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Laser-induced breakdown spectroscopy for the quantitative analysis of metals in sediments using natural zeolite matrix

Spectrochimica acta. Part B: Atomic spectroscopy, 2017-10, Vol.136, p.1-7

2017

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Stability of fluorinated parylenes to oxygen reactive-ion etching under aluminum, aluminum oxide, and tantalum nitride overlayers

Journal of electronic materials, 2003-09, Vol.32 (9), p.925-931

2003

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Co-implantation of carbon and nitrogen into silicon dioxide for synthesis of carbon nitride materials

Nuclear instruments & methods in physics research. Section B, Beam interactions with materials and atoms, 2002-11, Vol.196 (1), p.75-80

2002

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Chemical Vapor Deposition of ZnS:Mn for Thin-Film Electroluminescent Display Applications

Journal of materials research, 2004-03, Vol.19 (3), p.697-706

2004

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Cu-metal interfacial interactions during metal organic chemical vapour deposition

Thin solid films, 1995-06, Vol.262 (1), p.224-233

1995

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Effects of atomic hydrogen on Cu(II)bishexafluoroacetylacetonate interactions with a TiN surface

Applied surface science, 1994-10, Vol.81 (2), p.237-249

1994

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Metalorganic chemical vapor deposition of titanium oxide for microelectronics applications

Journal of materials research, 2001-06, Vol.16 (6), p.1838-1849

2001

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The Effects of Processing Parameters in the Chemical Vapor Deposition of Cobalt from Cobalt Tricarbonyl Nitrosyl

Journal of the Electrochemical Society, 1999-06, Vol.146 (6), p.2139-2145

1999

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Interlayer Mediated Epitaxy of Cobalt Silicide on Silicon (100) from Low Temperature Chemical Vapor Deposition of Cobalt Formation Mechanisms and Associated Properties

Journal of the Electrochemical Society, 2001, Vol.148 (1), p.C21

2001

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Atomic hydrogen cleaning of a TiN surface

Applied surface science, 1994, Vol.74 (1), p.115-120

1994

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Low-temperature metalorganic chemical vapor deposition of Al2O3 for advanced complementary metal-oxide semiconductor gate dielectric applications

Journal of materials research, 2003-08, Vol.18 (8), p.1868-1876

2003

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Low-temperature chemical vapor deposition of tantalum nitride from tantalum pentabromide for integrated circuitry copper metallization applications

Journal of materials research, 1999-05, Vol.14 (5), p.2043-2052

1999

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LOW-TEMPERATURE METALLORGANIC CHEMICAL VAPOUR DEPOSITION OF Al2O3 FOR ADVANCED COMPLEMENTARY METAL-OXIDE SEMICONDUCTOR GATE DIELECTRIC APPLICATIONS

Journal of materials research, 2003-01, Vol.18 (8), p.1868-1876

2003

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Surface Effects in the Mocvd of Copper

MRS proceedings, 1994, Vol.337, Article 177

1994

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METALLORGANIC CHEMICAL VAPOUR DEPOSITION OF TITANIUM OXIDE FOR MICROELECTRONICS APPLICATIONS

Journal of materials research, 2001-01, Vol.16 (6), p.1838-1849

2001

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Copper-metal interfacial interactions during metal organic chemical vapour deposition

Thin solid films, 1995-06, Vol.262 (1-2), p.224-233

1995

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Cu-metal interfacial interactions during metal organic chemical vapour deposition: Copper-based metallizationand interconnects for ultra-large-scale integration applications

Thin solid films, 1995, Vol.262 (1-2), p.224-233

1995

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Low Temperature Metal Organic Chemical Vapor Deposition of Aluminum Oxide Thin Films for Advanced CMOS Gate Dielectric Applications

MRS proceedings, 2002, Vol.716, Article B4.11

2002

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Effects of atomic hydrogen on Cu(II)bishexafluoroacetylcetonate interactions with a TiN surface

Applied surface science, 1994, Vol.81 (2), p.237-249

1994

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LOW-TEMPERATURE CHEMICAL VAPOUR DEPOSITION OF TANTALUM NITRIDE FROM TANTALUM PENTABROMIDE FOR INTEGRATED CIRCUITRY COPPER METALLISATION APPLICATIONS

Journal of materials research, 1999-01, Vol.14 (5), p.2043-2052

1999

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Development of TiSiN diffusion barriers for Cu/SiLK metallization schemes

Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407), 2000, p.40-42

2000

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Low temperature metal-organic chemical vapor deposition of tungsten nitride as diffusion barrier for copper metallization

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 1999-05, Vol.17 (3), p.1101-1104

1999

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Low temperature metalorganic chemical vapor deposition of conformal silver coatings for applications in high aspect ratio structures

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 2001-03, Vol.19 (2), p.585-588

2001

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Integration of chemical vapor deposition Al interconnects in a benzocyclobutene low dielectric constant polymer matrix: A feasibility study

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 2000-09, Vol.18 (5), p.2463-2471

2000

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Electropolymerized-molecularly imprinted polymers (E-MIPS) as sensing elements for the detection of dengue infection

Analytical and bioanalytical chemistry, 2022, Vol.414 (3), p.1347-1357

2022

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Laser-induced breakdown spectroscopy for the quantitative analysis of metals in sediments using natural zeolite matrix

Stability of fluorinated parylenes to oxygen reactive-ion etching under aluminum, aluminum oxide, and tantalum nitride overlayers

Co-implantation of carbon and nitrogen into silicon dioxide for synthesis of carbon nitride materials

Chemical Vapor Deposition of ZnS:Mn for Thin-Film Electroluminescent Display Applications

Cu-metal interfacial interactions during metal organic chemical vapour deposition

Effects of atomic hydrogen on Cu(II)bishexafluoroacetylacetonate interactions with a TiN surface

Metalorganic chemical vapor deposition of titanium oxide for microelectronics applications

The Effects of Processing Parameters in the Chemical Vapor Deposition of Cobalt from Cobalt Tricarbonyl Nitrosyl

Interlayer Mediated Epitaxy of Cobalt Silicide on Silicon (100) from Low Temperature Chemical Vapor Deposition of Cobalt Formation Mechanisms and Associated Properties

Atomic hydrogen cleaning of a TiN surface

Low-temperature metalorganic chemical vapor deposition of Al2O3 for advanced complementary metal-oxide semiconductor gate dielectric applications

Low-temperature chemical vapor deposition of tantalum nitride from tantalum pentabromide for integrated circuitry copper metallization applications

LOW-TEMPERATURE METALLORGANIC CHEMICAL VAPOUR DEPOSITION OF Al2O3 FOR ADVANCED COMPLEMENTARY METAL-OXIDE SEMICONDUCTOR GATE DIELECTRIC APPLICATIONS

Surface Effects in the Mocvd of Copper

METALLORGANIC CHEMICAL VAPOUR DEPOSITION OF TITANIUM OXIDE FOR MICROELECTRONICS APPLICATIONS

Copper-metal interfacial interactions during metal organic chemical vapour deposition

Cu-metal interfacial interactions during metal organic chemical vapour deposition: Copper-based metallizationand interconnects for ultra-large-scale integration applications

Low Temperature Metal Organic Chemical Vapor Deposition of Aluminum Oxide Thin Films for Advanced CMOS Gate Dielectric Applications

Effects of atomic hydrogen on Cu(II)bishexafluoroacetylcetonate interactions with a TiN surface

LOW-TEMPERATURE CHEMICAL VAPOUR DEPOSITION OF TANTALUM NITRIDE FROM TANTALUM PENTABROMIDE FOR INTEGRATED CIRCUITRY COPPER METALLISATION APPLICATIONS

Development of TiSiN diffusion barriers for Cu/SiLK metallization schemes

Low temperature metal-organic chemical vapor deposition of tungsten nitride as diffusion barrier for copper metallization

Low temperature metalorganic chemical vapor deposition of conformal silver coatings for applications in high aspect ratio structures

Integration of chemical vapor deposition Al interconnects in a benzocyclobutene low dielectric constant polymer matrix: A feasibility study

Electropolymerized-molecularly imprinted polymers (E-MIPS) as sensing elements for the detection of dengue infection

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