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FOREWORD

Microsystem technologies : sensors, actuators, systems integration, 2020-07, Vol.26 (7), p.2143-2143

Michel, Bernd

2020

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FOREWORD

Microsystem technologies : sensors, actuators, systems integration, 2020-07, Vol.26 (7), p.2143-2143

Michel, Bernd

2020

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FOREWORD

Microsystem technologies : sensors, actuators, systems integration, 2020, Vol.26 (7), p.2143-2143

Michel, Bernd

2020

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Thermo-mechanical characterization of copper through-silicon vias (Cu-TSVs) using micro-Raman spectroscopy and atomic force microscopy

Microelectronic engineering, 2015-04, Vol.137, p.101-104

2015

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Special issue on Design, Test, Integration and Packaging of MEMS and MOEMS, 2016

Microsystem technologies : sensors, actuators, systems integration, 2018, Vol.24 (1), p.361-361

2018

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Special issue on Design, Test, Integration and Packaging of MEMS and MOEMS (DTIP 2015), held in Montpellier, France, April 27–30, 2015

Microsystem technologies : sensors, actuators, systems integration, 2017-09, Vol.23 (9), p.3825-3825

2017

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Special issue on Design, Test, Integration and Packaging of MEMS and MOEMS (DTIP 2015): Montpellier, France, April 27–30, 2015

Microsystem Technologies, 2017, Vol.23 (9)

2017

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Special issue on design, test, integration and packaging of EMS/MOEMS, 2013

Microsystem technologies : sensors, actuators, systems integration, 2015-09, Vol.21 (9), p.1811-1811

2015

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Special issue on 4th International Conference on Smart Systems Engineering (SmaSys 2016)

Microsystem technologies : sensors, actuators, systems integration, 2018, Vol.24 (1), p.595-595

2018

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Special Issue on 3rd International Conference on Smart Systems Engineering (SmaSys 2015)

Microsystem technologies : sensors, actuators, systems integration, 2017-05, Vol.23 (5), p.1131-1131

2017

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Special issue on computing, communication and sensor network: CCSN, Puri, Odisha, India, 2014

Microsystem technologies : sensors, actuators, systems integration, 2017-03, Vol.23 (3), p.531-532

2017

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Special issue on design, test, integration and packaging of MEMS/MOEMS, 2012

Microsystem technologies, 2013-06, Vol.19 (6), p.773-773

COURTOIS, Bernard

2013

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Special Issue on Micro-2014, 1st International Conference on Microelectronics, Circuits and Systems, Kolkata, India, July 2014

Microsystem technologies : sensors, actuators, systems integration, 2016-11, Vol.22 (11), p.2601-2601

2016

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Mechanism and impact of catecholamine conversion by Vibrio cholerae

Biochimica et biophysica acta. Bioenergetics, 2019-06, Vol.1860 (6), p.478-487

2019

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The 2nd International Conference on Surfaces, Coatings and Nanostructured Materials: Asia (NANOSMAT-Asia, 2015)

Microsystem technologies : sensors, actuators, systems integration, 2016-05, Vol.22 (5), p.921-921

2016

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Special issue on design, test, integration and packaging of MEMS/MOEMS, 2011

Microsystem technologies : sensors, actuators, systems integration, 2012-11, Vol.18 (11), p.1759-1759

2012

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Special Issue on 2nd International Conference on Smart Systems Engineering (SmaSys 2014)

Microsystem technologies : sensors, actuators, systems integration, 2016-01, Vol.22 (1), p.1-1

2016

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Part II of the Special Issue on 3rd International Conference on Engineering and Technology Innovation (ICETI 2014), held in Kenting, Taiwan Oct 31–Nov 2, 2014

Microsystem technologies : sensors, actuators, systems integration, 2017-06, Vol.23 (6), p.1651-1651

2017

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MST Special Issue on the conference MicroNanoReliability 2007

Microsystem technologies : sensors, actuators, systems integration, 2009, Vol.15 (1), p.1-1

Michel, Bernd

2009

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Special issue WaferBond’13: International Conference on Wafer Bonding for MEMS Technologies and Wafer Level Integration

Microsystem technologies : sensors, actuators, systems integration, 2015-05, Vol.21 (5), p.951-951

2015

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Response of Vibrio cholerae to the Catecholamine Hormones Epinephrine and Norepinephrine

Journal of bacteriology, 2015-12, Vol.197 (24), p.3769-3778

2015

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Special Issue on 3rd International Conference on Engineering and Technology Innovation (ICETI 2014), held in Kenting, Taiwan Oct. 31–Nov. 2, 2014

Microsystem technologies : sensors, actuators, systems integration, 2017-02, Vol.23 (2), p.275-275

2017

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Polymer Testing

3, 2022

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Microsystem Technologies: foreword to special issue on design, test, integration and packaging of MEMS/MOEMS, 2010

Microsystem technologies : sensors, actuators, systems integration, 2011-04, Vol.17 (4), p.481-481

2011

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Special issue of the conference ‘Smart Sensors, Actuators and MEMS’, within the SPIE EUROPE Symposium ‘MICROTECHNOLOGIES’ Grenoble, France, 24–26 April 2013

Microsystem technologies, 2014-04, Vol.20 (4-5), p.521-521

2014

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FOREWORD

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FOREWORD

Thermo-mechanical characterization of copper through-silicon vias (Cu-TSVs) using micro-Raman spectroscopy and atomic force microscopy

Special issue on Design, Test, Integration and Packaging of MEMS and MOEMS, 2016

Special issue on Design, Test, Integration and Packaging of MEMS and MOEMS (DTIP 2015), held in Montpellier, France, April 27–30, 2015

Special issue on Design, Test, Integration and Packaging of MEMS and MOEMS (DTIP 2015): Montpellier, France, April 27–30, 2015

Special issue on design, test, integration and packaging of EMS/MOEMS, 2013

Special issue on 4th International Conference on Smart Systems Engineering (SmaSys 2016)

Special Issue on 3rd International Conference on Smart Systems Engineering (SmaSys 2015)

Special issue on computing, communication and sensor network: CCSN, Puri, Odisha, India, 2014

Special issue on design, test, integration and packaging of MEMS/MOEMS, 2012

Special Issue on Micro-2014, 1st International Conference on Microelectronics, Circuits and Systems, Kolkata, India, July 2014

Mechanism and impact of catecholamine conversion by Vibrio cholerae

The 2nd International Conference on Surfaces, Coatings and Nanostructured Materials: Asia (NANOSMAT-Asia, 2015)

Special issue on design, test, integration and packaging of MEMS/MOEMS, 2011

Special Issue on 2nd International Conference on Smart Systems Engineering (SmaSys 2014)

Part II of the Special Issue on 3rd International Conference on Engineering and Technology Innovation (ICETI 2014), held in Kenting, Taiwan Oct 31–Nov 2, 2014

MST Special Issue on the conference MicroNanoReliability 2007

Special issue WaferBond’13: International Conference on Wafer Bonding for MEMS Technologies and Wafer Level Integration

Response of Vibrio cholerae to the Catecholamine Hormones Epinephrine and Norepinephrine

Special Issue on 3rd International Conference on Engineering and Technology Innovation (ICETI 2014), held in Kenting, Taiwan Oct. 31–Nov. 2, 2014

Polymer Testing

Microsystem Technologies: foreword to special issue on design, test, integration and packaging of MEMS/MOEMS, 2010

Special issue of the conference ‘Smart Sensors, Actuators and MEMS’, within the SPIE EUROPE Symposium ‘MICROTECHNOLOGIES’ Grenoble, France, 24–26 April 2013

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