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Short-Circuit Study in Medium-Voltage GaN Cascodes, p-GaN HEMTs, and GaN MISHEMTs

IEEE transactions on industrial electronics (1982), 2017-11, Vol.64 (11), p.9012-9022

2017

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Gate Oxide Degradation of SiC MOSFET in Switching Conditions

IEEE electron device letters, 2014-12, Vol.35 (12), p.1284-1286

2014

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Die-Level Transient Thermal Imaging Based on Fourier Series Reconstruction for Power Industrial Electronics

IEEE transactions on instrumentation and measurement, 2023, Vol.72, p.1-11

2023

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Measurement Uncertainty in Fourier Coefficient- Based Time Series Reconstruction Considering Calibration Effects in Thermal Imaging

IEEE transactions on instrumentation and measurement, 2024, Vol.73, p.1-11

2024

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Thermomechanical Assessment of Die-Attach Materials for Wide Bandgap Semiconductor Devices and Harsh Environment Applications

IEEE transactions on power electronics, 2014-05, Vol.29 (5), p.2261-2271

2014

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Physics-based Strategies for Fast TDDB Testing and Lifetime Estimation in SiC Power MOSFETs

IEEE transactions on industrial electronics (1982), 2024-05, Vol.71 (5), p.1-10

2024

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BPF-Based Thermal Sensor Circuit for On-Chip Testing of RF Circuits

Sensors (Basel, Switzerland), 2021-01, Vol.21 (3), p.805

2021

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Thermal Management Strategies for Low- and High-Voltage Retrofit LED Lamp Drivers

IEEE transactions on power electronics, 2019-04, Vol.34 (4), p.3677-3688

2019

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Thermal Analysis of LED Lamps for Optimal Driver Integration

IEEE transactions on power electronics, 2015-07, Vol.30 (7), p.3876-3891

2015

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Output Power and Gain Monitoring in RF CMOS Class A Power Amplifiers by Thermal Imaging

IEEE transactions on instrumentation and measurement, 2019-08, Vol.68 (8), p.2861-2870

2019

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Single-MOSFET DC thermal sensor for RF-amplifier central frequency extraction

Sensors and actuators. A. Physical., 2017-09, Vol.264, p.157-164

2017

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MOSFET dynamic thermal sensor for IC testing applications

Sensors and actuators. A. Physical., 2016-05, Vol.242, p.195-202

2016

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Direct Visualization of Anti‐Ferroelectric Switching Dynamics via Electrocaloric Imaging

Advanced electronic materials, 2021-12, Vol.7 (12), p.n/a

2021

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Layout Role in Failure Physics of IGBTs Under Overloading Clamped Inductive Turnoff

IEEE transactions on electron devices, 2013-02, Vol.60 (2), p.598-605

2013

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Analysis of Clamped Inductive Turnoff Failure in Railway Traction IGBT Power Modules Under Overload Conditions

IEEE transactions on industrial electronics (1982), 2011-07, Vol.58 (7), p.2706-2714

2011

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Local non invasive study of SiC diodes with abnormal electrical behavior

Solid-state electronics, 2015-11, Vol.113, p.35-41

2015

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A Survey of Wide Bandgap Power Semiconductor Devices

IEEE transactions on power electronics, 2014-05, Vol.29 (5), p.2155-2163

2014

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Steady-state sinusoidal thermal characterization at chip level by internal infrared-laser deflection

Journal of physics. D, Applied physics, 2008-08, Vol.41 (15), p.155508-155508 (7)

2008

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Reduced-Order Thermal Behavioral Model Based on Diffusive Representation

IEEE transactions on power electronics, 2009-12, Vol.24 (12), p.2833-2846

2009

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Location of hot spots in integrated circuits by monitoring the substrate thermal-phase lag with the mirage effect

Optics letters, 2010-08, Vol.35 (15), p.2657

2010

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Characterization of MOSFET Temperature Sensors for On-chip Dynamic Thermal Measurements

Procedia engineering, 2015, Vol.120, p.836-839

2015

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Power Losses and Current Distribution Studies by Infrared Thermal Imaging in Soft- and Hard-Switched IGBTs Under Resonant Load

IEEE transactions on power electronics, 2020-05, Vol.35 (5), p.5221-5237

2020

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Local Thermal Resistance Extraction in Monolithic Microwave Integrated Circuits

IEEE transactions on industrial electronics (1982), 2021-12, Vol.68 (12), p.1-1

2021

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Solid-State Relay Solutions for Induction Cooking Applications Based on Advanced Power Semiconductor Devices

IEEE transactions on industrial electronics (1982), 2019-03, Vol.66 (3), p.1832-1841

2019

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Direct Visualization of Anti‐Ferroelectric Switching Dynamics via Electrocaloric Imaging

Advanced electronic materials, 2024-01, Vol.10 (1), p.n/a

2024

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Short-Circuit Study in Medium-Voltage GaN Cascodes, p-GaN HEMTs, and GaN MISHEMTs

Gate Oxide Degradation of SiC MOSFET in Switching Conditions

Die-Level Transient Thermal Imaging Based on Fourier Series Reconstruction for Power Industrial Electronics

Measurement Uncertainty in Fourier Coefficient- Based Time Series Reconstruction Considering Calibration Effects in Thermal Imaging

Thermomechanical Assessment of Die-Attach Materials for Wide Bandgap Semiconductor Devices and Harsh Environment Applications

Physics-based Strategies for Fast TDDB Testing and Lifetime Estimation in SiC Power MOSFETs

BPF-Based Thermal Sensor Circuit for On-Chip Testing of RF Circuits

Thermal Management Strategies for Low- and High-Voltage Retrofit LED Lamp Drivers

Thermal Analysis of LED Lamps for Optimal Driver Integration

Output Power and Gain Monitoring in RF CMOS Class A Power Amplifiers by Thermal Imaging

Single-MOSFET DC thermal sensor for RF-amplifier central frequency extraction

MOSFET dynamic thermal sensor for IC testing applications

Direct Visualization of Anti‐Ferroelectric Switching Dynamics via Electrocaloric Imaging

Layout Role in Failure Physics of IGBTs Under Overloading Clamped Inductive Turnoff

Analysis of Clamped Inductive Turnoff Failure in Railway Traction IGBT Power Modules Under Overload Conditions

Local non invasive study of SiC diodes with abnormal electrical behavior

A Survey of Wide Bandgap Power Semiconductor Devices

Steady-state sinusoidal thermal characterization at chip level by internal infrared-laser deflection

Reduced-Order Thermal Behavioral Model Based on Diffusive Representation

Location of hot spots in integrated circuits by monitoring the substrate thermal-phase lag with the mirage effect

Characterization of MOSFET Temperature Sensors for On-chip Dynamic Thermal Measurements

Power Losses and Current Distribution Studies by Infrared Thermal Imaging in Soft- and Hard-Switched IGBTs Under Resonant Load

Local Thermal Resistance Extraction in Monolithic Microwave Integrated Circuits

Solid-State Relay Solutions for Induction Cooking Applications Based on Advanced Power Semiconductor Devices

Direct Visualization of Anti‐Ferroelectric Switching Dynamics via Electrocaloric Imaging

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