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IEEE transactions on electromagnetic compatibility, 2000-02, Vol.42 (1), p.29-38
2000

IEEE transactions on electromagnetic compatibility, 2000-08, Vol.42 (3), p.265-275
2000



IEEE transactions on electromagnetic compatibility, 2001-08, Vol.43 (3), p.295-304
2001


IEEE transactions on electromagnetic compatibility, 2000-02, Vol.42 (1), p.71-76
2000

IEEE transactions on electromagnetic compatibility, 2000-05, Vol.42 (2), p.135-141
2000


IEEE transactions on components and packaging technologies, 2000-03, Vol.23 (1), p.136-142
2000

IEEE 1997, EMC, Austin Style. IEEE 1997 International Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.97CH36113), 1997, p.66-71
1997

IEEE 1997, EMC, Austin Style. IEEE 1997 International Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.97CH36113), 1997, p.177-182
1997

IEEE transactions on electromagnetic compatibility, 2000, Vol.42 (3), p.265-275
2000
Link zum Volltext

1998 IEEE EMC Symposium. International Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.98CH36253), 1998, Vol.2, p.1041-1046 vol.2
1998

1999 IEEE International Symposium on Electromagnetic Compatability. Symposium Record (Cat. No.99CH36261), 1999, Vol.1, p.355-360 vol.1
1999

IEEE 1997, EMC, Austin Style. IEEE 1997 International Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.97CH36113), 1997, p.165-170
1997

An impact of layer stack-up on EMI
1998 IEEE EMC Symposium. International Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.98CH36253), 1998, Vol.2, p.828-833 vol.2
1998

IEEE 1997, EMC, Austin Style. IEEE 1997 International Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.97CH36113), 1997, p.183-187
1997

IEEE 1997, EMC, Austin Style. IEEE 1997 International Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.97CH36113), 1997, p.171-176
1997

1996 Proceedings Electrical Overstress/Electrostatic Discharge Symposium, 1996, p.211-222
1996




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