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Effective Constitutive Relations for Sintered Nano Copper Joints

Journal of electronic packaging, 2023-06, Vol.145 (2)

2023

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Thermal and Mechanical Stability of Ce-Containing Sn-3.9Ag-0.7Cu Lead-Free Solder on Cu and Electroless Ni-P Metallizations

Journal of electronic materials, 2012-12, Vol.41 (12), p.3249-3258

2012

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Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds

Journal of electronic packaging, 2022-03, Vol.144 (1)

2022

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Behavior of (1 1 1) grains during the thermal treatment of copper film studied in situ by electron back-scatter diffraction

Microelectronic engineering, 2006-02, Vol.83 (2), p.221-235

2006

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Inelastic Deformation of Copper Nanoparticle Based Joints and Bonds

Journal of electronic packaging, 2022-09, Vol.144 (3)

2022

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New Interpretation of the Influence of Various Parameters on Texture Evolution in Damascene Cu Interconnect Lines

Materials science forum, 2005-01, Vol.495-497, p.1449-1454

2005

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Orientation and Microstructure Dependence of Electromigration Damage in Damascene Cu Interconnect Lines

Materials science forum, 2005-01, Vol.495-497, p.1443-1448

2005

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Thermal and Mechanical Stability of Ce-Containing Sn-3.9Ag-0.7Cu Lead-Free Solder on Cu and Electroless Ni-P Metallizations : PHASE STABILITY, PHASE TRANSFORMATIONS, AND REACTIVE PHASE FORMATION IN ELECTRONIC MATERIALS XI

Journal of electronic materials, 2012, Vol.41 (12), p.3249-3258

2012

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Texture, Microstructure and Stress Investigations in 0.18 μm Damascene Cu Interconnect Lines

Materials science forum, 2003-08, Vol.426-432, p.3551-3556

2003

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Texture Investigations In Damascene Copper Interconnects

Materials science forum, 2002-01, Vol.408-412 (2), p.1627-1632

2002

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Correlation of electromigration defects in small damascene Cu interconnects with their microstructure

Microelectronic engineering, 2005-12, Vol.82 (3), p.660-664

2005

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Stress, texture and electromigration in damascene copper interconnects

Mirpuri, Kabir

2006

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Stress, texture and electromigration in damascene copper interconnects

Mirpuri, Kabir

2006

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Formation of Electromigration Defects in Small Damascene Cu Interconnects with Respect to the Microstructure

AIP conference proceedings, 2004-12, Vol.741 (1)

2004

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Texture and stress analysis in as-deposited and annealed damascene Cu interconnects using XRD and OIM

AIP Conference Proceedings, 2003, Vol.683, p.494-498

2003

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Influence of Line-Width on Microstructure and Texture of Damascene Copper Interconnects

MRS proceedings, 2002, Vol.721, Article J5.6

2002

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Effective Constitutive Relations for Sintered Nano Copper Joints

Thermal and Mechanical Stability of Ce-Containing Sn-3.9Ag-0.7Cu Lead-Free Solder on Cu and Electroless Ni-P Metallizations

Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds

Behavior of (1 1 1) grains during the thermal treatment of copper film studied in situ by electron back-scatter diffraction

Inelastic Deformation of Copper Nanoparticle Based Joints and Bonds

New Interpretation of the Influence of Various Parameters on Texture Evolution in Damascene Cu Interconnect Lines

Orientation and Microstructure Dependence of Electromigration Damage in Damascene Cu Interconnect Lines

Thermal and Mechanical Stability of Ce-Containing Sn-3.9Ag-0.7Cu Lead-Free Solder on Cu and Electroless Ni-P Metallizations : PHASE STABILITY, PHASE TRANSFORMATIONS, AND REACTIVE PHASE FORMATION IN ELECTRONIC MATERIALS XI

Texture, Microstructure and Stress Investigations in 0.18 μm Damascene Cu Interconnect Lines

Texture Investigations In Damascene Copper Interconnects

Correlation of electromigration defects in small damascene Cu interconnects with their microstructure

Stress, texture and electromigration in damascene copper interconnects

Stress, texture and electromigration in damascene copper interconnects

Formation of Electromigration Defects in Small Damascene Cu Interconnects with Respect to the Microstructure

Texture and stress analysis in as-deposited and annealed damascene Cu interconnects using XRD and OIM

Influence of Line-Width on Microstructure and Texture of Damascene Copper Interconnects

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