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Direct Patterning of Silver Circuit Using Surface- modification and UV Irradiation on Polyimide Resin

Transactions of the Institute of Metal Finishing, 2002, Vol.80 (2), p.40-42

2002

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Preparation and Electrical Resistance Characteristics of Electroless Copper-Nickel Alloy Deposits

Transactions of the Institute of Metal Finishing, 1998, Vol.76 (6), p.231-234

1998

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A New Conducting Method of Ultrafine Polymer Particles by Using Direct Metallization Technology

Journal of Japan Institute of Electronics Packaging, 2001, Vol.4 (6), p.528-530

2001

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Direct Metallization of Copper Using Surface Modification and Thermocompression of Polyimide Resin

Journal of Japan Institute of Electronics Packaging, 2001, Vol.4 (7), p.603-606

2001

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Electrodeposition of Sn-In Eutectic Alloy from Sulfosuccinate Bath for Flip-Chip Interconnection

Journal of Japan Institute of Electronics Packaging, 2002, Vol.5 (4), p.349-352

2002

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Electrodeposition of Sn-0.7Cu-0.3Ag Ternary Alloy from Methanesulfonate Bath for Pb-Free Soldering

Journal of Japan Institute of Electronics Packaging, 2002, Vol.5 (2), p.146-151

2002

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Neutral Electroless Silver Plating Using Imidazole and Succinimide as Reducing and Complex Agents on Nickel-Phosphorus Substrate

Journal of The Surface Finishing Society of Japan, 2001/11/01, Vol.52(11), pp.768-772

2001

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Electrodeposition of Sn-Ag Eutectic Alloy from Methanesulfonate Bath

Journal of The Surface Finishing Society of Japan, 2000/12/01, Vol.51(12), pp.1234-1238

2000

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Formation of ULSI Copper Minute Wiring by Copper Electro-deposition Process Using the Pre-adsorption of Additive

Journal of The Surface Finishing Society of Japan, 2002/01/01, Vol.53(1), pp.59-64

2002

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Electrodeposition of Void-free Copper from Ethylenediamine Complex Bath for ULSI Metallization

Journal of The Surface Finishing Society of Japan, 2000/11/01, Vol.51(11), pp.1142-1147

2000

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Basic Study for Direct Metallization Using Surface Modification of Polyimide and Epoxy Resin

Journal of Japan Institute of Electronics Packaging, 1999, Vol.2 (5), p.390-393

1999

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Autocatalytic Electroless Silver Deposition Using 2-Aminoethanethiol as Reducing Agent

Journal of The Surface Finishing Society of Japan, 1999/10/01, Vol.50(10), pp.928-932

1999

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Electrodeposition of Sn-Cu Alloy from Methanesulfonate Bath

Journal of The Surface Finishing Society of Japan, 1999/10/01, Vol.50(10), pp.923-927

1999

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Electrodeposition of Copper from Ethylenediamine Complex Bath for ULSI Metallization

Journal of The Surface Finishing Society of Japan, 1999/07/01, Vol.50(7), pp.625-629

1999

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Deposition Mechanism of Electroless Pd Plating Using Formic Acid as a Reducing Agent

Journal of The Surface Finishing Society of Japan, 1999/05/01, Vol.50(5), pp.469-470

1999

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Fabrication of Ultra-large Scale Integrated by Electroless Neutral Copper Plating

Journal of The Surface Finishing Society of Japan, 1999/04/01, Vol.50(4), pp.374-377

1999

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Direct Metallization Using Sulfonation of Photosensitive Epoxy Resin for Manufacture of Printed Wiring Board by "Build up Process"

Journal of Japan Institute of Electronics Packaging, 1998, Vol.1 (4), p.301-303

1998

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Fabrication of Ultra-large Scale Integrated Circuits by Electroless Copper Plating System

Journal of The Surface Finishing Society of Japan, 1998/12/01, Vol.49(12), pp.1360-1361

1998

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Electroless Plalladium Plating from Monoaminodicarboxylic Acid Complex Bath Using Formic Acid as a Reducing Agent

Hyōmen gijutsu, 1998, Vol.49 (12), p.1322-1326

1998

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Crystal Structure of Electroless Palladium Plating Films Using Trimethylamine Borane as a Reducing Agent

Journal of The Surface Finishing Society of Japan, 1996/04/01, Vol.47(4), pp.356-359

1996

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Mass Balance and Deposition Mechanism of Electroless Palladium Plating Using Trimethylamine Borane as a Reducing Agent

Journal of The Surface Finishing Society of Japan, 1996/08/01, Vol.47(8), pp.725-728

1996

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Deposition Mechanism of Electroless Ni-Cu-P Alloy Plating

Journal of The Surface Finishing Society of Japan, 1997/04/01, Vol.48(4), pp.468-469

1997

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Mass Balance and Deposition Mechanism in Electroless Ni-B Alloy Plating Using Dimethylamine Borane as a Reducing Agent

Journal of The Surface Finishing Society of Japan, 1995/10/01, Vol.46(10), pp.951-955

1995

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Effect of Inclusion on Room Temperature Softening of Copper Film Electrodeposited from Ethylenediamine Complex Bath

Journal of The Surface Finishing Society of Japan, 1995/09/01, Vol.46(9), pp.834-839

1995

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Effect of Phosphorus Codeposition on Properties of Palladium-Phosphorus Alloys Deposited from Electroless Plating Baths Using Hypophosphite as a Reducing Agent

Journal of The Surface Finishing Society of Japan, 1996/12/01, Vol.47(12), pp.1060-1064

1996

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Direct Patterning of Silver Circuit Using Surface- modification and UV Irradiation on Polyimide Resin

Preparation and Electrical Resistance Characteristics of Electroless Copper-Nickel Alloy Deposits

A New Conducting Method of Ultrafine Polymer Particles by Using Direct Metallization Technology

Direct Metallization of Copper Using Surface Modification and Thermocompression of Polyimide Resin

Electrodeposition of Sn-In Eutectic Alloy from Sulfosuccinate Bath for Flip-Chip Interconnection

Electrodeposition of Sn-0.7Cu-0.3Ag Ternary Alloy from Methanesulfonate Bath for Pb-Free Soldering

Neutral Electroless Silver Plating Using Imidazole and Succinimide as Reducing and Complex Agents on Nickel-Phosphorus Substrate

Electrodeposition of Sn-Ag Eutectic Alloy from Methanesulfonate Bath

Formation of ULSI Copper Minute Wiring by Copper Electro-deposition Process Using the Pre-adsorption of Additive

Electrodeposition of Void-free Copper from Ethylenediamine Complex Bath for ULSI Metallization

Basic Study for Direct Metallization Using Surface Modification of Polyimide and Epoxy Resin

Autocatalytic Electroless Silver Deposition Using 2-Aminoethanethiol as Reducing Agent

Electrodeposition of Sn-Cu Alloy from Methanesulfonate Bath

Electrodeposition of Copper from Ethylenediamine Complex Bath for ULSI Metallization

Deposition Mechanism of Electroless Pd Plating Using Formic Acid as a Reducing Agent

Fabrication of Ultra-large Scale Integrated by Electroless Neutral Copper Plating

Direct Metallization Using Sulfonation of Photosensitive Epoxy Resin for Manufacture of Printed Wiring Board by "Build up Process"

Fabrication of Ultra-large Scale Integrated Circuits by Electroless Copper Plating System

Electroless Plalladium Plating from Monoaminodicarboxylic Acid Complex Bath Using Formic Acid as a Reducing Agent

Crystal Structure of Electroless Palladium Plating Films Using Trimethylamine Borane as a Reducing Agent

Mass Balance and Deposition Mechanism of Electroless Palladium Plating Using Trimethylamine Borane as a Reducing Agent

Deposition Mechanism of Electroless Ni-Cu-P Alloy Plating

Mass Balance and Deposition Mechanism in Electroless Ni-B Alloy Plating Using Dimethylamine Borane as a Reducing Agent

Effect of Inclusion on Room Temperature Softening of Copper Film Electrodeposited from Ethylenediamine Complex Bath

Effect of Phosphorus Codeposition on Properties of Palladium-Phosphorus Alloys Deposited from Electroless Plating Baths Using Hypophosphite as a Reducing Agent

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