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Superconformal Nickel Deposition in Through Silicon Vias: Experiment and Prediction

Journal of the Electrochemical Society, 2018, Vol.165 (7), p.D291-D300

2018

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Curvature enhanced adsorbate coverage mechanism for bottom-up superfilling and bump control in damascene processing

Electrochimica acta, 2007-11, Vol.53 (1), p.145-154

2007

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Extreme Bottom-Up Superfilling of Through-Silicon-Vias by Damascene Processing: Suppressor Disruption, Positive Feedback and Turing Patterns

Journal of the Electrochemical Society, 2012-01, Vol.159 (4), p.D208-D216

2012

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Superconformal Copper Deposition in Through Silicon Vias by Suppression-Breakdown

Journal of the Electrochemical Society, 2018-01, Vol.165 (2), p.D23-D30

2018

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Survey of P-Block Metal Additives for Superconformal Cu Deposition in an Alkaline Electrolyte

Journal of the Electrochemical Society, 2022-09, Vol.169 (9), p.92505

2022

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Additives for Superconformal Gold Feature Filling

Journal of the Electrochemical Society, 2021-05, Vol.168 (5), p.52502

2021

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Bottom-up Filling of Damascene Trenches with Gold in a Sulfite Electrolyte

Journal of the Electrochemical Society, 2019, Vol.166 (1), p.D3022-D3034

2019

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Mechanism of Bismuth Stimulated Bottom-up Gold Feature Filling

Journal of the Electrochemical Society, 2022-12, Vol.169 (12), p.122507

2022

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Superconformal Bottom-Up Nickel Deposition in High Aspect Ratio Through Silicon Vias

Journal of the Electrochemical Society, 2016, Vol.163 (7), p.D322-D331

2016

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Cationic Surfactants for the Control of Overfill Bumps in Cu Superfilling

Journal of the Electrochemical Society, 2006, Vol.153 (12), p.C826

2006

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Curvature Enhanced Adsorbate Coverage Model for Electrodeposition

Journal of the Electrochemical Society, 2006, Vol.153 (2), p.C127

2006

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Superconformal Bottom-Up Gold Deposition in High Aspect Ratio Through Silicon Vias

Journal of the Electrochemical Society, 2017, Vol.164 (6), p.D327-D334

2017

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Spatial-Temporal Modeling of Extreme Bottom-up Filling of Through-Silicon-Vias

Journal of the Electrochemical Society, 2013, Vol.160 (12), p.D3260-D3265

2013

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Effect of Chloride Concentration on Copper Deposition in Through Silicon Vias

Journal of the Electrochemical Society, 2019, Vol.166 (1), p.D3259-D3271

2019

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Superconformal electrodeposition in submicron features

Physical review letters, 2001-07, Vol.87 (1), p.016102-016102, Article 016102

2001

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Electrodeposition of Cu on Ru Barrier Layers for Damascene Processing

Journal of the Electrochemical Society, 2006, Vol.153 (1), p.C37

2006

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Bottom-Up Gold Filling in New Geometries and Yet Higher Aspect Ratio Gratings for Hard X-ray Interferometry

Journal of the Electrochemical Society, 2021-08, Vol.168 (8), p.82508

2021

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A Simple Equation for Predicting Superconformal Electrodeposition in Submicrometer Trenches

Journal of the Electrochemical Society, 2001, Vol.148 (12), p.C767

2001

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Bottom-Up Copper Filling of Millimeter Size Through Silicon Vias

Journal of the Electrochemical Society, 2019, Vol.166 (1), p.D3254-D3258

2019

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Effect of Chloride on Microstructure in Cu Filled Microscale Through Silicon Vias

Journal of the Electrochemical Society, 2021-11, Vol.168 (11), p.112501

2021

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Microstructure and Texture in Copper Filled Millimeter Scale Through Silicon Vias

Journal of the Electrochemical Society, 2022-03, Vol.169 (3), p.32508

2022

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In Situ Ellipsometric Study of PEG∕Cl[sup −] Coadsorption on Cu, Ag, and Au

Journal of the Electrochemical Society, 2005, Vol.152 (6), p.C403

2005

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Accelerated Bottom-Up Gold Filling of Metallized Trenches

Journal of the Electrochemical Society, 2019, Vol.166 (12), p.D487-D495

2019

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Gold Superfill in Submicrometer Trenches: Experiment and Prediction

Journal of the Electrochemical Society, 2006, Vol.153 (1), p.C11

2006

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Bottom-Up Copper Filling of Large Scale Through Silicon Vias for MEMS Technology

Journal of the Electrochemical Society, 2018-11, Vol.166 (1), p.D3066-D3071

2018

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Superconformal Nickel Deposition in Through Silicon Vias: Experiment and Prediction

Curvature enhanced adsorbate coverage mechanism for bottom-up superfilling and bump control in damascene processing

Extreme Bottom-Up Superfilling of Through-Silicon-Vias by Damascene Processing: Suppressor Disruption, Positive Feedback and Turing Patterns

Superconformal Copper Deposition in Through Silicon Vias by Suppression-Breakdown

Survey of P-Block Metal Additives for Superconformal Cu Deposition in an Alkaline Electrolyte

Additives for Superconformal Gold Feature Filling

Bottom-up Filling of Damascene Trenches with Gold in a Sulfite Electrolyte

Mechanism of Bismuth Stimulated Bottom-up Gold Feature Filling

Superconformal Bottom-Up Nickel Deposition in High Aspect Ratio Through Silicon Vias

Cationic Surfactants for the Control of Overfill Bumps in Cu Superfilling

Curvature Enhanced Adsorbate Coverage Model for Electrodeposition

Superconformal Bottom-Up Gold Deposition in High Aspect Ratio Through Silicon Vias

Spatial-Temporal Modeling of Extreme Bottom-up Filling of Through-Silicon-Vias

Effect of Chloride Concentration on Copper Deposition in Through Silicon Vias

Superconformal electrodeposition in submicron features

Electrodeposition of Cu on Ru Barrier Layers for Damascene Processing

Bottom-Up Gold Filling in New Geometries and Yet Higher Aspect Ratio Gratings for Hard X-ray Interferometry

A Simple Equation for Predicting Superconformal Electrodeposition in Submicrometer Trenches

Bottom-Up Copper Filling of Millimeter Size Through Silicon Vias

Effect of Chloride on Microstructure in Cu Filled Microscale Through Silicon Vias

Microstructure and Texture in Copper Filled Millimeter Scale Through Silicon Vias

In Situ Ellipsometric Study of PEG∕Cl[sup −] Coadsorption on Cu, Ag, and Au

Accelerated Bottom-Up Gold Filling of Metallized Trenches

Gold Superfill in Submicrometer Trenches: Experiment and Prediction

Bottom-Up Copper Filling of Large Scale Through Silicon Vias for MEMS Technology

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