UB Paderborn / Katalog / Suche / in CDI

Sortiert nach

Einfacher Volltextzugriff von (fast) überall

Installieren Sie die LibKey Nomad-Browsererweiterung und erhalten Sie von vielen Webseiten einfachen Zugriff auf lizenzierte Volltexte oder Open Access Publikationen. Mehr erfahren...

Low-Temperature Sinterable Cu@Ag Paste with Superior Strength Driven by Pre-Heating Process

Energies (Basel), 2023-07, Vol.16 (14), p.5419

2023

Volltextzugriff (PDF)

Pressureless Silver Sintering of Silicon-Carbide Power Modules for Electric Vehicles

JOM (1989), 2020-02, Vol.72 (2), p.889-897

2020

Volltextzugriff (PDF)

Nano-volcanic Eruption of Silver

Scientific reports, 2016-10, Vol.6 (1), p.34769-34769, Article 34769

2016

Volltextzugriff (PDF)

Silver Sintered Joint Property Between Silicon Carbide Device and Ceramic Substrate for Electric Vehicle Power Module

Journal of electronic materials, 2019-01, Vol.48 (1), p.122-134

2019

Volltextzugriff (PDF)

Hillock growth dynamics for Ag stress migration bonding

Materials letters, 2014-12, Vol.137, p.170-173

2014

Volltextzugriff (PDF)

Effect of oxygen on pressureless silver sintering in a nitrogen atmosphere

Journal of materials science. Materials in electronics, 2020, Vol.31 (1), p.488-494

2020

Volltextzugriff (PDF)

Non-resonant lasing in a deep-hole scattering cavity

Optics express, 2022-12, Vol.30 (26), p.47816-47825

2022

Volltextzugriff (PDF)

Copper electrochemical migration growth in an air HAST

Microelectronics and reliability, 2019-09, Vol.100-101, p.113394, Article 113394

2019

Volltextzugriff (PDF)

Underfill material property dependence of lifetime and mechanical behavior of BGA package: EBSD and FEM investigations

Microelectronics and reliability, 2023-11, Vol.150, p.115113, Article 115113

2023

Volltextzugriff (PDF)

Lifetime Prediction of Electrochemical Ion Migration with Various Surface Finishes of Printed Circuit Boards

Journal of electronic materials, 2020, Vol.49 (1), p.48-58

2020

Volltextzugriff (PDF)

Pressureless wafer bonding by turning hillocks into abnormal grain growths in Ag films

Applied physics letters, 2014-04, Vol.104 (16)

2014

Volltextzugriff (PDF)

Silver stress migration bonding driven by thermomechanical stress with various substrates

Journal of materials science. Materials in electronics, 2015-04, Vol.26 (4), p.2525-2530

2015

Volltextzugriff (PDF)

Development of solderable layer on power MOSFET for double-side bonding

Microelectronics and reliability, 2022-02, Vol.129, p.114482, Article 114482

2022

Volltextzugriff (PDF)

Pressureless Bonding Using Sputtered Ag Thin Films

Journal of electronic materials, 2014-12, Vol.43 (12), p.4406-4412

2014

Volltextzugriff (PDF)

Low-Pressure Silver Sintering of Automobile Power Modules with a Silicon-Carbide Device and an Active-Metal-Brazed Substrate

Journal of electronic materials, 2020, Vol.49 (1), p.188-195

2020

Volltextzugriff (PDF)

Reflection and durability study of different types of backsheets and their impact on c-Si PV module performance

Solar energy materials and solar cells, 2016-03, Vol.146, p.91-98

2016

Volltextzugriff (PDF)

Pressureless Ag Thin-Film Die-Attach for SiC Devices

Materials science forum, 2015-06, Vol.821-823, p.919-922

2015

Volltextzugriff (PDF)

Al and Si Alloying Effect on Solder Joint Reliability in Sn-0.5Cu for Automotive Electronics

Journal of electronic materials, 2016-12, Vol.45 (12), p.6150-6162

2016

Volltextzugriff (PDF)

Bonding copper ribbons on crystalline photovoltaic modules using various lead-free solders

Journal of materials science. Materials in electronics, 2015-12, Vol.26 (12), p.9721-9726

2015

Volltextzugriff (PDF)

Pressureless Bonding Using Sputtered Ag Thin Films : Pb-FREE SOLDERS AND MATERIALS FOR EMERGING INTERCONNECT AND PACKAGING TECHNOLOGIES

Journal of electronic materials, 2014, Vol.43 (12), p.4406-4412

2014

Volltextzugriff (PDF)

Diffusional hillock growth in Ag stress migration bonding for power device interconnections

2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, p.1128-1133

2015

Volltextzugriff (PDF)

Stress Analysis for Bendable Electronic Module Under Thermal-Hygroscopic Complex Loads

Taehan Kigye Hakhoe nonmunjip. A, 2013-05, Vol.37 (5), p.619-624

2013

Volltextzugriff (PDF)

Creep lifetime prediction of solder joint for heat sink assembly

Microelectronics and reliability, 2010-09, Vol.50 (9), p.1645-1649

2010

Volltextzugriff (PDF)

Thermal Cycle Reliability of BGA Package With Board-Level Underfill Materials

2024 International Conference on Electronics Packaging (ICEP), 2024, p.1-2

2024

Volltextzugriff (PDF)

Degradation of Backsheets for Crystalline Photovoltaic Modules under Damp Heat Test

New & Renewable Energy, 2016-09, Vol.12 (3), p.36-43

2016

Volltextzugriff (PDF)

1 – 25 von 77

Suche als RSS-Feed

Suchergebnisse filtern

Filter anzeigen

Nur zeigen

Geprüft (Peer-Review)
(54)
Mit Volltextzugriff
(62)

Publikationsform

Sprache

Englisch
(77)

Erscheinungsjahr

n.n

Thema

Science & Technology
(52)
Technology
(37)
Physical Sciences
(32)
Physics
(28)
Materials Science
(26)
Physics, Applied
(26)
Engineering
(25)
Engineering, Electrical & Electronic
(20)
Materials Science, Multidisciplinary
(19)
Science & Technology - Other Topics
(14)
Nanoscience & Nanotechnology
(11)
Silver
(11)
Characterization And Evaluation Of Materials
(10)
Chemistry And Materials Science
(10)
Optical And Electronic Materials
(10)
Exact Sciences And Technology
(9)
Life Sciences & Biomedicine
(9)
Bonding Strength
(8)
Chemistry
(7)
Applied Sciences
(6)

15 weitere anzeigen...

Weniger anzeigen...

Neu hinzugefügt

... seit 30 Tagen
(1)

Menü

Weitere Dienste

Einstellungen

Low-Temperature Sinterable Cu@Ag Paste with Superior Strength Driven by Pre-Heating Process

Pressureless Silver Sintering of Silicon-Carbide Power Modules for Electric Vehicles

Nano-volcanic Eruption of Silver

Silver Sintered Joint Property Between Silicon Carbide Device and Ceramic Substrate for Electric Vehicle Power Module

Hillock growth dynamics for Ag stress migration bonding

Effect of oxygen on pressureless silver sintering in a nitrogen atmosphere

Non-resonant lasing in a deep-hole scattering cavity

Copper electrochemical migration growth in an air HAST

Underfill material property dependence of lifetime and mechanical behavior of BGA package: EBSD and FEM investigations

Lifetime Prediction of Electrochemical Ion Migration with Various Surface Finishes of Printed Circuit Boards

Pressureless wafer bonding by turning hillocks into abnormal grain growths in Ag films

Silver stress migration bonding driven by thermomechanical stress with various substrates

Development of solderable layer on power MOSFET for double-side bonding

Pressureless Bonding Using Sputtered Ag Thin Films

Low-Pressure Silver Sintering of Automobile Power Modules with a Silicon-Carbide Device and an Active-Metal-Brazed Substrate

Reflection and durability study of different types of backsheets and their impact on c-Si PV module performance

Pressureless Ag Thin-Film Die-Attach for SiC Devices

Al and Si Alloying Effect on Solder Joint Reliability in Sn-0.5Cu for Automotive Electronics

Bonding copper ribbons on crystalline photovoltaic modules using various lead-free solders

Pressureless Bonding Using Sputtered Ag Thin Films : Pb-FREE SOLDERS AND MATERIALS FOR EMERGING INTERCONNECT AND PACKAGING TECHNOLOGIES

Diffusional hillock growth in Ag stress migration bonding for power device interconnections

Stress Analysis for Bendable Electronic Module Under Thermal-Hygroscopic Complex Loads

Creep lifetime prediction of solder joint for heat sink assembly

Thermal Cycle Reliability of BGA Package With Board-Level Underfill Materials

Degradation of Backsheets for Crystalline Photovoltaic Modules under Damp Heat Test

Suchergebnisse filtern