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Compression force–depth relationship during out-of-hospital cardiopulmonary resuscitation

Resuscitation, 2007-03, Vol.72 (3), p.364-370

2007

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Utilizing Characteristic Electrical Properties of the Epidermal Skin Layers to Detect Fake Fingers in Biometric Fingerprint Systems-A Pilot Study

IEEE transactions on biomedical engineering, 2007-05, Vol.54 (5), p.891-894

2007

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Novel methods to determine pediatric anterior-posterior thoracic force-deflection characteristics

Journal of biomechanics, 2006, Vol.39, p.S157-S157

2006

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A 500-dpi AC capacitive hybrid flip-chip CMOS ASIC/sensor module for fingerprint, navigation, and pointer detection with on-chip data processing

IEEE journal of solid-state circuits, 2003-12, Vol.38 (12), p.2288-2296

2003

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Manikins With Human-Like Chest PropertiesaA New Tool for Chest Compression Research

IEEE transactions on biomedical engineering, 2008-01, Vol.55 (11)

2008

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Utilizing Characteristic Electrical Properties of the Epidermal Skin Layers to Detect Fake Fingers in Biometric Fingerprint SystemsaA Pilot Study

IEEE transactions on biomedical engineering, 2007-01, Vol.54 (5)

2007

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Capacitive differential pressure sensor for harsh environments

Sensors and actuators. A. Physical., 2000-05, Vol.83 (1), p.30-33

2000

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Measurement of package-induced stress and thermal zero shift in transfer molded silicon piezoresistive pressure sensors

Journal of micromechanics and microengineering, 1998-06, Vol.8 (2), p.168-171

1998

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Structures for piezoresistive measurement of package induced stress in transfer molded silicon pressure sensors

Microelectronics and reliability, 1998-06, Vol.38 (6), p.1271-1276

1998

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Thermal cycling lifetime of flip chip on board circuits with solder bumps and isotropically conductive adhesive joints

IEEE transactions on advanced packaging, 2000-11, Vol.23 (4), p.743-749

2000

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Examining the potential of using thorax impedance measured by automated external defibrillators for quantification of circulation

Computers in Cardiology, 2005, 2005, p.809-812

2005

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A capacitive hybrid flip-chip ASIC and sensor for fingerprint, navigation and pointer detection

2003 IEEE International Solid-State Circuits Conference, 2003. Digest of Technical Papers. ISSCC, 2003, p.214-489 vol.1

2003

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Measurements of solder bump lifetime as a function of underfill material properties

IEEE transactions on components, packaging, and manufacturing technology. Part A, 1998-06, Vol.21 (2), p.281-287

1998

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Isotropically conductive adhesives and solder bumps for flip chip on board circuits-a comparison of lifetime under thermal cycling

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180), 1998, p.125-131

1998

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Energy assessments of onboard CO2 capture from ship engines by MEA-based post combustion capture system with flue gas heat integration

International journal of greenhouse gas control, 2022-01, Vol.113, p.103526, Article 103526

2022

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Measurements of solder bump lifetime as a function of underfill material properties

Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268), 1997, p.307-314

1997

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Worldwide implementation of the WHO Child Growth Standards

Public health nutrition, 2012-09, Vol.15 (9), p.1603-1610

2012

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Enrolment and baseline characteristics in the WHO Multicentre Growth Reference Study

Acta pædiatrica (Oslo, Norway : 1992). Supplement, 2006-04, Vol.450, p.7-15

WHO Multicentre Growth Reference Study Group

2006

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Ordovician palaeogeography with new palaeomagnetic data from the Montagne Noire (Southern France)

Earth and planetary science letters, 2002-10, Vol.203 (1), p.329-341

2002

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Development of intraformational (Oligocene–Miocene) faults in the northern North Sea: influence of remote stresses and doming of Fennoscandia

Journal of structural geology, 1999-10, Vol.21 (10), p.1457-1475

1999

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Compression force–depth relationship during out-of-hospital cardiopulmonary resuscitation

Utilizing Characteristic Electrical Properties of the Epidermal Skin Layers to Detect Fake Fingers in Biometric Fingerprint Systems-A Pilot Study

Novel methods to determine pediatric anterior-posterior thoracic force-deflection characteristics

A 500-dpi AC capacitive hybrid flip-chip CMOS ASIC/sensor module for fingerprint, navigation, and pointer detection with on-chip data processing

Manikins With Human-Like Chest PropertiesaA New Tool for Chest Compression Research

Utilizing Characteristic Electrical Properties of the Epidermal Skin Layers to Detect Fake Fingers in Biometric Fingerprint SystemsaA Pilot Study

Capacitive differential pressure sensor for harsh environments

Measurement of package-induced stress and thermal zero shift in transfer molded silicon piezoresistive pressure sensors

Structures for piezoresistive measurement of package induced stress in transfer molded silicon pressure sensors

Thermal cycling lifetime of flip chip on board circuits with solder bumps and isotropically conductive adhesive joints

Examining the potential of using thorax impedance measured by automated external defibrillators for quantification of circulation

A capacitive hybrid flip-chip ASIC and sensor for fingerprint, navigation and pointer detection

Measurements of solder bump lifetime as a function of underfill material properties

Isotropically conductive adhesives and solder bumps for flip chip on board circuits-a comparison of lifetime under thermal cycling

Energy assessments of onboard CO2 capture from ship engines by MEA-based post combustion capture system with flue gas heat integration

Measurements of solder bump lifetime as a function of underfill material properties

Worldwide implementation of the WHO Child Growth Standards

Enrolment and baseline characteristics in the WHO Multicentre Growth Reference Study

Ordovician palaeogeography with new palaeomagnetic data from the Montagne Noire (Southern France)

Development of intraformational (Oligocene–Miocene) faults in the northern North Sea: influence of remote stresses and doming of Fennoscandia

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