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Psychosocial and psychophysical assessment in paediatric patients and young adults with chronic back pain: A cluster analysis

European journal of pain, 2022-04, Vol.26 (4), p.855-872

2022

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Design and development of a 3D scanning MEMS OCT probe using a novel SiOB package assembly

Journal of micromechanics and microengineering, 2008-12, Vol.18 (12), p.125005-125005 (8)

2008

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Enzymatic Synthesis of Fluorescent Naphthol-Based Polymers

Macromolecules, 1996-09, Vol.29 (20), p.6452-6460

1996

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Platinum microheater integrated silicon optical bench assembly for endoscopic optical coherence tomography

Journal of micromechanics and microengineering, 2010-01, Vol.20 (1), p.015008-015008 (8)

2010

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Reliability challenges for 2.5D/3D integration: An overview

2018 IEEE International Reliability Physics Symposium (IRPS), 2018, p.5B.4-1-5B.4-5

2018

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Development of a Cu/Low- k Stack Die Fine Pitch Ball Grid Array (FBGA) Package for System in Package Applications

IEEE transactions on components, packaging, and manufacturing technology (2011), 2011-03, Vol.1 (3), p.299-309

2011

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A Comprehensive Wafer Level Reliability Study on 65nm Silicon Interposer

2019 IEEE International Reliability Physics Symposium (IRPS), 2019, p.1-8

2019

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Role of tumor-derived transforming growth factor-β1 (TGF-β1) in site-dependent tumorigenicity of murine ascitic lymphosarcoma

Cancer Immunology, Immunotherapy, 2005-09, Vol.54 (9), p.837-847

2005

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Monte Carlo simulation studies of sidewall roughening during reactive ion etching

Applied physics. A, Materials science & processing, 2007-08, Vol.88 (2), p.401-407

2007

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Efficient Bidirectional protection structure for Plasma induced damage (PID) and Electrostatic discharge (ESD) for 3D IC Integration

2020 IEEE International Reliability Physics Symposium (IRPS), 2020, p.1-5

2020

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Therapeutic treatment with L-arginine rescues mice from heat stroke-induced death : Physiological and molecular mechanisms

Shock (Augusta, Ga.), 2005-10, Vol.24 (4), p.341-347

2005

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A standard reference material for the measurement of particle mobility by electrophoretic light scattering

Colloids and surfaces. A, Physicochemical and engineering aspects, 1995-05, Vol.98 (3), p.209-224

1995

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Mechanistic understanding of silicon nitride dispersion using cationic and anionic polyelectrolytes

Powder technology, 1994-04, Vol.79 (1), p.43-52

1994

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Novel stress-free Keep Out Zone process development for via middle TSV in 20nm planar CMOS technology

IEEE International Interconnect Technology Conference, 2014, p.203-206

2014

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Electrokinetic behaviour and dispersion characteristics of ceramic powders with cationic and anionic polyelectrolytes

Bulletin of materials science, 1994-11, Vol.17 (6), p.911-920

1994

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Impact of 3D Via Middle TSV Process on 20nm Wafer Level FEOL and BEOL Reliability

2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016, p.1593-1598

2016

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Fabrication and Testing of a Wafer-Level Vacuum Package for MEMS Device

IEEE transactions on advanced packaging, 2009-05, Vol.32 (2), p.486-490

2009

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Removal of fish bones from the throat

Emergency medicine journal : EMJ, 1995-12, Vol.12 (4), p.303-303

1995

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Interaction of gold-related and irradiation-induced defects in silicon

Journal of applied physics, 1991-06, Vol.69 (12), p.8205-8209

1991

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Development of a Disposable Bio-Microfluidic Package With Reagents Self-Contained Reservoirs and Micro-Valves for a DNA Lab-on-a-Chip (LOC) Application

IEEE transactions on advanced packaging, 2009-05, Vol.32 (2), p.528-535

2009

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Relationship of the gold related donor and acceptor levels in silicon

Journal of applied physics, 1991-02, Vol.69 (4), p.2714-2716

1991

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Design and Development of Fine Pitch Copper/Low-K Wafer Level Package

IEEE transactions on advanced packaging, 2010-05, Vol.33 (2), p.377-388

2010

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Cardiopulmonary arrest in general wards: a retrospective study of referral patterns to an intensive care facility and their influence on outcome

Emergency medicine journal : EMJ, 1997-01, Vol.14 (1), p.26-29

1997

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Chip Package Interaction(CPI) risk assessment on 28nm Back End of Line(BEOL) stack of a large I/O chip using compact 3D FEA modeling

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 2013, p.93-97

2013

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The Use of ELISA to Monitor Amplified Hemolysis by the Combined Action of Osmotic Stress and Radiation: Potential Applications

Radiation research, 2005-03, Vol.163 (3), p.351-355

2005

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Psychosocial and psychophysical assessment in paediatric patients and young adults with chronic back pain: A cluster analysis

Design and development of a 3D scanning MEMS OCT probe using a novel SiOB package assembly

Enzymatic Synthesis of Fluorescent Naphthol-Based Polymers

Platinum microheater integrated silicon optical bench assembly for endoscopic optical coherence tomography

Reliability challenges for 2.5D/3D integration: An overview

Development of a Cu/Low- k Stack Die Fine Pitch Ball Grid Array (FBGA) Package for System in Package Applications

A Comprehensive Wafer Level Reliability Study on 65nm Silicon Interposer

Role of tumor-derived transforming growth factor-β1 (TGF-β1) in site-dependent tumorigenicity of murine ascitic lymphosarcoma

Monte Carlo simulation studies of sidewall roughening during reactive ion etching

Efficient Bidirectional protection structure for Plasma induced damage (PID) and Electrostatic discharge (ESD) for 3D IC Integration

Therapeutic treatment with L-arginine rescues mice from heat stroke-induced death : Physiological and molecular mechanisms

A standard reference material for the measurement of particle mobility by electrophoretic light scattering

Mechanistic understanding of silicon nitride dispersion using cationic and anionic polyelectrolytes

Novel stress-free Keep Out Zone process development for via middle TSV in 20nm planar CMOS technology

Electrokinetic behaviour and dispersion characteristics of ceramic powders with cationic and anionic polyelectrolytes

Impact of 3D Via Middle TSV Process on 20nm Wafer Level FEOL and BEOL Reliability

Fabrication and Testing of a Wafer-Level Vacuum Package for MEMS Device

Removal of fish bones from the throat

Interaction of gold-related and irradiation-induced defects in silicon

Development of a Disposable Bio-Microfluidic Package With Reagents Self-Contained Reservoirs and Micro-Valves for a DNA Lab-on-a-Chip (LOC) Application

Relationship of the gold related donor and acceptor levels in silicon

Design and Development of Fine Pitch Copper/Low-K Wafer Level Package

Cardiopulmonary arrest in general wards: a retrospective study of referral patterns to an intensive care facility and their influence on outcome

Chip Package Interaction(CPI) risk assessment on 28nm Back End of Line(BEOL) stack of a large I/O chip using compact 3D FEA modeling

The Use of ELISA to Monitor Amplified Hemolysis by the Combined Action of Osmotic Stress and Radiation: Potential Applications

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