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IEEE electron device letters, 2011-06, Vol.32 (6), p.713-715
2011
- Link zum Volltext
2014 SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2014, p.1-3
- Wei Lin
- Faltermeier, Johnathan
- Winstel, Kevin
- Skordas, Spyridon
- Graves-Abe, Troy
- Batra, Pooja
- Herman, Kenneth
- Golz, John
- Kirihata, Toshiaki
- Garant, John
- Hubbard, Alex
- Cauffman, Kris
- Levine, Theodore
- Kelly, James
- Priyadarshini, Deepika
- Peethala, Brown
- Patlolla, Raghuveer
- Shoudy, Matthew
- Demarest, James J.
- Wynne, Jean
- Canaperi, Donald
- McHerron, Dale
- Berger, Dan
- Iyer, Subramanian
2014
- Link zum Volltext
IEEE transactions on components, packaging, and manufacturing technology (2011), 2021-05, Vol.11 (5), p.875-878
2021
- Link zum Volltext
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.1175-1180
- Chen, Qianwen
- Belyansky, Michael
- Sulehria, Yasir
- Horibe, Akihiro
- Qin, Liqiao
- Pujari, Ruturaj
- Perfecto, Eric
- Lie, Fee Li
- Butt, Shahid
- Polomoff, Nick
- Miyazawa, Risa
- Kohara, Sayuri
- Farooq, Mukta
- Hisada, Takashi
- Oakley, Jennifer
- Skordas, Spyridon
- Fan, Susan
- Sakuma, Katsuyuki
- Knickerbocker, John
- Mcherron, Dale
- Tamura, Takeshi
- Ishii, Takayuki
- Jaipan, Panupong
- Nishimura, Satoshi
- Son, Ilseok
- Maeda, Yohei
- Koga, Takashi
- Klein, Joseph
- Tashiro, Kei
- Arkalgud, Sitaram
- Kondo, Yoshihiro
2023
- Link zum Volltext
Polymer (Guilford), 1993-01, Vol.34 (5), p.915-924
1993
Link zum Volltext
IEEE electron device letters, 2011-06, Vol.32 (6), p.713
2011
Link zum Volltext
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.872-877
2023
- Link zum Volltext
Journal of applied polymer science, 1992-11, Vol.46 (8), p.1313-1327
1992
Link zum Volltext
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.800-805
2023
- Link zum Volltext
2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, p.292-297
2021
- Link zum Volltext
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022, p.312-316
2022
- Link zum Volltext
2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, p.408-414
2021
- Link zum Volltext
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022, p.977-980
- Farooq, Mukta
- Kumar, Arvind
- Lee, Sae-Kyu
- Bonam, Ravi
- Gomez, Juan-Manuel
- Kelly, James
- Hosokawa, Kohji
- Nomura, Akiyo
- Kohda, Yasuteru
- Dickson, Timothy
- Sakuma, Katsuyuki
- Mori, Hiroyuki
- Rubin, Joshua
- Saraf, Iqbal
- Pai, Vinay
- Nieves, Pablo
- Li, Yandong
- DelaPena, Abraham
- Wassick, Thomas
- Perfecto, Eric
- Carr, Christopher
- Sardesai, Viraj
- Miller, Eric
- Oakley, Jennifer
- Skordas, Spyridon
- Teehan, Sean
- McHerron, Dale
- Burns, Jeff
- Divakaruni, Rama
2022
- Link zum Volltext
2018 IEEE International Electron Devices Meeting (IEDM), 2018, p.11.4.1-11.4.4
2018
- Link zum Volltext
Polymer (Guilford), 1993, Vol.34 (19), p.3976-3985
1993
Link zum Volltext
2009 IEEE International Interconnect Technology Conference, 2009, p.8-10
- Soon-Cheon Seo
- Chih-Chao Yang
- Chun-Chen Yeh
- Haran, B.
- Horak, D.
- Fan, S.
- Koburger, C.
- Canaperi, D.
- Papa Rao, S.S.
- Monsieur, F.
- Knorr, A.
- Kerber, A.
- Chao-Kun Hu
- Kelly, J.
- Tuan Vo
- Cummings, J.
- Smalleya, M.
- Petrillo, K.
- Mehta, S.
- Schmitz, S.
- Levin, T.
- Dae-Guy Park
- Stathis, J.H.
- Spooner, T.
- Paruchuri, V.
- Wynne, J.
- Edelstein, D.
- McHerron, D.
- Doris, B.
2009
- Link zum Volltext
Journal of applied polymer science, 1991-09, Vol.43 (6), p.1045-1058
1991
Link zum Volltext
IEEE transactions on advanced packaging, 2000-08, Vol.23 (3), p.515-520
2000
- Link zum Volltext
Proceedings of the International Conference on Multichip Modules, 1994, p.86-93
1994
- Link zum Volltext
IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 1994-11, Vol.17 (4), p.486-492
1994
- Link zum Volltext
IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 1995-02, Vol.18 (1), p.37-41
1995
- Link zum Volltext
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