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Friction characteristics of mechanically microtextured metal surface in dry sliding

Tribology international, 2020-09, Vol.149, p.105634, Article 105634

2020

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Chemo-mechanical grinding by applying grain boundary cohesion fixed abrasive for monocrystal sapphire

Precision engineering, 2021-07, Vol.70, p.110-116

2021

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Investigation of nanoscratch anisotropy of C-plane sapphire wafer using friction force microscope

Precision engineering, 2022-01, Vol.73, p.51-62

2022

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Study on the potential of chemo-mechanical-grinding (CMG) process of sapphire wafer

International journal of advanced manufacturing technology, 2017-07, Vol.91 (5-8), p.1539-1546

2017

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顕微Raman断層イメージングによる電子材料・セラミックス材料研削加工面の品質検査技術

精密工学会誌, 2022/07/05, Vol.88(7), pp.551-555

小貫, 哲平

2022

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Practical Method for Identifying Model Parameters for Machining Error Simulation in End Milling Through Sensor-Less Monitoring and On-Machine Measurement

International journal of automation technology, 2024-05, Vol.18 (3), p.342-351

2024

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Abrasive wear damages observation in engineering ceramics using micro-Raman tomography

Journal of Advanced Mechanical Design, Systems, and Manufacturing, 2023, Vol.17(1), pp.JAMDSM0009-JAMDSM0009

2023

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Autonomous optimization of cutting conditions in end milling operation based on deep reinforcement learning (Offline training in simulation environment for feed rate optimization)

Journal of advanced mechanical design, systems, and manufacturing, 2023-01, Vol.17 (5), p.JAMDSM0064-JAMDSM0064, Article 2023jamdsm0064

2023

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Study on the finishing capability and abrasives-sapphire interaction in dry chemo-mechanical-grinding (CMG) process

Precision engineering, 2018-04, Vol.52, p.451-457

2018

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Dry sliding characteristics of metal surfaces with periodic arrangement of dimple-like patterns textured by vibration-assisted cutting

Journal of the Japan Society for Abrasive Technology, 2023/04/01, Vol.67(4), pp.218-223

2023

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Theoretical analysis on effects of grain size variation

Precision engineering, 2017-10, Vol.50, p.27-31

2017

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Material removal mechanism in rotary in-feed grinding - Modeling and analysis

Journal of Advanced Mechanical Design, Systems, and Manufacturing, 2020, Vol.14(6), pp.JAMDSM0095-JAMDSM0095

2020

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Analysis of Nanoscratch Mechanism of C-Plane Sapphire with the Aid of Molecular Dynamics Simulation of Hcp Crystal

Nanomaterials (Basel, Switzerland), 2021-07, Vol.11 (7), p.1739

2021

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Modeling of chemical reaction in molecular dynamics simulation of chemical mechanical polishing of silicon wafer

Journal of the Japan Society for Abrasive Technology, 2023/08/01, Vol.67(8), pp.452-457

2023

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Improving an electret transducer by fully utilizing the implanted charge

Applied physics letters, 2008-09, Vol.93 (12), p.122901-122901-3

2008

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Development and characterization of binder-free abrasive pellet for CMG grinding wheel

Journal of the Japan Society for Abrasive Technology, 2021/12/01, Vol.65(12), pp.671-675

2021

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The advantages and potential of electret-based vibration-driven micro energy harvesters

International journal of energy research, 2009-10, Vol.33 (13), p.1180-1190

2009

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Process study on large-size silicon wafer grinding by using a small-diameter wheel

Journal of Advanced Mechanical Design, Systems, and Manufacturing, 2015, Vol.9(5), pp.JAMDSM0073-JAMDSM0073

2015

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Modeling of Process Mechanisms in Pulsed Laser Micro Machining on Lithium Niobate Substrates

International journal of automation technology, 2014-11, Vol.8 (6), p.896-902

2014

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Development of Microtextured Photocatalytic Surface by Vibration-Assisted Scratching

Materials science forum, 2014-05, Vol.783-786, p.1488-1493

2014

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Multichannel Photonic Crystal Wavelength Filter Array for Near-Infrared Wavelengths

Journal of lightwave technology, 2007-02, Vol.25 (2), p.499-503

2007

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Molecular Dynamics Simulation of a Cutting Method by Making Use of Localized Hydrostatic Pressure

Advanced Materials Research, 2016-01, Vol.1136, p.156-161

2016

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Study on Grinding Processing of Sapphire Wafer

Advanced materials research, 2012-09, Vol.565, p.22-27

2012

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Influence of Surface Integrity in Silicon Wafer Thickness Measurements by Reflection Spectroscopy

Advanced materials research, 2014-09, Vol.1017, p.681-685

2014

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Development and implementation of real-time anomaly detection on tool wear based on stacked LSTM encoder-decoder model

International journal of advanced manufacturing technology, 2023-07, Vol.127 (1-2), p.263-278

2023

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Friction characteristics of mechanically microtextured metal surface in dry sliding

Chemo-mechanical grinding by applying grain boundary cohesion fixed abrasive for monocrystal sapphire

Investigation of nanoscratch anisotropy of C-plane sapphire wafer using friction force microscope

Study on the potential of chemo-mechanical-grinding (CMG) process of sapphire wafer

顕微Raman断層イメージングによる電子材料・セラミックス材料研削加工面の品質検査技術

Practical Method for Identifying Model Parameters for Machining Error Simulation in End Milling Through Sensor-Less Monitoring and On-Machine Measurement

Abrasive wear damages observation in engineering ceramics using micro-Raman tomography

Autonomous optimization of cutting conditions in end milling operation based on deep reinforcement learning (Offline training in simulation environment for feed rate optimization)

Study on the finishing capability and abrasives-sapphire interaction in dry chemo-mechanical-grinding (CMG) process

Dry sliding characteristics of metal surfaces with periodic arrangement of dimple-like patterns textured by vibration-assisted cutting

Theoretical analysis on effects of grain size variation

Material removal mechanism in rotary in-feed grinding - Modeling and analysis

Analysis of Nanoscratch Mechanism of C-Plane Sapphire with the Aid of Molecular Dynamics Simulation of Hcp Crystal

Modeling of chemical reaction in molecular dynamics simulation of chemical mechanical polishing of silicon wafer

Improving an electret transducer by fully utilizing the implanted charge

Development and characterization of binder-free abrasive pellet for CMG grinding wheel

The advantages and potential of electret-based vibration-driven micro energy harvesters

Process study on large-size silicon wafer grinding by using a small-diameter wheel

Modeling of Process Mechanisms in Pulsed Laser Micro Machining on Lithium Niobate Substrates

Development of Microtextured Photocatalytic Surface by Vibration-Assisted Scratching

Multichannel Photonic Crystal Wavelength Filter Array for Near-Infrared Wavelengths

Molecular Dynamics Simulation of a Cutting Method by Making Use of Localized Hydrostatic Pressure

Study on Grinding Processing of Sapphire Wafer

Influence of Surface Integrity in Silicon Wafer Thickness Measurements by Reflection Spectroscopy

Development and implementation of real-time anomaly detection on tool wear based on stacked LSTM encoder-decoder model

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