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Mechanism of electromigration-induced failure in the 97Pb–3Sn and 37Pb–63Sn composite solder joints

Journal of applied physics, 2003-12, Vol.94 (12), p.7560-7566

2003

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Anisotropic conductive adhesives with enhanced thermal conductivity for flip chip applications

Journal of electronic materials, 2005-08, Vol.34 (8), p.1165-1171

2005

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Electromigration in flip chip solder bump of 97Pb–3Sn/37Pb–63Sn combination structure

Acta materialia, 2004-01, Vol.52 (1), p.129-136

2004

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Effects of epoxy functionality on the properties and reliability of the anisotropic conductive films for flip chips on organic substrates

Journal of electronic materials, 2006-09, Vol.35 (9), p.1722-1727

2006

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Effects of thermoplastic resin content of anisotropic conductive films on the pressure cooker test reliability of anisotropic conductive film flip-chip assembly

Journal of electronic materials, 2005-11, Vol.34 (11), p.1455-1461

2005

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PRMT1 Is the Predominant Type I Protein Arginine Methyltransferase in Mammalian Cells

The Journal of biological chemistry, 2000-03, Vol.275 (11), p.7723-7730

2000

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Effect of Mo substitution by W on high temperature embrittlement characteristics in duplex stainless steels

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 1998-06, Vol.247 (1), p.67-74

1998

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Comparison of theoretical predictions and experimental values of the dielectric constant of epoxy/BaTiO3 composite embedded capacitor films

Journal of materials science. Materials in electronics, 2005-02, Vol.16 (2), p.77-84

2005

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Effect of enzymic methylation of heterogeneous ribonucleoprotein particle A1 on its nucleic-acid binding and controlled proteolysis

Biochemical journal, 1994-12, Vol.304 ( Pt 3) (3), p.903-909

1994

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Effects of thermoplastic resin content of anisotropic conductive films on the pressure cooker test reliability of anisotropic conductive film flip-chip assembly

Journal of electronic materials, 2006-01, Vol.35 (1), p.189-189

2006

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Experimental investigation of thermal characteristics for a microchannel heat sink subject to an impinging jet, using a micro-thermal sensor array

Sensors and actuators. A. Physical., 2003-07, Vol.105 (2), p.211-224

2003

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Effects of silica filler and diluent on material properties and reliability of nonconductive pastes (NCPs) for flip-chip applications

IEEE transactions on components and packaging technologies, 2004-09, Vol.27 (3), p.608-615

2004

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Purification and molecular identification of two protein methylases I from calf brain. Myelin basic protein- and histone-specific enzyme

The Journal of biological chemistry, 1988-12, Vol.263 (35), p.19024-19033

1988

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Pb-free Sn/3.5Ag wafer-bumping process and UBM (under bump metallurgy) study

Microsystem technologies : sensors, actuators, systems integration, 2002, Vol.7 (5-6), p.269-272

2002

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Effects of bonding temperature on the properties and reliabilities of anisotropic conductive films (ACFs) for flip chip on organic substrate application

Microelectronics and reliability, 2008-02, Vol.48 (2), p.293-299

2008

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A study on interfacial reactions between electroless Ni-P under bump metallization and 95.5Sn-4.0Ag-0.5Cu alloy

Journal of electronic materials, 2003-06, Vol.32 (6), p.548-557

2003

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Adsorption of self-assembling sulfur compounds through electrochemical reactions : Effects of potential, acid and oxidizing agents

Physical chemistry chemical physics : PCCP, 2001, Vol.3 (16), p.3405-3410

2001

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Enzymatic methylation of recombinant heterogeneous nuclear RNP protein A1. Dual substrate specificity for S-adenosylmethionine:histone-arginine N-methyltransferase

The Journal of biological chemistry, 1994-01, Vol.269 (2), p.1075-1082

1994

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Grain Morphology of Intermetallic Compounds at Solder Joints

Journal of materials research, 2002-03, Vol.17 (3), p.597-599

2002

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Influence of rhenium on the microstructures and mechanical properties of a mechanically alloyed oxide dispersion-strengthened nickel-base superalloy

Journal of materials science, 1998-07, Vol.33 (13), p.3361-3370

1998

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Purification and characterization of S-adenosylmethionine-protein-arginine N-methyltransferase from rat liver

Biochemical journal, 1994-06, Vol.300 (2), p.483-489

1994

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Recent advances in protein methylation: enzymatic methylation of nucleic acid binding proteins

Amino acids, 1998-01, Vol.15 (4), p.291-306

1998

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Experimental Analysis of Mechanical and Electrical Characteristics of Metal-Coated Conductive Spheres for Anisotropic Conductive Adhesives (ACAs) Interconnection

IEEE transactions on components and packaging technologies, 2006-09, Vol.29 (3), p.528-534

2006

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Mechanism of the mercury beating heart: An experimental study of the electrochemical-mechanical oscillator

Electrochimica acta, 1996-01, Vol.41 (18), p.2829-2836

1996

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Studies of electroless nickel under bump metallurgy-solder interfacial reactions and their effects on flip chip solder joint reliability

Journal of electronic materials, 2002-05, Vol.31 (5), p.520-528

2002

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Mechanism of electromigration-induced failure in the 97Pb–3Sn and 37Pb–63Sn composite solder joints

Anisotropic conductive adhesives with enhanced thermal conductivity for flip chip applications

Electromigration in flip chip solder bump of 97Pb–3Sn/37Pb–63Sn combination structure

Effects of epoxy functionality on the properties and reliability of the anisotropic conductive films for flip chips on organic substrates

Effects of thermoplastic resin content of anisotropic conductive films on the pressure cooker test reliability of anisotropic conductive film flip-chip assembly

PRMT1 Is the Predominant Type I Protein Arginine Methyltransferase in Mammalian Cells

Effect of Mo substitution by W on high temperature embrittlement characteristics in duplex stainless steels

Comparison of theoretical predictions and experimental values of the dielectric constant of epoxy/BaTiO3 composite embedded capacitor films

Effect of enzymic methylation of heterogeneous ribonucleoprotein particle A1 on its nucleic-acid binding and controlled proteolysis

Effects of thermoplastic resin content of anisotropic conductive films on the pressure cooker test reliability of anisotropic conductive film flip-chip assembly

Experimental investigation of thermal characteristics for a microchannel heat sink subject to an impinging jet, using a micro-thermal sensor array

Effects of silica filler and diluent on material properties and reliability of nonconductive pastes (NCPs) for flip-chip applications

Purification and molecular identification of two protein methylases I from calf brain. Myelin basic protein- and histone-specific enzyme

Pb-free Sn/3.5Ag wafer-bumping process and UBM (under bump metallurgy) study

Effects of bonding temperature on the properties and reliabilities of anisotropic conductive films (ACFs) for flip chip on organic substrate application

A study on interfacial reactions between electroless Ni-P under bump metallization and 95.5Sn-4.0Ag-0.5Cu alloy

Adsorption of self-assembling sulfur compounds through electrochemical reactions : Effects of potential, acid and oxidizing agents

Enzymatic methylation of recombinant heterogeneous nuclear RNP protein A1. Dual substrate specificity for S-adenosylmethionine:histone-arginine N-methyltransferase

Grain Morphology of Intermetallic Compounds at Solder Joints

Influence of rhenium on the microstructures and mechanical properties of a mechanically alloyed oxide dispersion-strengthened nickel-base superalloy

Purification and characterization of S-adenosylmethionine-protein-arginine N-methyltransferase from rat liver

Recent advances in protein methylation: enzymatic methylation of nucleic acid binding proteins

Experimental Analysis of Mechanical and Electrical Characteristics of Metal-Coated Conductive Spheres for Anisotropic Conductive Adhesives (ACAs) Interconnection

Mechanism of the mercury beating heart: An experimental study of the electrochemical-mechanical oscillator

Studies of electroless nickel under bump metallurgy-solder interfacial reactions and their effects on flip chip solder joint reliability

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