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Loop-tree implementation of the adaptive integral method (AIM) for numerically-stable, broadband, fast electromagnetic modeling

IEEE transactions on antennas and propagation, 2004-08, Vol.52 (8), p.2130-2140

2004

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Systematic development of transmission-line models for interconnects with frequency-dependent losses

IEEE transactions on microwave theory and techniques, 2001-10, Vol.49 (10), p.1677-1685

2001

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On deembedding of port discontinuities in full-wave CAD models of multiport circuits

IEEE transactions on microwave theory and techniques, 2003-12, Vol.51 (12), p.2355-2365

2003

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On the Dual Basis for Solving Electromagnetic Surface Integral Equations

IEEE transactions on antennas and propagation, 2009-10, Vol.57 (10), p.3136-3146

2009

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Enhancement of the numerical stability of the adaptive integral method at low frequencies through a loop-charge formulation of the method-of-moments approximation

IEEE transactions on microwave theory and techniques, 2004-03, Vol.52 (3), p.962-970

2004

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An efficient integral equation solver for the electromagnetic modeling of highly-integrated planar RF/microwave circuits

2002 IEEE MTT-S International Microwave Symposium Digest (Cat. No.02CH37278), 2002, Vol.3, p.1897-1900 vol.3

2002

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De-embedding of port discontinuities in full-wave CAD models of multi-port circuits

IEEE MTT-S International Microwave Symposium Digest, 2003, 2003, Vol.1, p.303-306 vol.1

2003

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Authors reply

IEEE transactions on microwave theory and techniques, 2005-05, Vol.53 (5), p.1829

2005

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Finite-thickness conductor models for full-wave analysis of interconnects with a fast Integral equation method

IEEE transactions on advanced packaging, 2004-02, Vol.27 (1), p.24-33

2004

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PRIME: passive realization of interconnect models from measured data

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565), 2001, p.47-50

2001

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Comments on "On deembedding of port discontinuities in full-wave CAD models of multiport circuits" and related comments

IEEE transactions on microwave theory and techniques, 2005-05, Vol.53 (5), p.1829

Farina, M.

2005

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Comments on: on deembedding of port discontinuities in full-wave cad models of multiport circuits and related. Authors' reply

IEEE transactions on microwave theory and techniques, 2005, Vol.53 (5)

2005

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Synthesis of SPICE-compatible broadband electrical models for pins and vias

2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220), 2001, p.518-522

2001

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The Use of Fast Integral Equations Solvers for Practical Package and Interconnect Analysis

2006 IEEE Electrical Performane of Electronic Packaging, 2006, p.335-338

2006

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Physically consistent transmission line models for high-speed interconnects in lossy dielectrics

IEEE transactions on advanced packaging, 2002-05, Vol.25 (2), p.129-135

2002

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The Use of Accelerated Full-Wave Modeling to Analyze Power Island Coupling in a HyperBGA SCM

IEEE transactions on advanced packaging, 2007-05, Vol.30 (2), p.288-294

2007

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Finite-thickness conductor models for full-wave analysis of interconnects with the adaptive integral method

2002 IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging, 2002, p.45-48

2002

Volltextzugriff (PDF)

Systematic development of transmission-line models for interconnects with frequency-dependent losses

IEEE transactions on microwave theory and techniques, 2000-10, Vol.49 (10), p.1677-1685

2000

Volltextzugriff (PDF)

Physically consistent transmission line models for high-speed interconnects in lossy dielectrics

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565), 2001, p.247-250

2001

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SPICE-compatible transmission line modeling using synthesized broadband multi-port representations

2002 IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging, 2002, p.363-366

2002

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A new broadband transmission line model for accurate simulation of dispersive interconnects

Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456), 2000, p.345-351

2000

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Systematic development of transmission line models for interconnects with frequency-dependent losses

IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524), 2000, p.221-224

2000

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Techniques and considerations for verification of model causality

2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2011, p.488-494

2011

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Constructing 3D package component broadband electrical models with correct DC values

19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems, 2010, p.253-256

2010

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Massively parallel full-wave modeling of advanced packaging structures on BlueGene supercomputer

2008 58th Electronic Components and Technology Conference, 2008, p.1218-1224

2008

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Loop-tree implementation of the adaptive integral method (AIM) for numerically-stable, broadband, fast electromagnetic modeling

Systematic development of transmission-line models for interconnects with frequency-dependent losses

On deembedding of port discontinuities in full-wave CAD models of multiport circuits

On the Dual Basis for Solving Electromagnetic Surface Integral Equations

Enhancement of the numerical stability of the adaptive integral method at low frequencies through a loop-charge formulation of the method-of-moments approximation

An efficient integral equation solver for the electromagnetic modeling of highly-integrated planar RF/microwave circuits

De-embedding of port discontinuities in full-wave CAD models of multi-port circuits

Authors reply

Finite-thickness conductor models for full-wave analysis of interconnects with a fast Integral equation method

PRIME: passive realization of interconnect models from measured data

Comments on "On deembedding of port discontinuities in full-wave CAD models of multiport circuits" and related comments

Comments on: on deembedding of port discontinuities in full-wave cad models of multiport circuits and related. Authors' reply

Synthesis of SPICE-compatible broadband electrical models for pins and vias

The Use of Fast Integral Equations Solvers for Practical Package and Interconnect Analysis

Physically consistent transmission line models for high-speed interconnects in lossy dielectrics

The Use of Accelerated Full-Wave Modeling to Analyze Power Island Coupling in a HyperBGA SCM

Finite-thickness conductor models for full-wave analysis of interconnects with the adaptive integral method

Systematic development of transmission-line models for interconnects with frequency-dependent losses

Physically consistent transmission line models for high-speed interconnects in lossy dielectrics

SPICE-compatible transmission line modeling using synthesized broadband multi-port representations

A new broadband transmission line model for accurate simulation of dispersive interconnects

Systematic development of transmission line models for interconnects with frequency-dependent losses

Techniques and considerations for verification of model causality

Constructing 3D package component broadband electrical models with correct DC values

Massively parallel full-wave modeling of advanced packaging structures on BlueGene supercomputer

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