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A Double-Side Cooled SiC MOSFET Power Module With Sintered-Silver Interposers: I-Design, Simulation, Fabrication, and Performance Characterization

IEEE transactions on power electronics, 2021-10, Vol.36 (10), p.11672-11680

2021

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Systematic Design of Coils in Series–Series Inductive Power Transfer for Power Transferability and Efficiency

IEEE transactions on power electronics, 2018-04, Vol.33 (4), p.3333-3345

2018

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New Core Loss Measurement Method for High-Frequency Magnetic Materials

IEEE transactions on power electronics, 2014-08, Vol.29 (8), p.4374-4381

2014

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Series-Resonator Buck Converter-Viability Demonstration

IEEE transactions on power electronics, 2021-09, Vol.36 (9), p.9693-9697

2021

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Balancing of Peak Currents Between Paralleled SiC MOSFETs by Drive-Source Resistors and Coupled Power-Source Inductors

IEEE transactions on industrial electronics (1982), 2017-10, Vol.64 (10), p.8334-8343

2017

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A Fast Method to Optimize Efficiency and Stray Magnetic Field for Inductive-Power-Transfer Coils Using Lumped-Loops Model

IEEE transactions on power electronics, 2018-04, Vol.33 (4), p.3065-3075

2018

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Analytical Calculation of Proximity-Effect Resistance for Planar Coil With Litz Wire and Ferrite Plate in Inductive Power Transfer

IEEE transactions on industry applications, 2019-05, Vol.55 (3), p.2984-2991

2019

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Circuit Modeling of the Mechanical-Motion Rectifier for Electrical Simulation of Ocean Wave Power Takeoff

IEEE transactions on industrial electronics (1982), 2021-04, Vol.68 (4), p.3262-3272

2021

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New Way of Generating Electromagnetic Waves

IEEE transactions on antennas and propagation, 2021-10, Vol.69 (10), p.6383-6390

2021

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Characterization of a Nonlinear Resistive Polymer-Nanoparticle Composite Coating for Electric Field Reduction in a Medium-Voltage Power Module

IEEE transactions on power electronics, 2022-03, Vol.37 (3), p.2475-2479

2022

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Omnicoupled Inductors (OCI) Applied in a Resonant Cross-Commutated Buck Converter

IEEE transactions on industrial electronics (1982), 2021-06, Vol.68 (6), p.4894-4902

2021

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Synthesis of DC-DC Converters From Voltage Conversion Ratio and Prescribed Requirements

IEEE transactions on power electronics, 2021-12, Vol.36 (12), p.13889-13902

2021

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Circuit Models and Fast Optimization of Litz Shield for Inductive-Power-Transfer Coils

IEEE transactions on power electronics, 2019-05, Vol.34 (5), p.4678-4688

2019

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Design Methodology of a One-Turn Inductor With Significant DC and AC Fluxes-Demonstration in a Resonant Cross-Commutated Buck Converter

IEEE transactions on industrial electronics (1982), 2019-11, Vol.66 (11), p.8424-8433

2019

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Transient Core-Loss Simulation for Ferrites With Nonuniform Field in SPICE

IEEE transactions on power electronics, 2019-01, Vol.34 (1), p.659-667

2019

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Passive Balancing of Peak Currents Between Paralleled MOSFETs With Unequal Threshold Voltages

IEEE transactions on power electronics, 2017-05, Vol.32 (5), p.3273-3277

2017

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Packaging of a 10-kV Double-Side Cooled Silicon Carbide Diode Module With Thin Substrates Coated by a Nonlinear Resistive Polymer-Nanoparticle Composite

IEEE transactions on power electronics, 2022-12, Vol.37 (12), p.14462-14470

2022

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Steady-State Analysis of Series-Resonator Buck Converter

IEEE transactions on power electronics, 2022-10, Vol.37 (10), p.12327-12335

2022

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Two-Dimensional Mapping of Interface Thermal Resistance by Transient Thermal Measurement

IEEE transactions on industrial electronics (1982), 2021-05, Vol.68 (5), p.4448-4456

2021

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Low Parasitic-Inductance Packaging of a 650 V/150 A Half-Bridge Module Using Enhancement-Mode Gallium-Nitride High Electron Mobility Transistors

IEEE transactions on industrial electronics (1982), 2023-01, Vol.70 (1), p.344-351

2023

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A 1200-V, 60-A SiC MOSFET Multichip Phase-Leg Module for High-Temperature, High-Frequency Applications

IEEE transactions on power electronics, 2014-05, Vol.29 (5), p.2307-2320

2014

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A Novel High-Temperature Planar Package for SiC Multichip Phase-Leg Power Module

IEEE transactions on power electronics, 2010-08, Vol.25 (8), p.2059-2067

2010

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Hybrid Electronic-Embedded Transformer-Based DC Transformer (EET-DCX): A New Family of Soft-Switching DCXs

IEEE transactions on power electronics, 2024-08, Vol.39 (8), p.9661-9679

2024

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Steady-State Analysis of Resonant Cross-Commutated Buck Converter Under Continuous Voltage Mode

IEEE transactions on industrial electronics (1982), 2018-10, Vol.65 (10), p.7782-7792

2018

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A High-Temperature SiC Three-Phase AC-DC Converter Design for > 100 °C Ambient Temperature

IEEE transactions on power electronics, 2013, Vol.28 (1), p.555-572

2013

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A Double-Side Cooled SiC MOSFET Power Module With Sintered-Silver Interposers: I-Design, Simulation, Fabrication, and Performance Characterization

Systematic Design of Coils in Series–Series Inductive Power Transfer for Power Transferability and Efficiency

New Core Loss Measurement Method for High-Frequency Magnetic Materials

Series-Resonator Buck Converter-Viability Demonstration

Balancing of Peak Currents Between Paralleled SiC MOSFETs by Drive-Source Resistors and Coupled Power-Source Inductors

A Fast Method to Optimize Efficiency and Stray Magnetic Field for Inductive-Power-Transfer Coils Using Lumped-Loops Model

Analytical Calculation of Proximity-Effect Resistance for Planar Coil With Litz Wire and Ferrite Plate in Inductive Power Transfer

Circuit Modeling of the Mechanical-Motion Rectifier for Electrical Simulation of Ocean Wave Power Takeoff

New Way of Generating Electromagnetic Waves

Characterization of a Nonlinear Resistive Polymer-Nanoparticle Composite Coating for Electric Field Reduction in a Medium-Voltage Power Module

Omnicoupled Inductors (OCI) Applied in a Resonant Cross-Commutated Buck Converter

Synthesis of DC-DC Converters From Voltage Conversion Ratio and Prescribed Requirements

Circuit Models and Fast Optimization of Litz Shield for Inductive-Power-Transfer Coils

Design Methodology of a One-Turn Inductor With Significant DC and AC Fluxes-Demonstration in a Resonant Cross-Commutated Buck Converter

Transient Core-Loss Simulation for Ferrites With Nonuniform Field in SPICE

Passive Balancing of Peak Currents Between Paralleled MOSFETs With Unequal Threshold Voltages

Packaging of a 10-kV Double-Side Cooled Silicon Carbide Diode Module With Thin Substrates Coated by a Nonlinear Resistive Polymer-Nanoparticle Composite

Steady-State Analysis of Series-Resonator Buck Converter

Two-Dimensional Mapping of Interface Thermal Resistance by Transient Thermal Measurement

Low Parasitic-Inductance Packaging of a 650 V/150 A Half-Bridge Module Using Enhancement-Mode Gallium-Nitride High Electron Mobility Transistors

A 1200-V, 60-A SiC MOSFET Multichip Phase-Leg Module for High-Temperature, High-Frequency Applications

A Novel High-Temperature Planar Package for SiC Multichip Phase-Leg Power Module

Hybrid Electronic-Embedded Transformer-Based DC Transformer (EET-DCX): A New Family of Soft-Switching DCXs

Steady-State Analysis of Resonant Cross-Commutated Buck Converter Under Continuous Voltage Mode

A High-Temperature SiC Three-Phase AC-DC Converter Design for > 100 °C Ambient Temperature

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