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Atomic layer annealing with radio-frequency substrate bias for control of grain morphology in gallium nitride thin films

MRS bulletin, 2023-11, Vol.48 (11), p.1164-1171

2023

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Pulsed chemical vapor deposition for crystalline aluminum nitride thin films and buffer layers on silicon and silicon carbide

Thin solid films, 2023-03, Vol.768, p.139717, Article 139717

2023

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The role of oxide formation on insulating versus metallic substrates during Co and Ru selective ALD

Applied surface science, 2020-04, Vol.510, p.144804, Article 144804

2020

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Tris(dimethylamido)aluminum(III) and N2H4: Ideal precursors for the low-temperature deposition of large grain, oriented c-axis AlN on Si via atomic layer annealing

Applied surface science, 2021-07, Vol.554, p.149656, Article 149656

2021

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Advances in Characterization of CMP Consumables

MRS bulletin, 2002-10, Vol.27 (10), p.766-771

2002

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Experimental and theoretical determination of the role of ions in atomic layer annealing

Journal of materials chemistry. C, Materials for optical and electronic devices, 2022-04, Vol.1 (14), p.577-5715

2022

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Low-Resistivity Titanium Nitride Thin Films Fabricated by Atomic Layer Deposition with TiCl 4 and Metal–Organic Precursors in Horizontal Vias

ACS applied electronic materials, 2023-08, Vol.5 (8), p.4094-4102

2023

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Low-Resistivity Titanium Nitride Thin Films Fabricated by Atomic Layer Deposition with TiCl4 and Metal–Organic Precursors in Horizontal Vias

ACS applied electronic materials, 2023-08, Vol.5 (8), p.4094-4102

2023

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Determining Pad-Wafer Contact using Dual Emission Laser Induced Fluorescence

MRS proceedings, 2007, Vol.991, Article 0991-C01-04

2007

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Optimization and upscaling of spin coating with organosilane monolayers for low-k pore sealing

Microelectronic engineering, 2017-01, Vol.167, p.32-36

2017

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Proximity Effects of the Selective Atomic Layer Deposition of Cobalt on the Nanoscale: Implications for Interconnects

ACS applied nano materials, 2021-08, Vol.4 (8), p.8447-8454

2021

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Fluorescence Correlation Spectroscopic Investigation of Surface Adsorption of CMP Slurry Additives on Abrasive Particles

MRS proceedings, 2013, Vol.1560 (1), Article mrss13-1560-bb04-04

2013

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Particle Metrology in CMP Slurries - Potential and Limitations of Relevant Measuring Methods

MRS proceedings, 2007, Vol.991, Article 0991-C04-02

2007

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Challenges of Ultra Low-k Dielectric Measurement and Plasma Damage Assessment

MRS proceedings, 2006, Vol.914, Article 0914-F04-02

2006

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Reverse Templating Effects of Low-Resistivity Ru ALD on Sputtered Ru

2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM), 2023, p.1-3

2023

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Physical, chemical, and in vitro toxicological characterization of nanoparticles in chemical mechanical planarization suspensions used in the semiconductor industry: towards environmental health and safety assessmentsElectronic supplementary information (ESI) available: Supplementary information includes some analytical methods and in-depth discussion of ENP fate during on-site industrial wastewater treatment. See DOI: 10.1039/c5en00046g

2015-06

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Co Metal ALD on Cu with Cyclic Clean by Peroxide and Hydrazine for Inverse Hybrid Metal Bonding

2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA), 2024, p.1-2

2024

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Measurement of Interactions between Abrasive Silica Particles and Copper, Titanium, Tungsten and Tantalum

MRS proceedings, 2007, Vol.991, Article 0991-C05-03

2007

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Copper CMP with Composite Polymer Core - Silica Shell Abrasives: A Defectivity Study

MRS proceedings, 2008, Vol.1079 (1), Article 1079-N11-04

2008

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New Particle Metrology for CMP Slurries

MRS proceedings, 2007, Vol.991, Article 0991-C09-01

2007

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Micromachined Shear Stress Sensors for Characterization of Surface Forces During Chemical Mechanical Polishing

MRS proceedings, 2007, Vol.991, Article C6.3

2007

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Composite polymer core – ceria shell abrasive particles during silicon oxide CMP

MRS proceedings, 2007, Vol.991, Article 0991-C08-04

2007

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Polymer Anchoring Layer for Atomic Force Microscopy Studies of Nanoparticle-Substrate Interactions

Journal of macromolecular science. Physics, 2007-01, Vol.46 (1), p.231-244

2007

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Promixity Effect of Selective Co ALD on the Nanoscale

2020 IEEE International Interconnect Technology Conference (IITC), 2020, p.139-141

2020

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Atomic layer annealing with radio-frequency substrate bias for control of grain morphology in gallium nitride thin films

Physical, chemical, and in vitro toxicological characterization of nanoparticles in chemical mechanical planarization suspensions used in the semiconductor industry: towards environmental health and safety assessments

Pulsed chemical vapor deposition for crystalline aluminum nitride thin films and buffer layers on silicon and silicon carbide

The role of oxide formation on insulating versus metallic substrates during Co and Ru selective ALD

Tris(dimethylamido)aluminum(III) and N2H4: Ideal precursors for the low-temperature deposition of large grain, oriented c-axis AlN on Si via atomic layer annealing

Advances in Characterization of CMP Consumables

Experimental and theoretical determination of the role of ions in atomic layer annealing

Low-Resistivity Titanium Nitride Thin Films Fabricated by Atomic Layer Deposition with TiCl 4 and Metal–Organic Precursors in Horizontal Vias

Low-Resistivity Titanium Nitride Thin Films Fabricated by Atomic Layer Deposition with TiCl4 and Metal–Organic Precursors in Horizontal Vias

Determining Pad-Wafer Contact using Dual Emission Laser Induced Fluorescence

Optimization and upscaling of spin coating with organosilane monolayers for low-k pore sealing

Proximity Effects of the Selective Atomic Layer Deposition of Cobalt on the Nanoscale: Implications for Interconnects

Fluorescence Correlation Spectroscopic Investigation of Surface Adsorption of CMP Slurry Additives on Abrasive Particles

Particle Metrology in CMP Slurries - Potential and Limitations of Relevant Measuring Methods

Challenges of Ultra Low-k Dielectric Measurement and Plasma Damage Assessment

Reverse Templating Effects of Low-Resistivity Ru ALD on Sputtered Ru

Co Metal ALD on Cu with Cyclic Clean by Peroxide and Hydrazine for Inverse Hybrid Metal Bonding

Measurement of Interactions between Abrasive Silica Particles and Copper, Titanium, Tungsten and Tantalum

Copper CMP with Composite Polymer Core - Silica Shell Abrasives: A Defectivity Study

New Particle Metrology for CMP Slurries

Micromachined Shear Stress Sensors for Characterization of Surface Forces During Chemical Mechanical Polishing

Composite polymer core – ceria shell abrasive particles during silicon oxide CMP

Polymer Anchoring Layer for Atomic Force Microscopy Studies of Nanoparticle-Substrate Interactions

Promixity Effect of Selective Co ALD on the Nanoscale

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