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A multicellular spheroid formation and extraction chip using removable cell trapping barriers

Lab on a chip, 2011-01, Vol.11 (1), p.115-119

2011

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Air-breathing miniature planar stack using the flexible printed circuit board as a current collector

International journal of hydrogen energy, 2009, Vol.34 (1), p.459-466

2009

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Electrical Properties of Horizontal Array Capacitor Using Composite Organic Dielectric Layer of Impregnated Glass-Fiber Epoxy

Advances in polymer technology, 2020, Vol.2020 (2020), p.1-8

2020

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Studies on inkjet-printed conducting lines for electronic devices

Journal of electronic materials, 2007-09, Vol.36 (9), p.1211-1218

2007

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Bismuth-zinc-niobate embedded capacitors grown at room temperature for printed circuit board applications

Applied physics letters, 2006-05, Vol.88 (19)

2006

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Synthesis and barrier properties of poly(vinylidene chloride-co-acrylonitrile)/SiO2 hybrid composites by sol–gel process

Journal of membrane science, 2009-12, Vol.345 (1-2), p.90-96

2009

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Environmentally friendly synthesis of organic-soluble silver nanoparticles for printed electronics

Nanotechnology, 2007-08, Vol.18 (33), p.335601-335601 (5)

2007

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MEMS-based micro-fuel processor for application in a cell phone

Journal of power sources, 2006-11, Vol.162 (1), p.572-578

2006

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Gold Nanostructures Formed in Ionic Clusters of Perfluorinated Ionomer

Macromolecular rapid communications., 2006-09, Vol.27 (17), p.1483-1488

2006

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Direct synthesis and bonding origins of monolayer-protected silver nanocrystals from silver nitrate through in situ ligand exchange

Journal of colloid and interface science, 2006-12, Vol.304 (1), p.92-97

2006

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Solvent-assisted graphite loading for highly conductive phenolic resin bipolar plates for proton exchange membrane fuel cells

Journal of power sources, 2010-06, Vol.195 (12), p.3794-3801

2010

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A multi-step electrochemical etching process for a three-dimensional micro probe array

Journal of micromechanics and microengineering, 2011-01, Vol.21 (1), p.015019

2011

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Atomic-Layer-Deposited Dielectric Thin Films on a Cu Clad Laminate Substrate for Embedded Metal–Insulator–Metal Capacitor Applications in Printed Circuit Boards

Journal of the Electrochemical Society, 2011, Vol.158 (1), p.G1

2011

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Tunable surface hardness and dielectric constant of SiC x O y thin film converted from solution-processed organosilicon compound

Journal of materials science, 2012-06, Vol.47 (11), p.4540-4545

2012

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Realization of a high capacitance density in Bi2Mg2∕3Nb4∕3O7 pyrochlore thin films deposited directly on polymer substrates for embedded capacitor applications

Applied physics letters, 2006-12, Vol.89 (23)

2006

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Fabrication of Poly(3-hexylthiophene) Thin Films by Vapor-Phase Polymerization for Optoelectronic Device Applications

ACS applied materials & interfaces, 2009-07, Vol.1 (7), p.1567-1571

2009

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MEMS Based Metal Plated Silicon Package for High Power LED

Key engineering materials, 2006-12, Vol.326-328, p.309-312

2006

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Fabrication of a Touch Sensor for Flat Panel Displays Using Poly(3,4-ethylenedioxythiophene):Poly(styrene sulfonate) with Dimethylsulfoxide by Soft Lithography

Japanese Journal of Applied Physics, 2012-09, Vol.51 (9), p.096501-096501-4

2012

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Sintering and Consolidation of Silver Nanoparticles Printed on Polyimide Substrate Films

Macromolecular Research, 2009, 17(8), , pp.568-574

2009

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Composition-dependent curing behavior and peel strength of epoxy resins for printed circuit boards (PCBs)

Macromolecular Research, 2010, 18(1), , pp.47-52

2010

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Development of a 3D Motion Sensor Module

2006 5th IEEE Conference on Sensors, 2006, p.666-670

2006

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Thermal transformation of solvent-processable organosilicon compounds into inorganic silicone-based thin films

Journal of materials chemistry, 2011-01, Vol.21 (9), p.325-329

2011

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Development of embedded capacitor with bismuth-based pyrochlore thin films at low temperatures for printed circuit board applications

Microelectronics and reliability, 2007-04, Vol.47 (4), p.755-758

2007

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A monolithic inkjet print head: DomeJet

Sensors and actuators. A, Physical, 2002-01, Vol.95 (2), p.114-119

2002

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Failure mechanisms in thermal inkjet printhead analyzed by experiments and numerical simulation

Microelectronics and reliability, 2005-03, Vol.45 (3), p.473-478

2005

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A multicellular spheroid formation and extraction chip using removable cell trapping barriers

Air-breathing miniature planar stack using the flexible printed circuit board as a current collector

Electrical Properties of Horizontal Array Capacitor Using Composite Organic Dielectric Layer of Impregnated Glass-Fiber Epoxy

Studies on inkjet-printed conducting lines for electronic devices

Bismuth-zinc-niobate embedded capacitors grown at room temperature for printed circuit board applications

Synthesis and barrier properties of poly(vinylidene chloride-co-acrylonitrile)/SiO2 hybrid composites by sol–gel process

Environmentally friendly synthesis of organic-soluble silver nanoparticles for printed electronics

MEMS-based micro-fuel processor for application in a cell phone

Gold Nanostructures Formed in Ionic Clusters of Perfluorinated Ionomer

Direct synthesis and bonding origins of monolayer-protected silver nanocrystals from silver nitrate through in situ ligand exchange

Solvent-assisted graphite loading for highly conductive phenolic resin bipolar plates for proton exchange membrane fuel cells

A multi-step electrochemical etching process for a three-dimensional micro probe array

Atomic-Layer-Deposited Dielectric Thin Films on a Cu Clad Laminate Substrate for Embedded Metal–Insulator–Metal Capacitor Applications in Printed Circuit Boards

Tunable surface hardness and dielectric constant of SiC x O y thin film converted from solution-processed organosilicon compound

Realization of a high capacitance density in Bi2Mg2∕3Nb4∕3O7 pyrochlore thin films deposited directly on polymer substrates for embedded capacitor applications

Fabrication of Poly(3-hexylthiophene) Thin Films by Vapor-Phase Polymerization for Optoelectronic Device Applications

MEMS Based Metal Plated Silicon Package for High Power LED

Fabrication of a Touch Sensor for Flat Panel Displays Using Poly(3,4-ethylenedioxythiophene):Poly(styrene sulfonate) with Dimethylsulfoxide by Soft Lithography

Sintering and Consolidation of Silver Nanoparticles Printed on Polyimide Substrate Films

Composition-dependent curing behavior and peel strength of epoxy resins for printed circuit boards (PCBs)

Development of a 3D Motion Sensor Module

Thermal transformation of solvent-processable organosilicon compounds into inorganic silicone-based thin films

Development of embedded capacitor with bismuth-based pyrochlore thin films at low temperatures for printed circuit board applications

A monolithic inkjet print head: DomeJet

Failure mechanisms in thermal inkjet printhead analyzed by experiments and numerical simulation

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