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Viscoelastic Influence on the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling

Journal of electronic packaging, 2023-03, Vol.145 (1)

2023

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Impact of Aging on Mechanical Properties of Thermally Conductive Gap Fillers

Journal of electronic packaging, 2020-03, Vol.142 (1)

2020

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Investigation of the Impact of Material Models on Reliability Assessment of Electronic Packages

Misrak, Abel

2020

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Identification and Characterization of Particulate Contaminants Found at a Data Center Using Airside Economization

Journal of electronic packaging, 2019-09, Vol.141 (3)

2019

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Characterization of Mechanical Properties and Creep Behavior of Woven Glass/Epoxy Substrates by Nanoindentation

Journal of microelectronics and electronic packaging, 2018-04, Vol.15 (2), p.95-100

2018

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Impact of Die Attach Sample Preparation on Its Measured Mechanical Properties for MEMS Sensor Applications

Journal of microelectronics and electronic packaging, 2021-01, Vol.18 (1), p.21-28

2021

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Structural integrity optimization of 3D TSV package by analyzing crack behavior at TSV and BEOL

2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC), 2017, p.201-208

2017

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Effect of PCB thickness on solder joint reliability of Quad Flat no-lead assembly under Power Cycling and Thermal Cycling

2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), 2017, p.70-76

2017

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Impact of Viscoelastic Properties of Low Loss Printed Circuit Boards (PCBs) on Reliability of WCSP Packages Under Drop Test

2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, p.2266-2271

2020

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Damage progression study of 3D TSV package during reflow, thermal shocks and thermal cycling

2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2017, p.1119-1125

2017

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Mechanical characterization of RCC and FR4 laminated PCBs and assessment of their board level reliability

2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2017, p.1111-1118

2017

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Solder ball reliability assessment of WLCSP - Power cycling versus thermal cycling

2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2017, p.1361-1368

2017

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Comparison of the effect of elastic and viscoelastic modeling of PCBs on the assessment of board level reliability

2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2017, p.1106-1110

2017

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Predictors of Mental Health Literacy and Information Seeking Behavior Toward Mental Health Among University Students in Resource-Limited Settings

International journal of general medicine, 2022-11, Vol.15, p.8159-8172

2022

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Finite Element Analysis
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Temperature Measurement
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Thermal Cycling
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Electronic Packaging Thermal Management
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Viscoelastic Influence on the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling

Impact of Aging on Mechanical Properties of Thermally Conductive Gap Fillers

Investigation of the Impact of Material Models on Reliability Assessment of Electronic Packages

Identification and Characterization of Particulate Contaminants Found at a Data Center Using Airside Economization

Characterization of Mechanical Properties and Creep Behavior of Woven Glass/Epoxy Substrates by Nanoindentation

Impact of Die Attach Sample Preparation on Its Measured Mechanical Properties for MEMS Sensor Applications

Structural integrity optimization of 3D TSV package by analyzing crack behavior at TSV and BEOL

Effect of PCB thickness on solder joint reliability of Quad Flat no-lead assembly under Power Cycling and Thermal Cycling

Impact of Viscoelastic Properties of Low Loss Printed Circuit Boards (PCBs) on Reliability of WCSP Packages Under Drop Test

Damage progression study of 3D TSV package during reflow, thermal shocks and thermal cycling

Mechanical characterization of RCC and FR4 laminated PCBs and assessment of their board level reliability

Solder ball reliability assessment of WLCSP - Power cycling versus thermal cycling

Comparison of the effect of elastic and viscoelastic modeling of PCBs on the assessment of board level reliability

Predictors of Mental Health Literacy and Information Seeking Behavior Toward Mental Health Among University Students in Resource-Limited Settings

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