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High-Frequency Modeling of TSVs for 3-D Chip Integration and Silicon Interposers Considering Skin-Effect, Dielectric Quasi-TEM and Slow-Wave Modes

IEEE transactions on components, packaging, and manufacturing technology (2011), 2011-10, Vol.1 (10), p.1627-1641

2011

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Analytical, Numerical-, and Measurement-Based Methods for Extracting the Electrical Parameters of Through Silicon Vias (TSVs)

IEEE transactions on components, packaging, and manufacturing technology (2011), 2014-03, Vol.4 (3), p.504-515

2014

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Efficient Computation of Localized Fields for Through Silicon Via Modeling Up to 500 GHz

IEEE transactions on components, packaging, and manufacturing technology (2011), 2015-12, Vol.5 (12), p.1793-1801

2015

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Flip-Chip-Based Dual-Polarized Antenna-on-Package Arrays for 5G mmWave Modules

Journal of microelectronics and electronic packaging, 2024-04, Vol.21 (2)

2024

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Through-The-Wall Detection With Gated FMCW Signals Using Optimized Patch-Like and Vivaldi Antennas

IEEE transactions on antennas and propagation, 2015-03, Vol.63 (3), p.1106-1117

2015

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Dual-Band Dual-Polarized Antennas for 5G mmWave Base Stations

Journal of microelectronics and electronic packaging, 2023-10, Vol.20 (4)

2023

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On the Radiation Characteristics of Full-Loop, Half-Loop, and Quasi-Half-Loop Bond Wire Antennas

IEEE transactions on antennas and propagation, 2018-11, Vol.66 (11), p.5672-5686

2018

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Analysis and Characterization of Castellated Holes as RF Interconnects for Modular Millimeter-Wave Devices

2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC), 2023, p.1-7

2023

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Closed-Form Multipole Debye Model for Time-Domain Modeling of Lossy Dielectrics

IEEE transactions on electromagnetic compatibility, 2019-06, Vol.61 (3), p.966-968

2019

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On the Modeling, Characterization, and Analysis of the Current Distribution in PCB Transmission Lines With Surface Finishes

IEEE transactions on microwave theory and techniques, 2016-08, Vol.64 (8), p.2511-2518

2016

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Mixed-Port Scattering and Hybrid Parameters for High-Speed Differential Lines

IEEE transactions on electromagnetic compatibility, 2019-08, Vol.61 (4), p.1175-1182

2019

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Mold based D-band slotted SIW bandpass filter

2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022, p.589-592

2022

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A Methodology for Combined Modeling of Skin, Proximity, Edge, and Surface Roughness Effects

IEEE transactions on microwave theory and techniques, 2010-09, Vol.58 (9), p.2448-2455

2010

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Analytical Models for Calculating the Inductances of Bond Wires in Dependence on their Shapes, Bonding Parameters, and Materials

IEEE transactions on electromagnetic compatibility, 2015-04, Vol.57 (2), p.241-249

2015

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Characterization of bump arrays at RF/microwave frequencies

Microelectronics and reliability, 2005-03, Vol.45 (3), p.551-558

2005

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Development of a Glass Technology Based 79 GHz MIMO Radar Front-End Module for Autonomous Driving

2019 IEEE 21st Electronics Packaging Technology Conference (EPTC), 2019, p.376-381

2019

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Design and Comparison of 24 GHz Patch Antennas on Glass Substrates for Compact Wireless Sensor Nodes

International journal of microwave science and technology, 2011, Vol.2010 (2010), p.1-9

2011

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EBG Common-Mode Filter Design Using Uncoupled Coplanar Waveguide to Microstrip Transitions

IEEE journal on electromagnetic compatibility practice and applications, 2020-09, Vol.2 (3), p.81-84

2020

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Nonoverlapping Power/Ground Planes for Suppression of Power Plane Noise

IEEE transactions on components, packaging, and manufacturing technology (2011), 2018-01, Vol.8 (1), p.50-56

2018

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3-D Thin film interposer based on TGV (Through Glass Vias): An alternative to Si-interposer

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC), 2010, p.66-73

2010

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Efficient Total Crosstalk Analysis of Large Via Arrays in Silicon Interposers

IEEE transactions on components, packaging, and manufacturing technology (2011), 2016-12, Vol.6 (12), p.1889-1898

2016

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A Rigorous Approach for the Modeling of Through-Silicon-Via Pairs Using Multipole Expansions

IEEE transactions on components, packaging, and manufacturing technology (2011), 2016-01, Vol.6 (1), p.117-125

2016

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Power Plane Filter Using Higher Order Virtual Ground Fence

IEEE transactions on components, packaging, and manufacturing technology (2011), 2017-04, Vol.7 (4), p.519-525

2017

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A comparison of typical surface finishes on the high frequency performances of transmission lines in PCBs

2017 IEEE 21st Workshop on Signal and Power Integrity (SPI), 2017, p.1-3

2017

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Development and Validation of a Chip Integration Concept for Multi-Die GaAs Front Ends for Phased Arrays up to 60 GHz

IEEE transactions on components, packaging, and manufacturing technology (2011), 2018-07, Vol.8 (7), p.1231-1240

2018

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High-Frequency Modeling of TSVs for 3-D Chip Integration and Silicon Interposers Considering Skin-Effect, Dielectric Quasi-TEM and Slow-Wave Modes

Analytical, Numerical-, and Measurement-Based Methods for Extracting the Electrical Parameters of Through Silicon Vias (TSVs)

Efficient Computation of Localized Fields for Through Silicon Via Modeling Up to 500 GHz

Flip-Chip-Based Dual-Polarized Antenna-on-Package Arrays for 5G mmWave Modules

Through-The-Wall Detection With Gated FMCW Signals Using Optimized Patch-Like and Vivaldi Antennas

Dual-Band Dual-Polarized Antennas for 5G mmWave Base Stations

On the Radiation Characteristics of Full-Loop, Half-Loop, and Quasi-Half-Loop Bond Wire Antennas

Analysis and Characterization of Castellated Holes as RF Interconnects for Modular Millimeter-Wave Devices

Closed-Form Multipole Debye Model for Time-Domain Modeling of Lossy Dielectrics

On the Modeling, Characterization, and Analysis of the Current Distribution in PCB Transmission Lines With Surface Finishes

Mixed-Port Scattering and Hybrid Parameters for High-Speed Differential Lines

Mold based D-band slotted SIW bandpass filter

A Methodology for Combined Modeling of Skin, Proximity, Edge, and Surface Roughness Effects

Analytical Models for Calculating the Inductances of Bond Wires in Dependence on their Shapes, Bonding Parameters, and Materials

Characterization of bump arrays at RF/microwave frequencies

Development of a Glass Technology Based 79 GHz MIMO Radar Front-End Module for Autonomous Driving

Design and Comparison of 24 GHz Patch Antennas on Glass Substrates for Compact Wireless Sensor Nodes

EBG Common-Mode Filter Design Using Uncoupled Coplanar Waveguide to Microstrip Transitions

Nonoverlapping Power/Ground Planes for Suppression of Power Plane Noise

3-D Thin film interposer based on TGV (Through Glass Vias): An alternative to Si-interposer

Efficient Total Crosstalk Analysis of Large Via Arrays in Silicon Interposers

A Rigorous Approach for the Modeling of Through-Silicon-Via Pairs Using Multipole Expansions

Power Plane Filter Using Higher Order Virtual Ground Fence

A comparison of typical surface finishes on the high frequency performances of transmission lines in PCBs

Development and Validation of a Chip Integration Concept for Multi-Die GaAs Front Ends for Phased Arrays up to 60 GHz

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