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ISOP+: Machine Learning-Assisted Inverse Stack-Up Optimization for Advanced Package Design

IEEE transactions on computer-aided design of integrated circuits and systems, 2024-01, Vol.43 (1), p.1-1

2024

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Eye Height/Width Prediction From S -Parameters Using Learning-Based Models

IEEE transactions on components, packaging, and manufacturing technology (2011), 2016-06, Vol.6 (6), p.873-885

2016

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Improved Transmitter Jitter Modeling for Accurate Bit Error Rate (BER) Eye Contours Using Transient Simulation of Short Bit Patterns

IEEE transactions on electromagnetic compatibility, 2018-10, Vol.60 (5), p.1520-1528

2018

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A Novel Machine-Learning-Based Batch Selection Method in Sparse Near-Field Scanning

IEEE transactions on microwave theory and techniques, 2022-11, Vol.70 (11), p.5019-5028

2022

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S-Parameter and Frequency Identification Method for ANN-Based Eye-Height/Width Prediction

IEEE transactions on components, packaging, and manufacturing technology (2011), 2017-05, Vol.7 (5), p.698-709

2017

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Optimization of Ground Via Patterns for Via Transitions by Minimizing Loop Inductance

IEEE transactions on signal and power integrity, 2023-03, Vol.2, p.1-11

2023

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Analytical method for joint optimization of FFE and DFE equalizations for multi-level signals

Journal of Electrical Engineering, 2022-08, Vol.73 (4), p.284-291

2022

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Investigation of Voltage Regulator Module (VRM)-Induced Noise to High-Speed Signals With VRM via Design Factors

IEEE transactions on signal and power integrity, 2024, Vol.3, p.97-109

2024

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Fast PCB Stack-Up Optimization Using Integer Programming

IEEE transactions on signal and power integrity, 2023, Vol.2, p.32-42

2023

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One-Dimensional Deep Image Prior for Curve Fitting of S-Parameters from Electromagnetic Solvers

2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD), 2023, p.1-9

2023

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ISOP: Machine Learning-Assisted Inverse Stack-Up Optimization for Advanced Package Design

2023 Design, Automation & Test in Europe Conference & Exhibition (DATE), 2023, p.1-6

2023

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Crosstalk Impact of Periodic-Coupled Routing on Eye Opening of High-Speed Links in PCBs

IEEE transactions on electromagnetic compatibility, 2015-12, Vol.57 (6), p.1676-1689

2015

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Eye Height/Width Prediction From [Formula Omitted]-Parameters Using Learning-Based Models

IEEE transactions on components, packaging, and manufacturing technology (2011), 2016-06, Vol.6 (6), p.873

2016

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Quantifying the Impact of FEXT on Eye Margin for Coupled Lines in Inhomogeneous Media

IEEE transactions on electromagnetic compatibility, 2015-12, Vol.57 (6), p.1665-1675

2015

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Layout-level synthesis of RF inductors and filters in LCP substrates for Wi-Fi applications

IEEE transactions on microwave theory and techniques, 2005-06, Vol.53 (6), p.2196-2210

2005

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DDR5 Electrical Challenges in High-Speed Server Design

2023 Joint Asia-Pacific International Symposium on Electromagnetic Compatibility and International Conference on ElectroMagnetic Interference & Compatibility (APEMC/INCEMIC), 2023, p.1-4

2023

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Codimensional Optimization of Differential Via Padstacks

2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2022, p.1-3

2022

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An Efficient Electrical-Thermal Co-Design Methodology for Analysis of High-Speed PCB Interconnects

2023 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO), 2023, p.154-157

2023

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Channel Impedance Optimization For 100 Gbps High-Speed Networking Interfaces

2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 2022, p.1-3

2022

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Thermal Impact on High Speed PCB Interconnects

2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2019, p.1-3

2019

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Bayesian Optimization for Stack-up Design

2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), 2019, p.629-634

2019

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ISOP-Yield: Yield-Aware Stack-Up Optimization for Advanced Package Using Machine Learning

2024 29th Asia and South Pacific Design Automation Conference (ASP-DAC), 2024, p.644-650

2024

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Method of Exploring HVM Process Corner Cases for Loss and Impedance in High Speed Designs

2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2023, p.1-3

2023

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Sparsity Constrained Regression For High-Speed Signal Integrity Modeling

2019 Electrical Design of Advanced Packaging and Systems (EDAPS), 2019, p.1-3

2019

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BGA Routing Impact on High-Speed Signals

2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2021, p.1-3

2021

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ISOP+: Machine Learning-Assisted Inverse Stack-Up Optimization for Advanced Package Design

Eye Height/Width Prediction From S -Parameters Using Learning-Based Models

Improved Transmitter Jitter Modeling for Accurate Bit Error Rate (BER) Eye Contours Using Transient Simulation of Short Bit Patterns

A Novel Machine-Learning-Based Batch Selection Method in Sparse Near-Field Scanning

S-Parameter and Frequency Identification Method for ANN-Based Eye-Height/Width Prediction

Optimization of Ground Via Patterns for Via Transitions by Minimizing Loop Inductance

Analytical method for joint optimization of FFE and DFE equalizations for multi-level signals

Investigation of Voltage Regulator Module (VRM)-Induced Noise to High-Speed Signals With VRM via Design Factors

Fast PCB Stack-Up Optimization Using Integer Programming

One-Dimensional Deep Image Prior for Curve Fitting of S-Parameters from Electromagnetic Solvers

ISOP: Machine Learning-Assisted Inverse Stack-Up Optimization for Advanced Package Design

Crosstalk Impact of Periodic-Coupled Routing on Eye Opening of High-Speed Links in PCBs

Eye Height/Width Prediction From [Formula Omitted]-Parameters Using Learning-Based Models

Quantifying the Impact of FEXT on Eye Margin for Coupled Lines in Inhomogeneous Media

Layout-level synthesis of RF inductors and filters in LCP substrates for Wi-Fi applications

DDR5 Electrical Challenges in High-Speed Server Design

Codimensional Optimization of Differential Via Padstacks

An Efficient Electrical-Thermal Co-Design Methodology for Analysis of High-Speed PCB Interconnects

Channel Impedance Optimization For 100 Gbps High-Speed Networking Interfaces

Thermal Impact on High Speed PCB Interconnects

Bayesian Optimization for Stack-up Design

ISOP-Yield: Yield-Aware Stack-Up Optimization for Advanced Package Using Machine Learning

Method of Exploring HVM Process Corner Cases for Loss and Impedance in High Speed Designs

Sparsity Constrained Regression For High-Speed Signal Integrity Modeling

BGA Routing Impact on High-Speed Signals

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