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Fluorescence and Redox Activity of Probes Anchored through an Aminotrithiol to Polycrystalline Gold

Langmuir, 1998-02, Vol.14 (4), p.816-820

1998

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Constraint Effects on Thin Film Channel Cracking Behavior

Journal of materials research, 2005-09, Vol.20 (9), p.2266-2273

2005

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Moisture Adsorption in Plasma-Damaged Porous Low-k Dielectrics

MRS proceedings, 2008, Vol.1079 (1), Article 1079-N02-09

2008

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The effect of water diffusion on the adhesion of organosilicate glass film stacks

Journal of the mechanics and physics of solids, 2006-05, Vol.54 (5), p.887-903

2006

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Materials Issues and Characterization of Low-k Dielectric Materials

MRS bulletin, 1997-10, Vol.22 (10), p.49-54

1997

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Measurement of elastic modulus, Poisson ratio, and coefficient of thermal expansion of on-wafer submicron films

Journal of applied physics, 1999-05, Vol.85 (9), p.6421-6424

1999

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Aggregation of squaraine dyes: Structure-property relationships and solvent effects

Canadian journal of chemistry, 1995-10, Vol.73 (10), p.1605-1615

1995

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The effect of elastic modulus on channel crack propagation in organosilicate glass films

Thin solid films, 2006-12, Vol.515 (4), p.2257-2261

2006

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On-wafer characterization of thermomechanical properties of dielectric thin films by a bending beam technique

Journal of applied physics, 2000-09, Vol.88 (5), p.3029-3038

2000

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Thermomechanical properties and moisture uptake characteristics of hydrogen silsesquioxane submicron films

Applied physics letters, 1999-02, Vol.74 (7), p.944-946

1999

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Thin film interaction between low- k dielectric hydrogen silsesquioxane (HSQ) and Ti barrier layer

Thin solid films, 2000-02, Vol.360 (1), p.283-292

2000

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Molecular modelling of photoactive pigments in the solid state: Investigations of polymorphism

Canadian journal of chemistry, 1993-03, Vol.71 (3), p.390-398

1993

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Advanced Metallization Conference 2001 Held in October

MRS Bulletin, 2002-02, Vol.27 (2), p.138-138

2002

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Fracture Property Improvements of a Nanoporous Thin Film via Post Deposition UV Curing

MRS proceedings, 2006, Vol.914, Article 0914-F01-07

2006

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Fracture Property Improvements of a Nanoporous Thin Film Via Post Deposition Bond Modifications

MRS proceedings, 2005, Vol.863, Article B3.8

2005

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Constraint Effects on Cohesive Failures in Low-k Dielectric Thin Films

MRS proceedings, 2005, Vol.863, Article B4.1

2005

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Measuring the elastic modulus and ultimate strength of low-k dielectric materials by means of the bulge test

Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729), 2004, p.133-135

2004

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Environmental Effects on Crack Characteristics for OSG Materials

MRS proceedings, 2005, Vol.875, Article O10.6

2005

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The effects of passivation layer and film thickness on the mechanical behavior of freestanding electroplated Cu thin films with constant microstructure

MRS proceedings, 2003, Vol.795, Article U11.37

2003

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Effects of dielectric liners on TDDB lifetime of a Cu/ low-k interconnect

Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729), 2004, p.78-80

2004

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Effectiveness of Ti, TiN, Ta, TaN, and W2N as barriers for the integration of low- k dielectric hydrogen silsesquioxane

Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 2000-01, Vol.18 (1), p.221-230

2000

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Preparation and characterization of polyimide alternating copolymers incorporatingN,N?-bis-(4-anilino)-1,2,4,5-benzene bis(dicarboximide)

Journal of polymer science. Part A, Polymer chemistry, 1997-01, Vol.35 (2), p.319-327

1997

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Solvent-controlled aggregation of a photoconductive dye

Journal of the Chemical Society. Chemical communications, 1992 (17), p.1242-1243

1992

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Direct seed electroplating of copper on ruthenium liners

2011 IEEE International Interconnect Technology Conference, 2011, p.1-3

2011

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Copper BEOL solutions for advanced memory

Solid state technology, 2009-05, Vol.52 (5), p.10

2009

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Fluorescence and Redox Activity of Probes Anchored through an Aminotrithiol to Polycrystalline Gold

Constraint Effects on Thin Film Channel Cracking Behavior

Moisture Adsorption in Plasma-Damaged Porous Low-k Dielectrics

The effect of water diffusion on the adhesion of organosilicate glass film stacks

Materials Issues and Characterization of Low-k Dielectric Materials

Measurement of elastic modulus, Poisson ratio, and coefficient of thermal expansion of on-wafer submicron films

Aggregation of squaraine dyes: Structure-property relationships and solvent effects

The effect of elastic modulus on channel crack propagation in organosilicate glass films

On-wafer characterization of thermomechanical properties of dielectric thin films by a bending beam technique

Thermomechanical properties and moisture uptake characteristics of hydrogen silsesquioxane submicron films

Thin film interaction between low- k dielectric hydrogen silsesquioxane (HSQ) and Ti barrier layer

Molecular modelling of photoactive pigments in the solid state: Investigations of polymorphism

Advanced Metallization Conference 2001 Held in October

Fracture Property Improvements of a Nanoporous Thin Film via Post Deposition UV Curing

Fracture Property Improvements of a Nanoporous Thin Film Via Post Deposition Bond Modifications

Constraint Effects on Cohesive Failures in Low-k Dielectric Thin Films

Measuring the elastic modulus and ultimate strength of low-k dielectric materials by means of the bulge test

Environmental Effects on Crack Characteristics for OSG Materials

The effects of passivation layer and film thickness on the mechanical behavior of freestanding electroplated Cu thin films with constant microstructure

Effects of dielectric liners on TDDB lifetime of a Cu/ low-k interconnect

Effectiveness of Ti, TiN, Ta, TaN, and W2N as barriers for the integration of low- k dielectric hydrogen silsesquioxane

Preparation and characterization of polyimide alternating copolymers incorporatingN,N?-bis-(4-anilino)-1,2,4,5-benzene bis(dicarboximide)

Solvent-controlled aggregation of a photoconductive dye

Direct seed electroplating of copper on ruthenium liners

Copper BEOL solutions for advanced memory

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