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1st ed. 2020., 2020
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Journal of electronic materials, 2019-01, Vol.48 (1), p.201-210
2019
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JOM (1989), 2007-07, Vol.59 (7), p.26-31
2007
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IEEE transactions on components, packaging, and manufacturing technology (2011), 2021-07, Vol.11 (7), p.1081-1087
2021
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Journal of electronic materials, 2019-01, Vol.48 (1), p.201-210
2019
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Journal of advanced joining processes, 2022-11, Vol.6, p.100126, Article 100126
2022
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International journal of damage mechanics, 2022-04, Vol.31 (4), p.582-604
2022
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Microelectronics and reliability, 2012, Vol.52 (1), p.180-189
2012
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IEEE transactions on components, packaging, and manufacturing technology (2011), 2017-10, Vol.7 (10), p.1729-1738
2017
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2012 28th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2012, p.348-353
2012
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2011 IEEE International Conference on Advanced Information Networking and Applications, 2011, p.264-269
2011
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Soldering & surface mount technology, 2005-09, Vol.17 (3), p.9-19
2005
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Microelectronics and reliability, 2009-03, Vol.49 (3), p.235-241
2009
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Soldering & surface mount technology, 1999-04, Vol.11 (1), p.13-20
1999
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2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2017, p.89-96
2017
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2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2017, p.70-76
2017
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2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2014, p.655-665
2014
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Soldering & surface mount technology, 1998-08, Vol.10 (2), p.26-35
1998
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2023 24th International Conference on Electronic Packaging Technology (ICEPT), 2023, p.1-4
2023
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2015 16th International Conference on Electronic Packaging Technology (ICEPT), 2015, p.387-395
2015
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2021 22nd International Conference on Electronic Packaging Technology (ICEPT), 2021, p.1-6
2021
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2015 16th International Conference on Electronic Packaging Technology (ICEPT), 2015, p.367-374
2015
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36th International Electronics Manufacturing Technology Conference, 2014, p.1-8
2014
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2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 2013, p.635-640
2013
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