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Conformational Study of Helical Poly(propiolic esters) in Solution

Journal of the American Chemical Society, 2000-09, Vol.122 (37), p.8830-8836

2000

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Bonding Abilities of Pressure-assisted Sintered Copper for Die-Bonding of Large Chips

TRANSACTIONS OF THE JAPAN INSTITUTE OF ELECTRONICS PACKAGING, 2020, Vol.13, p.E20-E20-003-3

2020

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Bonding Strength of Cu Sinter Die-Bonding Paste on Ni, Cu, Ag, and Au Surfaces under Pressureless Bonding Process

TRANSACTIONS OF THE JAPAN INSTITUTE OF ELECTRONICS PACKAGING, 2020, Vol.13, p.E19-E19-017-11

2020

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Synthesis and Structure in Solution of Poly[(−)-menthyl propiolate] as a New Class of Helical Polyacetylene

Macromolecules, 1999-05, Vol.32 (9), p.2861-2864

1999

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Effect of Chiral Substituents on the Helical Conformation of Poly(propiolic esters)

Macromolecules, 2000-05, Vol.33 (11), p.3978-3982

2000

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Control of Threshold Voltage of O-FET by Modifying of Side Chain Groups on Polymer Gate Dielectrics

Journal of Photopolymer Science and Technology, 2010/06/22, Vol.23(3), pp.327-332

2010

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Development of Copper Materials and Processing for Printed Electronics

TRANSACTIONS OF THE JAPAN INSTITUTE OF ELECTRONICS PACKAGING, 2012, Vol.5 (1), p.20-25

2012

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Power Cycle Reliability of Cu Sintered Die-Bonding Using of Pressure Contact Structure

Journal of The Japan Institute of Electronics Packaging, 2022-05, Vol.25 (3), p.218-224, Article JIEP-D-21-00088

2022

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Material Technology of Conductive Wiring for Ink-jet Print

TRANSACTIONS OF THE JAPAN INSTITUTE OF ELECTRONICS PACKAGING, 2011, Vol.4 (1), p.114-118

2011

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Helix Inversion of Poly(propiolic esters)

Macromolecules, 2001-02, Vol.34 (5), p.1496-1502

2001

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Novel materials for electronic device fabrication using ink-jet printing technology

Applied surface science, 2009-11, Vol.256 (4), p.1019-1022

2009

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Design and synthesis of semiflexible substituted polyacetylenes with helical conformation

Journal of Molecular Catalysis. A, Chemical, 2002-12, Vol.190 (1), p.197-205

2002

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Bondability Evaluation of Pressureless Sintering Copper Die-Bonding Paste

Journal of The Japan Institute of Electronics Packaging, 2018-05, Vol.21 (3), p.224-233

2018

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Thermal cycling lifetime estimation of sintered metal die attachment

2016 International Conference on Electronics Packaging (ICEP), 2016, p.400-404

2016

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Large Area Powermodule Sintering Using Porous Copper

2024 International Conference on Electronics Packaging (ICEP), 2024, p.43-44

2024

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Dendrite Formation in Power Electronics Packages during HV-H3TRB Testing due to Flux Residue

2024 International Conference on Electronics Packaging (ICEP), 2024, p.31-32

2024

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Comparison of Mechanical Property and Thermal Cycling Lifetime of Sintered Cu and Sintered Ag

2024 International Conference on Electronics Packaging (ICEP), 2024, p.313-314

2024

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N-Substituted-2-propynamides. Highly Reactive Acetylene Derivatives toward Hydrogen Migration Polymerization

Polymer journal, 2000, Vol.32 (3), p.303-305

2000

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Novel group 6 transition metal catalysts, MCl2(CO)3(AsPh3)2 (M=W, Mo), for the metathesis polymerization of substituted acetylenes

Polymer journal, 1998, Vol.30 (7), p.577-580

1998

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Copper and silver sintered die-attach compared in HV-H3TRB and thermal shock cycling

2023 International Conference on Electronics Packaging (ICEP), 2023, p.89-90

2023

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Adhesive Strength and Diffusion at Interfaces between Sintered Cu Layer and Metal Surfaces (Cu, Ag, Au, Pd, Pt, Ni, NiPx, and NiBx)

2023 International Conference on Electronics Packaging (ICEP), 2023, p.233-234

2023

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Metathesis Polymerization of Substituted Acetylenes and Norbornene by M(CO)6-Ph2CCl2-hν (M=Mo, W) Catalysts

Polymer journal, 1998-07, Vol.30 (7), p.581-584

1998

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Effect of Sintering Temperature for Die-shear Strength of Non-pressure Sintering Copper Paste on Metal Plating

2022 International Conference on Electronics Packaging (ICEP), 2022, p.73-74

2022

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Reliability of Silicone and Epoxy Resin Encapsulated Power Modules in HV-H3TRB tests with Thin-Resin coated Dice

2022 International Conference on Electronics Packaging (ICEP), 2022, p.147-148

2022

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Cu-Sintering on Organic Packages for Power Modules

2022 International Conference on Electronics Packaging (ICEP), 2022, p.151-152

2022

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Conformational Study of Helical Poly(propiolic esters) in Solution

Bonding Abilities of Pressure-assisted Sintered Copper for Die-Bonding of Large Chips

Bonding Strength of Cu Sinter Die-Bonding Paste on Ni, Cu, Ag, and Au Surfaces under Pressureless Bonding Process

Synthesis and Structure in Solution of Poly[(−)-menthyl propiolate] as a New Class of Helical Polyacetylene

Effect of Chiral Substituents on the Helical Conformation of Poly(propiolic esters)

Control of Threshold Voltage of O-FET by Modifying of Side Chain Groups on Polymer Gate Dielectrics

Development of Copper Materials and Processing for Printed Electronics

Power Cycle Reliability of Cu Sintered Die-Bonding Using of Pressure Contact Structure

Material Technology of Conductive Wiring for Ink-jet Print

Helix Inversion of Poly(propiolic esters)

Novel materials for electronic device fabrication using ink-jet printing technology

Design and synthesis of semiflexible substituted polyacetylenes with helical conformation

Bondability Evaluation of Pressureless Sintering Copper Die-Bonding Paste

Thermal cycling lifetime estimation of sintered metal die attachment

Large Area Powermodule Sintering Using Porous Copper

Dendrite Formation in Power Electronics Packages during HV-H3TRB Testing due to Flux Residue

Comparison of Mechanical Property and Thermal Cycling Lifetime of Sintered Cu and Sintered Ag

N-Substituted-2-propynamides. Highly Reactive Acetylene Derivatives toward Hydrogen Migration Polymerization

Novel group 6 transition metal catalysts, MCl2(CO)3(AsPh3)2 (M=W, Mo), for the metathesis polymerization of substituted acetylenes

Copper and silver sintered die-attach compared in HV-H3TRB and thermal shock cycling

Adhesive Strength and Diffusion at Interfaces between Sintered Cu Layer and Metal Surfaces (Cu, Ag, Au, Pd, Pt, Ni, NiPx, and NiBx)

Metathesis Polymerization of Substituted Acetylenes and Norbornene by M(CO)6-Ph2CCl2-hν (M=Mo, W) Catalysts

Effect of Sintering Temperature for Die-shear Strength of Non-pressure Sintering Copper Paste on Metal Plating

Reliability of Silicone and Epoxy Resin Encapsulated Power Modules in HV-H3TRB tests with Thin-Resin coated Dice

Cu-Sintering on Organic Packages for Power Modules

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