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Micromechanical Force Sensor Using the Stress–Impedance Effect of Soft Magnetic FeCuNbSiB

Sensors (Basel, Switzerland), 2021-11, Vol.21 (22), p.7578

2021

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Tactile Sensing Using Magnetic Foam

Polymers, 2022-02, Vol.14 (4), p.834

2022

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Design and Fabrication Technology of Low Profile Tactile Sensor with Digital Interface for Whole Body Robot Skin

Sensors (Basel, Switzerland), 2018-07, Vol.18 (7), p.2374

2018

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3-Axis Fully-Integrated Capacitive Tactile Sensor with Flip-Bonded CMOS on LTCC Interposer

Sensors (Basel, Switzerland), 2017-10, Vol.17 (11), p.2451

2017

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Event-Driven Tactile Sensing System Including 100 CMOS-MEMS Integrated 3-Axis Force Sensors Based on Asynchronous Serial Bus Communication

IEEE sensors journal, 2020-09, Vol.20 (17), p.10159-10169

2020

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A Tactile Sensor Network System Using a Multiple Sensor Platform with a Dedicated CMOS-LSI for Robot Applications

Sensors (Basel, Switzerland), 2017-08, Vol.17 (9), p.1974

2017

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Electrical Design and Evaluation of Asynchronous Serial Bus Communication Network of 48 Sensor Platform LSIs with Single-Ended I/O for Integrated MEMS-LSI Sensors

Sensors (Basel, Switzerland), 2018-01, Vol.18 (1), p.231

2018

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Development of a Real-Time Force and Temperature Sensing System with MEMS-LSI Integrated Tactile Sensors for Next-Generation Robots

Journal of robotics and mechatronics, 2020-04, Vol.32 (2), p.323-332

2020

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Moment detection by integrated tactile sensors for partner robot applications

Electrical engineering in Japan, 2021-06, Vol.214 (2), p.n/a

2021

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Object judgment with an event‐driven MEMS‐LSI integrated tactile sensor array system

Electronics and communications in Japan, 2023-09, Vol.106 (3), p.n/a

2023

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Magnetic properties of Fe–Si–B thin films and their application as stress sensors

Thin solid films, 2022-09, Vol.758, p.139428, Article 139428

2022

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Integrated 3-axis tactile sensor using quad-seesaw-electrode structure on platform LSI with through silicon vias

Sensors and actuators. A. Physical., 2018-04, Vol.273, p.30-41

2018

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Quad-seesaw-electrode type 3-axis tactile sensor with low nonlinearities and low cross-axis sensitivities

Sensors and actuators. A. Physical., 2017-10, Vol.266, p.24-35

2017

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Surface-mountable capacitive tactile sensors with flipped CMOS-diaphragm on a flexible and stretchable bus line

Sensors and actuators. A. Physical., 2016-04, Vol.240, p.167-176

2016

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Advanced LSI-based amperometric sensor array with light-shielding structure for effective removal of photocurrent and mode selectable function for individual operation of 400 electrodes

Lab on a chip, 2015-01, Vol.15 (3), p.848-856

2015

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Delay window blind oversampling clock and data recovery algorithm with wide tracking range

2015 IEEE International Symposium on Circuits and Systems (ISCAS), 2015, p.1598-1601

2015

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Development of an Application Programming Interface for a Multi-Sensing System Based on Sensor Platform LSIs

2021 6th International Conference on Business and Industrial Research (ICBIR), 2021, p.109-112

2021

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Analysis of Effects of Input Arrival Time Variations on On-Chip Bus Power Consumption

Integrated Circuit and System Design. Power and Timing Modeling, Optimization and Simulation, p.62-71

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Touch Sensor Based on Highly Compressive Magnetic Foam Composite

2022 Smart Systems Integration (SSI), 2022, p.1-4

2022

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Surface Covering Structure and Active Sensing with MEMS-CMOS Integrated 3-Axis Tactile Sensors for Object Slip Detection and Texture Recognition

2021 21st International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers), 2021, p.222-225

2021

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CMOS-on-LTCC integrated fingertip sensor with 3-axis tactile and thermal sensation for robots

2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2017, p.516-519

2017

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Multi-sensor platform LSI enabling different sensors to be event-driven and connected to common differental bus line

2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2017, p.1156-1159

2017

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Tactile Sensing System Module with Multiple Cmos-Mems Integrated Sensors on 16 Mbps High Speed Shared Serial Bus Line

2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII), 2019, p.562-565

2019

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300 μm Deep through silicon via in laser-ablated CMOS multi-project wafer for cost-effective development of integrated MEMS

2017 IEEE 30th International Conference on Micro Electro Mechanical Systems (MEMS), 2017, p.744-748

2017

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Micromechanical Force Sensor Using the Stress–Impedance Effect of Soft Magnetic FeCuNbSiB

Tactile Sensing Using Magnetic Foam

Design and Fabrication Technology of Low Profile Tactile Sensor with Digital Interface for Whole Body Robot Skin

3-Axis Fully-Integrated Capacitive Tactile Sensor with Flip-Bonded CMOS on LTCC Interposer

Event-Driven Tactile Sensing System Including 100 CMOS-MEMS Integrated 3-Axis Force Sensors Based on Asynchronous Serial Bus Communication

A Tactile Sensor Network System Using a Multiple Sensor Platform with a Dedicated CMOS-LSI for Robot Applications

Electrical Design and Evaluation of Asynchronous Serial Bus Communication Network of 48 Sensor Platform LSIs with Single-Ended I/O for Integrated MEMS-LSI Sensors

Development of a Real-Time Force and Temperature Sensing System with MEMS-LSI Integrated Tactile Sensors for Next-Generation Robots

Moment detection by integrated tactile sensors for partner robot applications

Object judgment with an event‐driven MEMS‐LSI integrated tactile sensor array system

Magnetic properties of Fe–Si–B thin films and their application as stress sensors

Integrated 3-axis tactile sensor using quad-seesaw-electrode structure on platform LSI with through silicon vias

Quad-seesaw-electrode type 3-axis tactile sensor with low nonlinearities and low cross-axis sensitivities

Surface-mountable capacitive tactile sensors with flipped CMOS-diaphragm on a flexible and stretchable bus line

Advanced LSI-based amperometric sensor array with light-shielding structure for effective removal of photocurrent and mode selectable function for individual operation of 400 electrodes

Delay window blind oversampling clock and data recovery algorithm with wide tracking range

Advanced LSI-based amperometric sensor array with light-shielding structure for effective removal of photocurrent and mode selectable function for individual operation of 400 electrodesElectronic supplementary information (ESI) available. See DOI: 10.1039/c4lc01099j

Development of an Application Programming Interface for a Multi-Sensing System Based on Sensor Platform LSIs

Analysis of Effects of Input Arrival Time Variations on On-Chip Bus Power Consumption

Touch Sensor Based on Highly Compressive Magnetic Foam Composite

Surface Covering Structure and Active Sensing with MEMS-CMOS Integrated 3-Axis Tactile Sensors for Object Slip Detection and Texture Recognition

CMOS-on-LTCC integrated fingertip sensor with 3-axis tactile and thermal sensation for robots

Multi-sensor platform LSI enabling different sensors to be event-driven and connected to common differental bus line

Tactile Sensing System Module with Multiple Cmos-Mems Integrated Sensors on 16 Mbps High Speed Shared Serial Bus Line

300 μm Deep through silicon via in laser-ablated CMOS multi-project wafer for cost-effective development of integrated MEMS

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