosstalk between digital clock line and RF signal line in mixed mode mobile systems

Modeling and Measurement of Radiated Field Emission From a Power/Ground Plane Cavity Edge Excited by a Through-Hole Signal Via Based on a Balanced TLM and Via Coupling Model

Power/ground noise immunity test in wireless and high-speed UWB communication system

Electrical characterization of trough silicon via (TSV) depending on structural and material parameters based on 3D full wave simulation

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