UB Paderborn / Katalog / Suche / in CDI

Sortiert nach

Einfacher Volltextzugriff von (fast) überall

Installieren Sie die LibKey Nomad-Browsererweiterung und erhalten Sie von vielen Webseiten einfachen Zugriff auf lizenzierte Volltexte oder Open Access Publikationen. Mehr erfahren...

Effects of curing conditions on structural evolution and mechanical properties of UV-curable polyurethane acrylate coatings

Progress in organic coatings, 2018-01, Vol.114, p.58-67

2018

Volltextzugriff (PDF)

Improved adhesion of polyurethane-based coatings to tin surface

Journal of materials science. Materials in electronics, 2019-04, Vol.30 (8), p.7268-7279

2019

Volltextzugriff (PDF)

Effect of coating adhesion and degradation on tin whisker mitigation of polyurethane-based conformal coatings

Polymer degradation and stability, 2019-08, Vol.166, p.219-229

2019

Volltextzugriff (PDF)

Tin Whisker Growth on Electronic Assemblies Soldered with Bi-Containing, Pb-Free Alloys

Journal of electronic materials, 2021-03, Vol.50 (3), p.842-854

2021

Volltextzugriff (PDF)

Enhanced mechanical properties of polyurethane composite coatings through nanosilica addition

Progress in organic coatings, 2016-01, Vol.90, p.243-251

2016

Volltextzugriff (PDF)

Electron beam irradiation effect on the mechanical properties of nanosilica-filled polyurethane films

Polymer degradation and stability, 2017-07, Vol.141, p.45-53

2017

Volltextzugriff (PDF)

Wetting in the Au–Sn System

Acta materialia, 2004-06, Vol.52 (10), p.2873-2888

2004

Volltextzugriff (PDF)

Controlling morphology of NiSb needles in InSb through low temperature gradient horizontal gradient freeze

Journal of crystal growth, 2024-01, Vol.626, p.127440, Article 127440

2024

Volltextzugriff (PDF)

Thermal Preconditioning and Restoration of Bismuth-Containing, Lead-Free Solder Alloys

Journal of electronic materials, 2020, Vol.49 (1), p.116-127

2020

Volltextzugriff (PDF)

Evaluation of Effectiveness of Conformal Coatings as Tin Whisker Mitigation

Journal of electronic materials, 2012-09, Vol.41 (9), p.2508-2518

2012

Volltextzugriff (PDF)

Whisker Formation Induced by Component and Assembly Ionic Contamination

Journal of electronic materials, 2012-02, Vol.41 (2), p.204-223

2012

Volltextzugriff (PDF)

Whisker Formation Induced by Component and Assembly Ionic Contamination: Pb-free Solders and Materials for Emerging Interconnect and Packaging Technologies

Journal of electronic materials, 2012, Vol.41 (2), p.204-223

2012

Volltextzugriff (PDF)

Tin Whisker Formation on Small Outline Transistors Assembled Using Bismuth-Containing Lead-Free Solder Alloys After Long-Term Ambient Temperature, High Humidity Storage Part 3: In-Depth Characterization and Mechanisms

Journal of Surface Mount Technology, 2021-04, Vol.34 (1), p.11-23

2021

Volltextzugriff (PDF)

Tin Whisker Formation on Small Outline Transistors Assembled Using Bismuth-Containing Lead-Free Solder Alloys After Long-Term Ambient Temperature, High Humidity Storage Part 2: Statistical Analysis

Journal of Surface Mount Technology, 2020-07, Vol.33 (1), p.7-19

2020

Volltextzugriff (PDF)

The challenge of lead-free electronics for aerospace electronic systems

2009 IEEE Custom Integrated Circuits Conference, 2009, p.355-362

2009

Volltextzugriff (PDF)

Wetting of low melting point alloys on metal substrates

Meschter, Stephan John

2001

Volltextzugriff (PDF)

1 – 16 von 16

Suche als RSS-Feed

Suchergebnisse filtern

Filter anzeigen

Nur zeigen

Geprüft (Peer-Review)
(12)
Mit Volltextzugriff
(13)

Publikationsform

Sprache

Englisch
(16)

Erscheinungsjahr

n.n

Zeitschrift / Serie

2 weitere anzeigen...

Weniger anzeigen...

Menü

Weitere Dienste

Einstellungen

Effects of curing conditions on structural evolution and mechanical properties of UV-curable polyurethane acrylate coatings

Improved adhesion of polyurethane-based coatings to tin surface

Effect of coating adhesion and degradation on tin whisker mitigation of polyurethane-based conformal coatings

Tin Whisker Growth on Electronic Assemblies Soldered with Bi-Containing, Pb-Free Alloys

Enhanced mechanical properties of polyurethane composite coatings through nanosilica addition

Electron beam irradiation effect on the mechanical properties of nanosilica-filled polyurethane films

Wetting in the Au–Sn System

Controlling morphology of NiSb needles in InSb through low temperature gradient horizontal gradient freeze

Thermal Preconditioning and Restoration of Bismuth-Containing, Lead-Free Solder Alloys

Evaluation of Effectiveness of Conformal Coatings as Tin Whisker Mitigation

Whisker Formation Induced by Component and Assembly Ionic Contamination

Whisker Formation Induced by Component and Assembly Ionic Contamination: Pb-free Solders and Materials for Emerging Interconnect and Packaging Technologies

Tin Whisker Formation on Small Outline Transistors Assembled Using Bismuth-Containing Lead-Free Solder Alloys After Long-Term Ambient Temperature, High Humidity Storage Part 3: In-Depth Characterization and Mechanisms

Tin Whisker Formation on Small Outline Transistors Assembled Using Bismuth-Containing Lead-Free Solder Alloys After Long-Term Ambient Temperature, High Humidity Storage Part 2: Statistical Analysis

The challenge of lead-free electronics for aerospace electronic systems

Wetting of low melting point alloys on metal substrates

Suchergebnisse filtern