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Advanced soft fail characterization methodology for sub-28nm nanoscale SRAM yield improvement

25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014), 2014, p.351-356

2014

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TetraMax Diagnosis and Laker Software on Failure Analysis For ATPG/Scan Failures

2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2006, p.217-221

2006

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Failure analysis approach For TrenchMOS devices

Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 2013, p.190-195

2013

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Phase and microstructure analysis by electron diffraction in semiconductor failure analysis

2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2012, p.1-4

2012

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A SEM Based Technique To Detect Pin-holes In As-Deposited/As-Grown Dielectrics

2006 IEEE International Conference on Semiconductor Electronics, 2006, p.713-716

2006

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A Study of Sulphur Assisted Corrosion in Technologies with Copper Interconnects

2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2006, p.183-186

2006

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Electrochemical wet etching in KOH:H20 solution and secondary/ion image passive voltage contrast as a complementary technique in failure analysis

Microelectronics and reliability, 2000-08, Vol.40 (8-10), p.1455-1459

2000

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Direct insight to SRAM array devices in advanced FinFET nodes by large scale ultra-fast in-situ characterization

2019 IEEE 11th International Memory Workshop (IMW), 2019, p.1-4

2019

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A new fluorescent and Photoemission Microscope for submicron VLSI IC failure analysis

ICONIP '02. Proceedings of the 9th International Conference on Neural Information Processing. Computational Intelligence for the E-Age (IEEE Cat. No.02EX575), 2002, p.27-32

2002

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Step like degradation profile of electromigration of W-plug contact

Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247), 1999, p.44-46

1999

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Copper corrosion issue and analysis on copper damascene process

IEEE transactions on device and materials reliability, 2005-06, Vol.5 (2), p.206-211

2005

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A study of defects causing yield loss in copper backend process due to the power shorts

Proceedings of the 12th International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005, 2005, p.271-274

2005

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Application of Auger electron spectroscopy (AES), TEM electron energy loss spectrum (EELS) in failure analysis on poly grooves issue in wafer fabrication

2004 IEEE International Conference on Semiconductor Electronics, 2004, p.5 pp.

2004

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Advanced soft fail characterization methodology for sub-28nm nanoscale SRAM yield improvement

TetraMax Diagnosis and Laker Software on Failure Analysis For ATPG/Scan Failures

Failure analysis approach For TrenchMOS devices

Phase and microstructure analysis by electron diffraction in semiconductor failure analysis

A SEM Based Technique To Detect Pin-holes In As-Deposited/As-Grown Dielectrics

A Study of Sulphur Assisted Corrosion in Technologies with Copper Interconnects

Electrochemical wet etching in KOH:H20 solution and secondary/ion image passive voltage contrast as a complementary technique in failure analysis

Direct insight to SRAM array devices in advanced FinFET nodes by large scale ultra-fast in-situ characterization

A new fluorescent and Photoemission Microscope for submicron VLSI IC failure analysis

Step like degradation profile of electromigration of W-plug contact

Copper corrosion issue and analysis on copper damascene process

A study of defects causing yield loss in copper backend process due to the power shorts

Application of Auger electron spectroscopy (AES), TEM electron energy loss spectrum (EELS) in failure analysis on poly grooves issue in wafer fabrication

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