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Review on Methods for Trench MOSFET Gate Oxide Reliability and Switching Speed Improvement

ECS transactions, 2010, Vol.27 (1), p.21-26

Ng, Hong Seng

2010

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Verase Improvement for Split-gate Embedded Flash Through Poly Grain Size Reduction

ECS transactions, 2007, Vol.8 (1), p.83-89

2007

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Characterization of copper precipitates on aluminum copper bond pads formed after plasma clean and de-ionized water exposure

Microelectronics and reliability, 2015-06, Vol.55 (7), p.1101-1108

2015

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Impact of stress-induced heating on PLR and WLR HCI testing

2015 IEEE Regional Symposium on Micro and Nanoelectronics (RSM), 2015, p.1-4

2015

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Study of chemical staining on metallization for SEM image quality effect improvement

2008 IEEE International Conference on Semiconductor Electronics, 2008, p.410-413

2008

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Electromigration failure mechanism investigation between wafer level and plackage level reliability test in AL interconects

2016 China Semiconductor Technology International Conference (CSTIC), 2016, p.1-4

2016

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Electromigration failure mechanism comparison between wafer level and package level reliability test on via structure

2015 6th Asia Symposium on Quality Electronic Design (ASQED), 2015, p.86-89

2015

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Improved corner rounding method for trenched MOSFET

2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT), 2010, p.1-3

Ng Hong Seng

2010

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Improvement of bimodal breakdown voltage behavior on thin Oxide POD capacitor

2009 IEEE Symposium on Industrial Electronics & Applications, 2009, Vol.2, p.872-876

Ng, Hong Seng

2009

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The effect of STI and active length on dual gate oxide reliability

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT), 2008, p.1-4

Ng Hong Seng

2008

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Impact of Via Structure Toward Wire Bond Interconnect Quality

2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2022, p.1-4

2022

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Metal line and via electromigration improvement with wafer level tests

2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT), 2010, p.1-4

2010

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Smaller Bond Pad for Device Reliability

2024 38th Symposium on Microelectronics Technology and Devices (SBMicro), 2024, p.1-4

2024

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Failure mechanism and improvement on gate oxide failure at the edge of LOCOS

2012 10th IEEE International Conference on Semiconductor Electronics (ICSE), 2012, p.588-591

2012

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Investigation of low Vbd on 7nm oxide POD capacitor

2009 1st Asia Symposium on Quality Electronic Design, 2009, p.221-224

2009

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Slurry Usage Reduction for Failure Analysis Sample Preparation

2007 5th Student Conference on Research and Development, 2007, p.1-3

2007

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Wire Bondability Evaluation of Concave Bond Pad

2019 IEEE 9th International Nanoelectronics Conferences (INEC), 2019, p.1-4

2019

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Implementation of Fast Wafer Level Reliability Monitoring Strategy for Wafer Fab Process Monitoring

2007 5th Student Conference on Research and Development, 2007, p.1-3

2007

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Outsource bond pad reliability methodology setup for foundry process changes

2011 IEEE Symposium on Industrial Electronics and Applications, 2011, p.696-699

Ng, Hong Seng

2011

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Effect of silicon nitride deposition parameters on TDDB performance of SiNx-MIM capacitors

2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference, 2016, p.1-3

2016

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Aluminium oxide thickness impact on wire bond shear

36th International Electronics Manufacturing Technology Conference, 2014, p.1-4

2014

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Practical Consideration for PLR versus WLR HCI Testing

DEStech Transactions on Engineering and Technology Research, 2017-05 (imeia)

2017

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The socio-economic and cultural impacts of the Pan Borneo Highway on Indigenous and local communities in Sabah, Malaysian Borneo

PloS one, 2022-06, Vol.17 (6), p.e0269890-e0269890

2022

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Empagliflozin in Patients with Chronic Kidney Disease

The New England journal of medicine, 2023-01, Vol.388 (2), p.117-127

2023

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Commonalities and differences in the mutational signature and somatic driver mutation landscape across solid and hollow viscus organs

Oncogene, 2023-09, Vol.42 (37), p.2713-2724

2023

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Review on Methods for Trench MOSFET Gate Oxide Reliability and Switching Speed Improvement

Verase Improvement for Split-gate Embedded Flash Through Poly Grain Size Reduction

Characterization of copper precipitates on aluminum copper bond pads formed after plasma clean and de-ionized water exposure

Impact of stress-induced heating on PLR and WLR HCI testing

Study of chemical staining on metallization for SEM image quality effect improvement

Electromigration failure mechanism investigation between wafer level and plackage level reliability test in AL interconects

Electromigration failure mechanism comparison between wafer level and package level reliability test on via structure

Improved corner rounding method for trenched MOSFET

Improvement of bimodal breakdown voltage behavior on thin Oxide POD capacitor

The effect of STI and active length on dual gate oxide reliability

Impact of Via Structure Toward Wire Bond Interconnect Quality

Metal line and via electromigration improvement with wafer level tests

Smaller Bond Pad for Device Reliability

Failure mechanism and improvement on gate oxide failure at the edge of LOCOS

Investigation of low Vbd on 7nm oxide POD capacitor

Slurry Usage Reduction for Failure Analysis Sample Preparation

Wire Bondability Evaluation of Concave Bond Pad

Implementation of Fast Wafer Level Reliability Monitoring Strategy for Wafer Fab Process Monitoring

Outsource bond pad reliability methodology setup for foundry process changes

Effect of silicon nitride deposition parameters on TDDB performance of SiNx-MIM capacitors

Aluminium oxide thickness impact on wire bond shear

Practical Consideration for PLR versus WLR HCI Testing

The socio-economic and cultural impacts of the Pan Borneo Highway on Indigenous and local communities in Sabah, Malaysian Borneo

Empagliflozin in Patients with Chronic Kidney Disease

Commonalities and differences in the mutational signature and somatic driver mutation landscape across solid and hollow viscus organs

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