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Analysis of encapsulation process in 3D stacked chips with different microbump array

International communications in heat and mass transfer, 2012-12, Vol.39 (10), p.1616-1623

2012

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Effects of Aspect Ratio in Moulded Packaging Considering Fluid/Structure Interaction: A CFD Modelling Approach

Journal of applied fluid mechanics, 2017-11, Vol.10 (6), p.1799-1811

2017

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Insights into sweep efficiency using 4D seismic at Halfdan Field in the North Sea

Leading edge (Tulsa, Okla.), 2014-02, Vol.33 (2), p.182-187

2014

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FSI implications of EMC rheological properties to 3D IC with TSV structures during plastic encapsulation process

Microelectronics and reliability, 2013-04, Vol.53 (4), p.600-611

2013

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C-Reactive Protein (CRP) levels in influenza and other respiratory viral infections

International journal of infectious diseases, 2020-12, Vol.101, p.518-519

2020

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Performance of WHO and CDC influenza-like illness (ILI) case definitions in detecting influenza in the tropics

International journal of infectious diseases, 2020-12, Vol.101, p.370-371

2020

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Determinants of antibiotic prescribing for upper respiratory tract infections in an emergency department with good primary care access: a qualitative analysis

Epidemiology and infection, 2019-01, Vol.147, p.e111, Article e111

2019

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Fluid–structure interaction analysis on the effect of chip stacking in a 3D integrated circuit package with through-silicon vias during plastic encapsulation

Microelectronic engineering, 2014-01, Vol.113, p.40-49

2014

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Halfdan 4D workflow and results leading to increased recovery

Leading edge (Tulsa, Okla.), 2016-10, Vol.35 (10), p.840-848

2016

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Development of an integrated CAD–FEA process for below-knee prosthetic sockets

Clinical biomechanics (Bristol), 2005-07, Vol.20 (6), p.623-629

2005

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Study on the Fluid–Structure Interaction at Different Layout of Stacked Chip in Molded Packaging

Arabian journal for science and engineering (2011), 2017-11, Vol.42 (11), p.4743-4757

2017

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Numerical Modeling and Analysis of Microbump Pitch Effect in 3D IC Package with TSV During Molded Underfill (MUF)

Engineering applications of computational fluid mechanics, 2013, Vol.7 (2), p.210-222

2013

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Continuous supercritical carbon dioxide processing of palm oil

Journal of the American Oil Chemists' Society, 1996-02, Vol.73 (2), p.233-237

1996

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Recovery of carotenoids from palm oil

Journal of the American Oil Chemists' Society, 1994-04, Vol.71 (4), p.423-426

1994

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Steady and unsteady thermal analysis of a triple stack cold plate with heat losses

International journal of numerical methods for heat & fluid flow, 2005-01, Vol.15 (1), p.96-112

2005

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Penile strangulation: report of two unusual cases

Singapore medical journal, 2009-02, Vol.50 (2), p.e50-e52

2009

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Recovered oil from palm-pressed fiber: a good source of natural carotenoids, vitamin E, and sterols

Journal of the American Oil Chemists' Society, 1996-05, Vol.73 (5), p.599-602

1996

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FSI Analysis of the Effect of Aspect Ratio of Stacked Chip in Encapsulation Process of Moulded Underfill Packaging

Applied Mechanics and Materials, 2015-08, Vol.786 (Trends and Applications in Mechanical Engineering), p.361-366

2015

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Fluid―structure interaction analysis on the effect of chip stacking in a 3D integrated circuit package with through-silicon vias during plastic encapsulation

Microelectronic engineering, 2013, Vol.113, p.40-49

2013

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The Little India riot: experience of an emergency department in Singapore

Singapore medical journal, 2015-12, Vol.56 (12), p.677-680

2015

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Over pad metallization for high temperature interconnections

2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2011, p.1496-1501

2011

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Electroless over pad metallization for high temperature interconnections

2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT), 2010, p.1-7

2010

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Effect of stacking chips and fluid/structure interaction simulation in 3D stacked flip-chip encapsulation process

2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012, p.127-132

2012

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Fast transient solutions for heat transfer [FEM]

TENCON 2003. Conference on Convergent Technologies for Asia-Pacific Region, 2003, Vol.1, p.469-473 Vol.1

2003

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Pushing the limits of CMOS optical parametric amplifiers with USRN:Si7N3 above the two-photon absorption edge

Nature communications, 2017-01, Vol.8 (1), p.13878-13878, Article 13878

2017

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Analysis of encapsulation process in 3D stacked chips with different microbump array

Effects of Aspect Ratio in Moulded Packaging Considering Fluid/Structure Interaction: A CFD Modelling Approach

Insights into sweep efficiency using 4D seismic at Halfdan Field in the North Sea

FSI implications of EMC rheological properties to 3D IC with TSV structures during plastic encapsulation process

C-Reactive Protein (CRP) levels in influenza and other respiratory viral infections

Performance of WHO and CDC influenza-like illness (ILI) case definitions in detecting influenza in the tropics

Determinants of antibiotic prescribing for upper respiratory tract infections in an emergency department with good primary care access: a qualitative analysis

Fluid–structure interaction analysis on the effect of chip stacking in a 3D integrated circuit package with through-silicon vias during plastic encapsulation

Halfdan 4D workflow and results leading to increased recovery

Development of an integrated CAD–FEA process for below-knee prosthetic sockets

Study on the Fluid–Structure Interaction at Different Layout of Stacked Chip in Molded Packaging

Numerical Modeling and Analysis of Microbump Pitch Effect in 3D IC Package with TSV During Molded Underfill (MUF)

Continuous supercritical carbon dioxide processing of palm oil

Recovery of carotenoids from palm oil

Steady and unsteady thermal analysis of a triple stack cold plate with heat losses

Penile strangulation: report of two unusual cases

Recovered oil from palm-pressed fiber: a good source of natural carotenoids, vitamin E, and sterols

FSI Analysis of the Effect of Aspect Ratio of Stacked Chip in Encapsulation Process of Moulded Underfill Packaging

Fluid―structure interaction analysis on the effect of chip stacking in a 3D integrated circuit package with through-silicon vias during plastic encapsulation

The Little India riot: experience of an emergency department in Singapore

Over pad metallization for high temperature interconnections

Electroless over pad metallization for high temperature interconnections

Effect of stacking chips and fluid/structure interaction simulation in 3D stacked flip-chip encapsulation process

Fast transient solutions for heat transfer [FEM]

Pushing the limits of CMOS optical parametric amplifiers with USRN:Si7N3 above the two-photon absorption edge

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