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Cu6Sn5 crystal growth mechanisms during solidification of electronic interconnections

Acta materialia, 2017-03, Vol.126, p.540-551

2017

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Critical properties of Cu6Sn5 in electronic devices: Recent progress and a review

Current opinion in solid state & materials science, 2016-04, Vol.20 (2), p.55-76

2016

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Rapid Cu6Sn5 growth at liquid Sn/solid Cu interfaces

Scripta materialia, 2015-04, Vol.100, p.17-20

2015

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Effects of Ni and TiO2 additions in as-reflowed and annealed Sn0.7Cu solders on Cu substrates

Journal of materials processing technology, 2017-04, Vol.242, p.235-245

2017

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The role of trace element segregation in the eutectic modification of hypoeutectic Al–Si alloys

Journal of alloys and compounds, 2010-01, Vol.489 (2), p.415-420

2010

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Eutectic modification and microstructure development in Al–Si Alloys

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2005-12, Vol.413, p.243-248

2005

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In situ imaging of microstructure formation in electronic interconnections

Scientific reports, 2017-01, Vol.7 (1), p.40010-40010, Article 40010

2017

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The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering

Materials & design, 2020-01, Vol.186, p.108281, Article 108281

2020

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Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates

JOM (1989), 2009-06, Vol.61 (6), p.45-51

2009

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In-situ observation of high-temperature Pb-free electric interconnections by synchrotron microradiography

Materials letters, 2021-05, Vol.291, p.129520, Article 129520

2021

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Granular deformation mechanisms in semi-solid alloys

Acta materialia, 2011-07, Vol.59 (12), p.4933-4943

2011

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Development of a microwave sintered TiO2 reinforced Sn–0.7wt%Cu–0.05wt%Ni alloy

Materials & design, 2015-10, Vol.82, p.136-147

2015

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In-situ synchrotron X-ray diffraction investigation of the hydriding and dehydriding properties of a cast Mg–Ni alloy

Journal of alloys and compounds, 2015-07, Vol.636, p.249-256

2015

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Effects of boron on microstructure in cast titanium alloys

Scripta materialia, 2008-09, Vol.59 (5), p.538-541

2008

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Investigating the mechanical properties, creep and crack pattern of Cu6Sn5 and (Cu,Ni)6Sn5 on diverse crystal planes

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2013-03, Vol.566, p.126-133

2013

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In situ studies revealing dendrite and eutectic growth during the solidification of Sn-0.7Cu-0.5Ag Pb-free solder alloy

Journal of alloys and compounds, 2019-08, Vol.797, p.804-810

2019

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Al8Mn5 Particle Settling and Interactions with Oxide Films in Liquid AZ91 Magnesium Alloys

JOM (1989), 2019-07, Vol.71 (7), p.2235-2244

2019

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Suppression of Cu6Sn5 in TiO2 reinforced solder joints after multiple reflow cycles

Materials & design, 2016-10, Vol.108, p.418-428

2016

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Effects of Surface Finish on Sn-3.0Ag-0.5Cu Solder Joint Microstructure and Strength

Journal of electronic materials, 2021-03, Vol.50 (3), p.855-868

2021

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The effect of Ni on the growth morphology of primary β-phase in an In-35 wt%Sn alloy

Journal of alloys and compounds, 2022-03, Vol.897, p.163172, Article 163172

2022

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Origin of Primary Cu6Sn5 in Hypoeutectic Solder Alloys and a Method of Suppression to Improve Mechanical Properties

Journal of electronic materials, 2021-03, Vol.50 (3), p.710-722

2021

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Microstructure and growth kinetic study in Sn–Cu transient liquid phase sintering solder paste

Journal of materials science. Materials in electronics, 2020-07, Vol.31 (14), p.11077-11094

2020

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In situ investigation of unidirectional solidification in Sn–0.7Cu and Sn–0.7Cu–0.06Ni

Acta materialia, 2011-06, Vol.59 (10), p.4043-4054

2011

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Effect of Ni on phase stability and thermal expansion of Cu6−xNixSn5 (X = 0, 0.5, 1, 1.5 and 2)

Intermetallics, 2012-07, Vol.26, p.78-85

2012

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Effects of immersion silver (ImAg) and immersion tin (ImSn) surface finish on the microstructure and joint strength of Sn-3.0Ag-0.5Cu solder

Journal of materials science. Materials in electronics, 2022-06, Vol.33 (17), p.14249-14263

2022

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Cu6Sn5 crystal growth mechanisms during solidification of electronic interconnections

Critical properties of Cu6Sn5 in electronic devices: Recent progress and a review

Rapid Cu6Sn5 growth at liquid Sn/solid Cu interfaces

Effects of Ni and TiO2 additions in as-reflowed and annealed Sn0.7Cu solders on Cu substrates

The role of trace element segregation in the eutectic modification of hypoeutectic Al–Si alloys

Eutectic modification and microstructure development in Al–Si Alloys

In situ imaging of microstructure formation in electronic interconnections

The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering

Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates

In-situ observation of high-temperature Pb-free electric interconnections by synchrotron microradiography

Granular deformation mechanisms in semi-solid alloys

Development of a microwave sintered TiO2 reinforced Sn–0.7wt%Cu–0.05wt%Ni alloy

In-situ synchrotron X-ray diffraction investigation of the hydriding and dehydriding properties of a cast Mg–Ni alloy

Effects of boron on microstructure in cast titanium alloys

Investigating the mechanical properties, creep and crack pattern of Cu6Sn5 and (Cu,Ni)6Sn5 on diverse crystal planes

In situ studies revealing dendrite and eutectic growth during the solidification of Sn-0.7Cu-0.5Ag Pb-free solder alloy

Al8Mn5 Particle Settling and Interactions with Oxide Films in Liquid AZ91 Magnesium Alloys

Suppression of Cu6Sn5 in TiO2 reinforced solder joints after multiple reflow cycles

Effects of Surface Finish on Sn-3.0Ag-0.5Cu Solder Joint Microstructure and Strength

The effect of Ni on the growth morphology of primary β-phase in an In-35 wt%Sn alloy

Origin of Primary Cu6Sn5 in Hypoeutectic Solder Alloys and a Method of Suppression to Improve Mechanical Properties

Microstructure and growth kinetic study in Sn–Cu transient liquid phase sintering solder paste

In situ investigation of unidirectional solidification in Sn–0.7Cu and Sn–0.7Cu–0.06Ni

Effect of Ni on phase stability and thermal expansion of Cu6−xNixSn5 (X = 0, 0.5, 1, 1.5 and 2)

Effects of immersion silver (ImAg) and immersion tin (ImSn) surface finish on the microstructure and joint strength of Sn-3.0Ag-0.5Cu solder

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