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A plasmaless, photochemical etch process for porous organosilicate glass films

Journal of applied physics, 2017-12, Vol.122 (24)

2017

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A plasmaless, photochemical etch process for porous organosilicate glassfilms

Journal of applied physics, 2017-12, Vol.122 (24)

2017

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Silane Decomposition on Cu Interconnects Inhibited by Ammonia

Journal of the Electrochemical Society, 2010, Vol.157 (1), p.H78

2010

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Measurement of Stresses Using Fluorescence in an Optical Microprobe: Stresses around Indentations in a Chromium-Doped Sapphire

Journal of the American Ceramic Society, 1990-11, Vol.73 (11), p.3189-3194

1990

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Post Copper CMP Hybrid Clean Process for Advanced BEOL Technology

IEEE transactions on semiconductor manufacturing, 2013-11, Vol.26 (4), p.493-499

2013

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Ultrathin (8-14 nm) Conformal SiN for sub-20 nm Copper/Low-k Interconnects

ECS transactions, 2014, Vol.61 (3), p.17-28

2014

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Property modifications of nanoporous p SiCOH dielectrics to enhance resistance to plasma-induced damage

Journal of applied physics, 2008-11, Vol.104 (9), p.094109-094109-7

2008

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Line Resistance and Electromigration Variations Induced by Hydrogen-Based Plasma Modifications to the Silicon Carbonitride/Copper Interface

Journal of the Electrochemical Society, 2007, Vol.154 (7), p.H604

2007

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Ultrathin (5-35 nm) SiCNH Dielectrics for Damascene Cu Cap Application: Thickness Scaling and Oxidation Barrier Performance Limitation

ECS transactions, 2010, Vol.33 (12), p.137-145

2010

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Robust Ultrathin (20-25 nm)Trilayer Dielectric Low k Cu Damascene Cap for Sub-30 nm Nanoelectric Devices

ECS transactions, 2012-05, Vol.41 (43), p.3-9

2012

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Hybrid clean approach for post-copper CMP defect reduction

ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference, 2013, p.346-351

2013

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Post cleaning and defect reduction for tungsten chemical mechanical planarization

2015 International Conference on Planarization/CMP Technology (ICPT), 2015, p.1-5

2015

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Highly Robust Advanced Single Precursor Based k 2.4 ILD for Beol Cu Interconnects

Meeting abstracts (Electrochemical Society), 2015-07, Vol.MA2015-02 (18), p.824-824

2015

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Ultrathin (8-14 nm) Conformal SiN for sub-20 nm Copper/Low-k Interconnects

Meeting abstracts (Electrochemical Society), 2014-04, Vol.MA2014-01 (39), p.1440-1440

2014

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Ultrathin (5-35 nm) SiCNH Dielectrics for Damascene Cu Cap Application: Thickness Scaling and Oxidation Barrier Performance Limitation

Meeting abstracts (Electrochemical Society), 2010-07, Vol.MA2010-02 (26), p.1685-1685

2010

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Growth Of Polyimide Films By Chemical Vapor Deposition And Their Characterization

MRS proceedings, 1991, Vol.227, Article 55

1991

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Properties of partially cured networks. 1. Curing kinetics of a model network

Macromolecules, 1984-09, Vol.17 (9), p.1830-1834

1984

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SPECTROSCOPIC CHARACTERIZATION OF THE MICROSTRUCTURE OF POLYBUTADIENE BASED POLYURETHANE ELASTOMERS

MOLIS, STEVEN EARLE

1986

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Robust Ultrathin (20-25 nm)Trilayer Dielectric Low k Cu Damascene Cap for Sub-30 nm Nanoelectric Devices

Meeting abstracts (Electrochemical Society), 2011-08, Vol.MA2011-02 (28), p.1933-1933

2011

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Lightly Porous SiCOH 2.7 Dielectric Film Development for 65/45/32 nm Advanced Nanoelectronic CMOS Devices

Meeting abstracts (Electrochemical Society), 2008-08, Vol.MA2008-02 (28), p.2076-2076

2008

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High Fidelity Bidirectional Neural Interfacing with Carbon Fiber Microelectrodes Coated with Boron‐Doped Carbon Nanowalls: An Acute Study

Advanced functional materials, 2020-12, Vol.30 (52), p.n/a

2020

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Hybrid diamond/ carbon fiber microelectrodes enable multimodal electrical/chemical neural interfacing

Biomaterials, 2020-02, Vol.230, p.119648-119648, Article 119648

2020

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Genetically determined exercise capacity affects systemic glucose response to insulin in rats

Physiological genomics, 2021-09, Vol.53 (9), p.395-405

2021

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Modulation of estrogen receptor mRNA expression by melatonin in MCF-7 human breast cancer cells

Molecular endocrinology (Baltimore, Md.), 1994-12, Vol.8 (12), p.1681-1690

1994

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Melatonin modulation of estrogen-regulated proteins, growth factors, and proto-oncogenes in human breast cancer

Journal of pineal research, 1995-03, Vol.18 (2), p.93-103

1995

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A plasmaless, photochemical etch process for porous organosilicate glass films

A plasmaless, photochemical etch process for porous organosilicate glassfilms

Silane Decomposition on Cu Interconnects Inhibited by Ammonia

Measurement of Stresses Using Fluorescence in an Optical Microprobe: Stresses around Indentations in a Chromium-Doped Sapphire

Post Copper CMP Hybrid Clean Process for Advanced BEOL Technology

Ultrathin (8-14 nm) Conformal SiN for sub-20 nm Copper/Low-k Interconnects

Property modifications of nanoporous p SiCOH dielectrics to enhance resistance to plasma-induced damage

Line Resistance and Electromigration Variations Induced by Hydrogen-Based Plasma Modifications to the Silicon Carbonitride/Copper Interface

Ultrathin (5-35 nm) SiCNH Dielectrics for Damascene Cu Cap Application: Thickness Scaling and Oxidation Barrier Performance Limitation

Robust Ultrathin (20-25 nm)Trilayer Dielectric Low k Cu Damascene Cap for Sub-30 nm Nanoelectric Devices

Hybrid clean approach for post-copper CMP defect reduction

Post cleaning and defect reduction for tungsten chemical mechanical planarization

Highly Robust Advanced Single Precursor Based k 2.4 ILD for Beol Cu Interconnects

Ultrathin (8-14 nm) Conformal SiN for sub-20 nm Copper/Low-k Interconnects

Ultrathin (5-35 nm) SiCNH Dielectrics for Damascene Cu Cap Application: Thickness Scaling and Oxidation Barrier Performance Limitation

Growth Of Polyimide Films By Chemical Vapor Deposition And Their Characterization

Properties of partially cured networks. 1. Curing kinetics of a model network

SPECTROSCOPIC CHARACTERIZATION OF THE MICROSTRUCTURE OF POLYBUTADIENE BASED POLYURETHANE ELASTOMERS

Robust Ultrathin (20-25 nm)Trilayer Dielectric Low k Cu Damascene Cap for Sub-30 nm Nanoelectric Devices

Lightly Porous SiCOH 2.7 Dielectric Film Development for 65/45/32 nm Advanced Nanoelectronic CMOS Devices

High Fidelity Bidirectional Neural Interfacing with Carbon Fiber Microelectrodes Coated with Boron‐Doped Carbon Nanowalls: An Acute Study

Hybrid diamond/ carbon fiber microelectrodes enable multimodal electrical/chemical neural interfacing

Genetically determined exercise capacity affects systemic glucose response to insulin in rats

Modulation of estrogen receptor mRNA expression by melatonin in MCF-7 human breast cancer cells

Melatonin modulation of estrogen-regulated proteins, growth factors, and proto-oncogenes in human breast cancer

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